Skip to main content
Erschienen in: Journal of Materials Science 8/2016

04.01.2016 | Review

Plating on acrylonitrile–butadiene–styrene (ABS) plastic: a review

verfasst von: Sharon Olivera, Handanahally Basavarajaiah Muralidhara, Krishna Venkatesh, Keshavanarayana Gopalakrishna, Chinnaganahalli Suryaprakash Vivek

Erschienen in: Journal of Materials Science | Ausgabe 8/2016

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

ABS is an engineering plastic that has butadiene part uniformly distributed over the acrylonitrile-styrene matrix. It possesses excellent toughness, good dimensional stability, easy processing ability, chemical resistance, and cheapness. However, it suffers from inherent shortcomings in terms of mechanical strength and vulnerability to environmental conditions. Furthermore, it is non-conducting and easily fretted. Plating on ABS can serve to enhance the strength and structural integrity as well as to improve durability and thermal resistance resulting in metallic properties on the ABS material. ABS is described as the most suitable candidate for plating because it is possible to deposit an adherent metal coating on it by only the use of chemical pretreatment process and without the use of any mechanical abrasion. This article aims to review the history of ABS plastics, properties of ABS, processes and mechanisms of plating, and studies of plating on ABS involving mainly eco-friendly methods of plating by discussing the literature published in recent years. The details of electroplating of ABS carried out in the authors’ laboratory are also presented.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
2.
Zurück zum Zitat Tran V, Massardier V, Guyot A, Nguyen T (1993) Interactions in metal-polymer-metal interfaces. Polymer 34(15):3179–3183CrossRef Tran V, Massardier V, Guyot A, Nguyen T (1993) Interactions in metal-polymer-metal interfaces. Polymer 34(15):3179–3183CrossRef
3.
Zurück zum Zitat Grundmeier G, Stratmann M (2005) Adhesion and de-adhesion mechanisms at polymer/metal interfaces: mechanistic understanding based on in situ studies of buried interfaces. Annu Rev Mater Res 35:571–615CrossRef Grundmeier G, Stratmann M (2005) Adhesion and de-adhesion mechanisms at polymer/metal interfaces: mechanistic understanding based on in situ studies of buried interfaces. Annu Rev Mater Res 35:571–615CrossRef
4.
Zurück zum Zitat Holubar P, Jilek M, Sima M (2000) Present and possible future applications of superhard nanocomposite coatings. Surf Coat Technol 133:145–151CrossRef Holubar P, Jilek M, Sima M (2000) Present and possible future applications of superhard nanocomposite coatings. Surf Coat Technol 133:145–151CrossRef
5.
Zurück zum Zitat Long DP, Blackburn JM, Watkins JJ (2000) Chemical fluid deposition: a hybrid technique for low-temperature metallization. Adv Mater 12(12):913–915CrossRef Long DP, Blackburn JM, Watkins JJ (2000) Chemical fluid deposition: a hybrid technique for low-temperature metallization. Adv Mater 12(12):913–915CrossRef
6.
Zurück zum Zitat Cheng K, Yang MH, Chiu WW, Huang CY, Chang J, Ying TF, Yang Y (2005) Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: low cost fabrication of circuits on a flexible substrate at room temperature. Macromol Rapid Comm 26(4):247–264CrossRef Cheng K, Yang MH, Chiu WW, Huang CY, Chang J, Ying TF, Yang Y (2005) Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: low cost fabrication of circuits on a flexible substrate at room temperature. Macromol Rapid Comm 26(4):247–264CrossRef
7.
Zurück zum Zitat Garcia A (2011) Ligand induced electroless plating of polymers. PhD Dissertation, École Polytech Garcia A (2011) Ligand induced electroless plating of polymers. PhD Dissertation, École Polytech
8.
Zurück zum Zitat Arai S, Sato T, Endo M (2011) Fabrication of various electroless Ni–P alloy/multiwalled carbon nanotube composite films on an acrylonitrile butadiene styrene resin. Surf Coat Technol 205(10):3175–3181CrossRef Arai S, Sato T, Endo M (2011) Fabrication of various electroless Ni–P alloy/multiwalled carbon nanotube composite films on an acrylonitrile butadiene styrene resin. Surf Coat Technol 205(10):3175–3181CrossRef
9.
Zurück zum Zitat Tengsuwan S, Ohshima M (2014) Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile–butadiene–styrene. Appl Surf Sci 311:189–200CrossRef Tengsuwan S, Ohshima M (2014) Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile–butadiene–styrene. Appl Surf Sci 311:189–200CrossRef
10.
Zurück zum Zitat Dechasit P, Trakarnpruk W (2011) Ni electroless plating of ABS polymer by palladium and tin-free process. J Met Mater Min 21(2):19–27 Dechasit P, Trakarnpruk W (2011) Ni electroless plating of ABS polymer by palladium and tin-free process. J Met Mater Min 21(2):19–27
11.
