Skip to main content
Erschienen in: Journal of Coatings Technology and Research 3/2008

01.09.2008

Kinetics analysis and physical properties of photocured silicate-based thiol-ene nanocomposites: The effects of vinyl POSS ene on the polymerization kinetics and physical properties of thiol-triallyl ether networks

verfasst von: Tolecia S. Clark, Charles E. Hoyle, Sergei Nazarenko

Erschienen in: Journal of Coatings Technology and Research | Ausgabe 3/2008

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

The kinetics and thermal/physical properties of the trithiol-TAE (triallyl ether) system were measured with respect to increasing polyoligomeric silsesquioxane (POSS) concentrations in order to understand how the presence of POSS nanoparticles affects network formation at low loadings. Vinyl POSS monomer (vPOSS-Bu4) with both vinyl and carboxylate pendant groups was synthesized via a thermally initiated, free-radical reaction to improve the compatibility of the inorganic particles with the trithiol and triallyl ether comomoners. Chemically modified vPOSS-Bu4 particles were incorporated into the trithiol-TAE polymer networks by a thiol-ene free-radical photopolymerization at molar concentrations of 0, 1, and 5 ene mol%. The polymerization rates were analyzed using real-time FTIR and photo-DSC. The polymerization rates showed no significant changes with increasing vPOSS-Bu4 concentration. Thermal analyses of the films by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) demonstrated that thermal stability improves without affecting T g as the POSS concentration increased. Additionally, scratch resistance increased and flame spread decreased markedly with increasing POSS concentration for concentrations up to 5 mol% vPOSS-Bu4.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Schadler LS, Brinson LC, Sawyer WG, Polymer Nanocomposites: A Small Part of the Story. JOM 59(3), 53–60 (2007)CrossRef Schadler LS, Brinson LC, Sawyer WG, Polymer Nanocomposites: A Small Part of the Story. JOM 59(3), 53–60 (2007)CrossRef
2.
Zurück zum Zitat Arshady, R, “Dendrimers Assemblies and Nanocomposites: Concepts, Criteria, Definitions.” Microsp. Microcap. Liposomes, 5 (Dendrimers, Assemblies, Nanocomposites), 1–29 Arshady, R, “Dendrimers Assemblies and Nanocomposites: Concepts, Criteria, Definitions.” Microsp. Microcap. Liposomes, 5 (Dendrimers, Assemblies, Nanocomposites), 1–29
3.
Zurück zum Zitat Peterson, KA, Conley, WR, “Protection of Microelectronic Devices During Packaging Using Water-Insoluble, Removable Coating.” US Patent 6335224, 2002, 11 pp Peterson, KA, Conley, WR, “Protection of Microelectronic Devices During Packaging Using Water-Insoluble, Removable Coating.” US Patent 6335224, 2002, 11 pp
4.
Zurück zum Zitat Hedrick JL, Miller RD, Yoon D, Cha HJ, Brown HR, Srinivasan SA, Di Pietro R, Flores V, Hummel J, Cook R, Liniger E, Simonyi E, Klaus D, Nanoscopically Engineered Organic–Inorganic Hybrids as Low Dielectric Constant, High Modulus Insulating Materials for Microelectronic Applications. Polym. Preprints (Am. Chem. Soc. Div. Polym. Chem.) 38(1), 985–986 (1997) Hedrick JL, Miller RD, Yoon D, Cha HJ, Brown HR, Srinivasan SA, Di Pietro R, Flores V, Hummel J, Cook R, Liniger E, Simonyi E, Klaus D, Nanoscopically Engineered Organic–Inorganic Hybrids as Low Dielectric Constant, High Modulus Insulating Materials for Microelectronic Applications. Polym. Preprints (Am. Chem. Soc. Div. Polym. Chem.) 38(1), 985–986 (1997)
5.
Zurück zum Zitat Vorotilov KA, Petrovsky VI, Vasiljev VA, Sobolevsky MV, ORMOSIL Films: Properties and Microelectronic Applications. J. Sol-Gel Sci. Technol. 8(1/2/3), 581–584 (1997)CrossRef Vorotilov KA, Petrovsky VI, Vasiljev VA, Sobolevsky MV, ORMOSIL Films: Properties and Microelectronic Applications. J. Sol-Gel Sci. Technol. 8(1/2/3), 581–584 (1997)CrossRef
6.
Zurück zum Zitat Miller RD, Hedrick JL, Yoon DY, Cook RF, Hummel JP, Phase-Separated Inorganic–Organic Hybrids for Microelectronic Applications. MRS Bull. 22(10), 44–48 (1997) Miller RD, Hedrick JL, Yoon DY, Cook RF, Hummel JP, Phase-Separated Inorganic–Organic Hybrids for Microelectronic Applications. MRS Bull. 22(10), 44–48 (1997)
