Ausgabe 3/2015
Special Section: 3D Printing. Guest Editors: Kyoung-sik (Jack) Moon, Raymond C. Rumpf, Namsoo P. Kim, and Seung-Kyum Choi
Inhalt (31 Artikel)
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process
Seyeon Hwang, Edgar I. Reyes, Kyoung-sik Moon, Raymond C. Rumpf, Nam Soo Kim
Printability and Electrical Conductivity of UV Curable MWCNT Ink
Ada Ortega, Byungwoo Park, Nam Soo Kim
Optimization of UV LED-Curable Ink for Reverse-Offset Roll-to-Plate (RO-R2P) Printing
Kayna Lee Mendoza, Ada Ortega, Nam Soo Kim
Measurement of 3D Printed Structure Using a Peak Detection Method in Dispersive Interferometry
Jongheon Kim, Taeyong Jo, Namyoon Kim, Dongil Kwon
Reliable and Fault-Tolerant Software-Defined Network Operations Scheme for Remote 3D Printing
Dongkyun Kim, Joon-Min Gil
Synthesis of 3D Printable Cu–Ag Core–Shell Materials: Kinetics of CuO Film Removal
Seongik Hong, Namsoo Kim
Use of Spherical Instrumented Indentation to Evaluate the Tensile Properties of 3D Combined Structures
Won-Seok Song, Seung-Gyu Kim, Young-Cheon Kim, Dongil Kwon
Fabrication of 3D Printed Metal Structures by Use of High-Viscosity Cu Paste and a Screw Extruder
Seongik Hong, Cesar Sanchez, Hanuel Du, Namsoo Kim
Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys
Kathlene N. Reeve, Iver E. Anderson, Carol A. Handwerker
Mechanical, Dielectric, and Microwave-Absorption Properties of Alumina Ceramic Containing Dispersed Ti3SiC2
Yi Liu, Fa Luo, Jinbu Su, Wancheng Zhou, Dongmei Zhu
Effect of Substrate Temperature on the Properties of Sprayed WO3 Thin Films Using Peroxotungstic Acid and Ammonium Tungstate: A Comparative Study
V. V. Ganbavle, J. H. Kim, K. Y. Rajpure
Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates
J. Stein, C. A. Cordova Tineo, U. Welzel, W. Huegel, E. J. Mittemeijer
Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages
Bite Zhou, Quan Zhou, Thomas R. Bieler, Tae-kyu Lee
Interfacial Reactions in Sn/Ni-xW Couples
Yee-Wen Yen, Chao-Wei Chiu, Chih-Ming Chen, Mei-Ting Lai, Jia-Ying Dai
Investigation of Optical Nonlinearities in Bi-Doped Se-Te Chalcogenide Thin Films
Preeti Yadav, Ambika Sharma
Growth of Wide-Bandgap Nanocrystalline Silicon Carbide Films by HWCVD: Influence of Filament Temperature on Structural and Optoelectronic Properties
Himanshu S. Jha, Asha Yadav, Mukesh Singh, Shailendra Kumar, Pratima Agarwal
Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials
Munish Sharma, D. D. L. Chung
Synthesis and Characterization of Melt-Spun Metastable Al6Ge5
Masaya Kumagai, Ken Kurosaki, Noriyuki Uchida, Yuji Ohishi, Hiroaki Muta, Shinsuke Yamanaka
Synchronization of Quantum Dot Lasers with an Optoelectronic Feedback Circuit
Basim Abdullattif Ghalib, Ghaidaa Abdul Hafedh, Amin H. Al-Khursan
Characteristic of Nano-Cu Film Prepared by Energy Filtrating Magnetron Sputtering Technique and Its Optical Property
Zhaoyong Wang, Xing Hu, Ning Yao
Polyimide-Damage-Free, CMOS-Compatible Removal of Polymer Residues from Deep Reactive Ion Etching Passivation
W.J. Wu, T. Zhu, J.Q. Liu, J. Fan, L.C. Tu
Electrical Characteristics of GaN-Based Light-Emitting Diodes on Patterned Sapphire Substrates
Y. Li, L. F. Feng, Q. Y. Xing, X. L. Wang
Influence of pH Value on the Properties of NH4Fe2(OH)- (PO4)2·2H2O Precursor and LiFePO4/C Composite
Xue-Bao Liu, Guo-Biao Liu, Yan Wang, Chen Chen, Jian-Long Li, Heng Liu
Characteristics and Charge Storage of Silicon Quantum Dots Embedded in Silicon Nitride Film
Wugang Liao, Xiangbin Zeng, Xixing Wen, Wenjun Zheng, Yangyang Wen, Wei Yao
Synthesis and Luminescence Properties of Eu3+ Doped High Temperature Form of Bi2MoO6
Bing Han, Jie Zhang, Pengju Li, Jianliang Li, Yang Bian, Hengzhen Shi