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2008 | Buch

Introduction Kapitel lesen Erstes Kapitel lesen

Development and Evaluation of Setup Strategies in Printed Circuit Board Assembly

verfasst von: Ihsan Onur Yilmaz

Verlag: Gabler

Enthalten in: Springer Professional "Wirtschaft+Technik" , Springer Professional "Wirtschaft"

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Über dieses Buch

During the last decade the electronics industry faced growth rates considerably higher than average due to innovative products and the comprehensive use of electronic control devices for almost all types of technical products. Hence, printed circuit board (PCB) assembly can be seen as one of the most dynamic branches of the electronics industry. In modern electronics manufacturing, highly automated assembly systems are used to mount the electronic com- nents at pre-specified locations onto the PCBs. Because of the tremendous complexity of the process technology and huge capital investments, highly sophisticated planning and control strategies are needed for the operation of the assembly plants. In the past both industry and academia became heavily involved in the development of tools and planning concepts which help to master the huge variety of customized electronic pr- ucts. While previous research work has primarily been concerned with a high-volume, l- variety production environment, there is now an ongoing trend towards the use of highly fl- ible manufacturing equipment and the production of printed circuit boards in a mixed - quence with only small lot sizes.

Inhaltsverzeichnis

Frontmatter
1. Introduction
Abstract
In the last decades, electronic control units have become essential parts of many modern industrial and commercial products. Since 2000, electronics industry is the biggest industrial sector in the world ahead of the automobile industry. Electronics is integrated into almost every product we use in our daily life — from the alarm clock we use to wake up every morning to the remote control for watching TV in the evening. Unfortunately, “people on the streets”, although they use over more than 100 of them a day, are still not aware of the product called printed circuit board (PCB).
2. Technological Background
Abstract
PCBs are the key components in almost all electronic assemblies. The idea of the PCB originated from the need of placing components and devices on a non-conductive carrier and adding functional and electrical connections with conductive paths.12 With the invention of PCBs, the former three-dimensional wiring of valves, coins and resistances has been replaced with a two-dimensional pattern on an insulating board. 13
3. SMT Placement Machines
Abstract
Placement machines are the most critical and expensive pieces of equipment in SMT, which commonly constitute the bottleneck of the assembly line, and hence determine the throughput. Growing production volumes, reducing size of components and complexity of the boards reinforced the usage of full-automated assembly lines. Depending on the placement type, fullautomated placement systems can be observed in two main groups: simultaneous and sequential placement equipment.44
4. Production Planning in Electronics Assembly
Abstract
The general planning problem for manufacturing systems is too complex to be solved globally. Thus, it is common in the flexible manufacturing systems (FMS) literature to decompose the planning problem into hierarchical decision structures relating to a variety of decisions to be taken in long-, medium- and short-term periods.70 In these decomposition schemes, problems are divided into solvable subproblems which are coupled with each other in the global scheme. Of course, this methodology cannot guarantee the global optimality of the final solution, even assuming that all subproblems are solved to optimality, because many subproblems are generally interrelated and the solution of one problem affects the solution of the next one. This is even more relevant for the case of PCB assembly, where most subproblems themselves turn out to be NP-hard, and hence can only be approximately solved by heuristic procedures.
5. Development of Group Setup Strategies
Abstract
Figure 5.1 illustrates the planning problems which are investigated in the developed group setup approaches. In this study, two different approaches are proposed for the job grouping problem. In the first approach, grouping is performed by use of well-known similarity measures and agglomerative linkage methods (see section 5.1). The second approach employs the so-called “inclusion measure” as a similarity coefficient, which is more appropriate for PCB assembly and generates setup families using a novel hierarchical clustering technique which is based on the inclusion tree representation scheme due to Raz and Yaung (1994). This approach is laid out in section 5.2. Because of the hierarchical nature of the presented grouping processes, initial grouping results are then improved using heuristic procedures which are described in section 5.3.
6. Numerical Investigation
Abstract
In the following, a comprehensive numerical investigation is presented, which evaluates the performance of the proposed group setup approaches and highlights the effects of the new features integrated into the heuristic methods. The main questions addressed through the computational experiments are:
  • Which conventional agglomerative linkage method performs best in combination with different similarity measures (section 6.2.1)?
  • How effective is the inclusion-based clustering approach compared against conventional clustering methods (section 6.2.2)?
  • What is the performance of the implemented improvement heuristics (section 6.2.3)?
  • How do the proposed group setup approaches perform in comparison with a unique setup strategy (section 6.3.1)?
  • How does the check for makespan reduction integrated into the group setup procedures improve their performance (section 6.3.2)?
  • How does the consideration of batch sizes in the magazine setup heuristic of the group setup procedures improve their performance (section 6.3.3)?
7. Conclusions
Abstract
The rapidly developing market for electronic products requires the use of flexible and highly automated assembly systems. Placement machines constitute the heaviest investment of an electronics assembly system which usually defines its throughput. Several analyses demonstrate that the real productive capacity of a placement machine remains much below the theoretical capacity given by the machine vendors. Hence, development and implementation of advanced planning and control systems are essential for exploiting the potentials of highly automated assembly lines.
Backmatter
Metadaten
Titel
Development and Evaluation of Setup Strategies in Printed Circuit Board Assembly
verfasst von
Ihsan Onur Yilmaz
Copyright-Jahr
2008
Verlag
Gabler
Electronic ISBN
978-3-8349-9872-9
Print ISBN
978-3-8349-1200-8
DOI
https://doi.org/10.1007/978-3-8349-9872-9

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