7.
Zurück zum Zitat Donald W.S., Thermal Rearrangement of Branched-Chain Methylpolysiloxanes, J. Am. Chem. Soc. 68(3), 356–358 (1946)CrossRef Donald W.S., Thermal Rearrangement of Branched-Chain Methylpolysiloxanes, J. Am. Chem. Soc. 68(3), 356–358 (1946)CrossRef
8.
Zurück zum Zitat Li, G, Wang, L, Ni, H, Pittman, CU Jr, “Polyhedral Oligomeric Silsesquioxane (POSS) Polymers and Copolymers: A Review.” J. Inorg. Organometal. Polym., 11 (3), 123–154 (2002) Li, G, Wang, L, Ni, H, Pittman, CU Jr, “Polyhedral Oligomeric Silsesquioxane (POSS) Polymers and Copolymers: A Review.” J. Inorg. Organometal. Polym., 11 (3), 123–154 (2002)
9.
Zurück zum Zitat Jacobine, AF, In: Fouassier, JD, Rabek, JF, (eds.) Radiation Curing in Polymer Science and Technology III, Polymerization Mechanisms, Vol. 3, pp. 219–268. Elsevier Applied Science, London (1993) Jacobine, AF, In: Fouassier, JD, Rabek, JF, (eds.) Radiation Curing in Polymer Science and Technology III, Polymerization Mechanisms, Vol. 3, pp. 219–268. Elsevier Applied Science, London (1993)
10.
Zurück zum Zitat Cramer NB, Scott JP, Bowman CN, Photopolymerizations of Thiol-Ene Polymers without Photoinitiators. Macromolecules 35(14), 5361–5365 (2002)CrossRef Cramer NB, Scott JP, Bowman CN, Photopolymerizations of Thiol-Ene Polymers without Photoinitiators. Macromolecules 35(14), 5361–5365 (2002)CrossRef
11.
Zurück zum Zitat Cramer NB, Bowman, CN, Kinetics of Thiol-ene and Thiol-Acrylate Photopolymerizations with Real-Time Fourier Transform Infrared. J. Polym. Sci. Part A Polym. Chem. 39(19), 3311–3319 (2001)CrossRef Cramer NB, Bowman, CN, Kinetics of Thiol-ene and Thiol-Acrylate Photopolymerizations with Real-Time Fourier Transform Infrared. J. Polym. Sci. Part A Polym. Chem. 39(19), 3311–3319 (2001)CrossRef
12.
Zurück zum Zitat Hoyle, C, Cole, M, Bachemin, M, Yoder, B, Nguyen, C, Kuang, W, Bowman, C, Cramer, N, Jonsson, S, Viswanathan, K, “Photopolymerization of Thiol-Enes: Some Recent Advances.” In: Radtech Japan 2000 Technical Proceedings, Tokyo, Japan, December 2000, p. 211 Hoyle, C, Cole, M, Bachemin, M, Yoder, B, Nguyen, C, Kuang, W, Bowman, C, Cramer, N, Jonsson, S, Viswanathan, K, “Photopolymerization of Thiol-Enes: Some Recent Advances.” In: Radtech Japan 2000 Technical Proceedings, Tokyo, Japan, December 2000, p. 211
13.
Zurück zum Zitat Hoyle CE, Hensel RD, Grubb MB, Laser-Initiated Polymerization of a Thiol-Ene System. Polym. Photochem. 4(1), 69–80 (1984)CrossRef Hoyle CE, Hensel RD, Grubb MB, Laser-Initiated Polymerization of a Thiol-Ene System. Polym. Photochem. 4(1), 69–80 (1984)CrossRef
14.
Zurück zum Zitat Hoyle CE, Hensel RD, Grubb MB, Temperature Dependence of the Laser-Initiated Polymerization of a Thiol-Ene System. J. Polym. Sci. Polym. Chem. Ed. 22(8), 1865–73 (1984)CrossRef Hoyle CE, Hensel RD, Grubb MB, Temperature Dependence of the Laser-Initiated Polymerization of a Thiol-Ene System. J. Polym. Sci. Polym. Chem. Ed. 22(8), 1865–73 (1984)CrossRef
15.
Zurück zum Zitat Standard Test Method for Film Hardness by Pencil Test. ASTM 1974, D 3363 00 Standard Test Method for Film Hardness by Pencil Test. ASTM 1974, D 3363 00
16.
Zurück zum Zitat Flammability of Plastics 0.050 in and Under in Thickness. ASTM 1956, D 0568 56 T. Flammability of Plastics 0.050 in and Under in Thickness. ASTM 1956, D 0568 56 T.
Metadaten
Titel
Kinetics analysis and physical properties of photocured silicate-based thiol-ene nanocomposites: The effects of vinyl POSS ene on the polymerization kinetics and physical properties of thiol-triallyl ether networks
verfasst von
Tolecia S. Clark
Charles E. Hoyle
Sergei Nazarenko
Publikationsdatum
01.09.2008
Verlag
Springer US
Erschienen in
Journal of Coatings Technology and Research / Ausgabe 3/2008
Print ISSN: 1547-0091
Elektronische ISSN: 1935-3804
DOI
https://doi.org/10.1007/s11998-008-9092-x

Weitere Artikel der Ausgabe 3/2008

Journal of Coatings Technology and Research 3/2008 Zur Ausgabe

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.