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2023 | OriginalPaper | Buchkapitel
5. Tying the System Together
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Abstract
Millions of dollars and a year of our design team’s hard work has been spent, but it was well worth it! The fab has finished and shipped your order – 100,000 freshly minted custom processors are on the way. What now? If you’re reading this on a kindle or a laptop, you may have noticed that a screen is in front of you, not a die-package assembly. The truth of the matter is that a well-designed IC is only as good as the system it’s a part of. As Moore’s Law slows down and companies lean more heavily on functional scaling to meet the demands of their customers, system integration has become increasingly important. From advanced interconnects and next generation IC Packaging to signal integrity and power distribution networks, in this chapter we’ll explore the technologies that tie systems together.