Ausgabe 2/2012
Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies
Inhalt (22 Artikel)
The Effect of Random Voids in the Modified Gurson Model
Huiyang Fei, Kyle Yazzie, Nikhilesh Chawla, Hanqing Jiang
A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase
Hu Hao, Guangchen Xu, Yonglun Song, Yaowu Shi, Fu Guo
Whisker Formation Induced by Component and Assembly Ionic Contamination
Polina Snugovsky, Stephan Meschter, Zohreh Bagheri, Eva Kosiba, Marianne Romansky, Jeffrey Kennedy
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging
Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland
Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits
Sung-Hwan Hwang, Byoung-Joon Kim, Ho-Young Lee, Young-Chang Joo
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
Liang Yin, Luke Wentlent, Linlin Yang, Babak Arfaei, Awni Oasaimeh, Peter Borgesen
Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective
Kejun Zeng, Mike Pierce, Hiroshi Miyazaki, Becky Holdford
In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders
Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee, Kuo-Chuan Liu
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation
Tae-Kyu Lee, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu
The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints
Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Payam Darbandi, Farhang Pourboghrat, Tae-Kyu Lee, Kuo-Chuan Liu
Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding
Liang Yin, Fred Wafula, Nikolay Dimitrov, Peter Borgesen
Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process
K.C. Yung, C.M.T. Law, C.P. Lee, B. Cheung, T.M. Yue
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)
P. Kumar, I. Dutta, M.S. Bakir
Finite-Element Analysis of Current-Induced Thermal Stress in a Conducting Sphere
Ming Liu, Fuqian Yang
Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature
B. Arfaei, N. Kim, E.J. Cotts
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions
Z. Huang, P. Kumar, I. Dutta, J.H.L. Pang, R. Sidhu, M. Renavikar, R. Mahajan
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints
Iver E. Anderson, Adam Boesenberg, Joel Harringa, David Riegner, Andrew Steinmetz, David Hillman
Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints
D. Chan, G. Subbarayan, L. Nguyen
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map
P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar, R. Mahajan
Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique
Limin Ma, Fu Guo, Guangchen Xu, Xitao Wang, Hongwen He, Haiyan Zhao