Zurück zum Zitat Wang Z, Li Z, He Y, Wang Z (2011) Study of an environmentally friendly surface etching system of ABS for improving adhesion of electroless Cu film. J Electrochem Soc 158(11):D664–D670CrossRef Wang Z, Li Z, He Y, Wang Z (2011) Study of an environmentally friendly surface etching system of ABS for improving adhesion of electroless Cu film. J Electrochem Soc 158(11):D664–D670CrossRef
12.
Zurück zum Zitat Kim GG, Kang JA, Kim JH, K-y Lee, Kim SJ, Kim S-J (2007) Photocatalytic pretreatment of acrylonitrile–butadiene–styrene polymer for electroless plating. Scripta Mater 56(5):349–351CrossRef Kim GG, Kang JA, Kim JH, K-y Lee, Kim SJ, Kim S-J (2007) Photocatalytic pretreatment of acrylonitrile–butadiene–styrene polymer for electroless plating. Scripta Mater 56(5):349–351CrossRef
13.
Zurück zum Zitat Di L, Liu B, Song J, Shan D, Yang D-A (2011) Effect of chemical etching on the Cu/Ni metallization of poly (ether ether ketone)/carbon fiber composites. Appl Surf Sci 257(9):4272–4277CrossRef Di L, Liu B, Song J, Shan D, Yang D-A (2011) Effect of chemical etching on the Cu/Ni metallization of poly (ether ether ketone)/carbon fiber composites. Appl Surf Sci 257(9):4272–4277CrossRef
14.
Zurück zum Zitat Ferreira ODS, Stevens A, Schrauwen C (2009) Quantitative comparison of adhesion in metal-to-plastic systems. Thin Solid Films 517(10):3070–3074CrossRef Ferreira ODS, Stevens A, Schrauwen C (2009) Quantitative comparison of adhesion in metal-to-plastic systems. Thin Solid Films 517(10):3070–3074CrossRef
15.
Zurück zum Zitat Ma Z, Tan K, Kang E (2000) Electroless plating of palladium and copper on polyaniline films. Synth Met 114(1):17–25CrossRef Ma Z, Tan K, Kang E (2000) Electroless plating of palladium and copper on polyaniline films. Synth Met 114(1):17–25CrossRef
16.
Zurück zum Zitat Kulkarni MV, Elangovan K, Hemachandra RK (2013) Effects of electroplating on the mechanical properties of injection molded thermoplastics. Int J Plast Technol. doi:10.1007/s12588-013-9056-6 Kulkarni MV, Elangovan K, Hemachandra RK (2013) Effects of electroplating on the mechanical properties of injection molded thermoplastics. Int J Plast Technol. doi:10.​1007/​s12588-013-9056-6
17.
Zurück zum Zitat Vander Togt RT (2011) Bumper and process to bond ionomers to plastic. US Patent 4,999,227 Vander Togt RT (2011) Bumper and process to bond ionomers to plastic. US Patent 4,999,227
18.
Zurück zum Zitat Teixeira LAC, Santini MC (2005) Surface conditioning of ABS for metallization without the use of chromium baths. J Mater Process Technol 170(1):37–41CrossRef Teixeira LAC, Santini MC (2005) Surface conditioning of ABS for metallization without the use of chromium baths. J Mater Process Technol 170(1):37–41CrossRef
19.
Zurück zum Zitat Shu Z, Wang X (2012) Environment-friendly Pd free surface activation technics for ABS surface. Appl Surf Sci 258(14):5328–5331CrossRef Shu Z, Wang X (2012) Environment-friendly Pd free surface activation technics for ABS surface. Appl Surf Sci 258(14):5328–5331CrossRef
20.
Zurück zum Zitat Bazzaoui M, Martins J, Bazzaoui E, Albourine A (2012) Environmentally friendly process for nickel electroplating of ABS. Appl Surf Sci 258(20):7968–7975CrossRef Bazzaoui M, Martins J, Bazzaoui E, Albourine A (2012) Environmentally friendly process for nickel electroplating of ABS. Appl Surf Sci 258(20):7968–7975CrossRef
21.
Zurück zum Zitat Tang X, Cao M, Bi C, Yan L, Zhang B (2008) Research on a new surface activation process for electroless plating on ABS plastic. Mater Lett 62(6):1089–1091CrossRef Tang X, Cao M, Bi C, Yan L, Zhang B (2008) Research on a new surface activation process for electroless plating on ABS plastic. Mater Lett 62(6):1089–1091CrossRef
22.
Zurück zum Zitat Skelly J (2008) Decorative plating processes for common plastic resins: resin selection as well as plastic part design is critical to matching the right finishing method with the intended application. Met Finish 106(6):61–65CrossRef Skelly J (2008) Decorative plating processes for common plastic resins: resin selection as well as plastic part design is critical to matching the right finishing method with the intended application. Met Finish 106(6):61–65CrossRef
23.
Zurück zum Zitat Haba B, Sugai K, Morishige Y, Kishida S (1994) Large scale two-step selective aluminum CVD on laser patterned palladium lines. Appl Surf Sci 79:381–384CrossRef Haba B, Sugai K, Morishige Y, Kishida S (1994) Large scale two-step selective aluminum CVD on laser patterned palladium lines. Appl Surf Sci 79:381–384CrossRef
24.
Zurück zum Zitat Chen Y, Reisman A, Turlik I, Temple D (1995) Cu CVD from copper (II) hexafluoroacetylacetonate II. Laser-assisted selective area deposition. J Electrochem Soc 142(11):3911–3918CrossRef Chen Y, Reisman A, Turlik I, Temple D (1995) Cu CVD from copper (II) hexafluoroacetylacetonate II. Laser-assisted selective area deposition. J Electrochem Soc 142(11):3911–3918CrossRef
25.
Zurück zum Zitat Seeböck R, Esrom H, Charbonnier M, Romand M, Kogelschatz U (2001) Surface modification of polyimide using dielectric barrier discharge treatment. Surf Coat Technol 142:455–459CrossRef Seeböck R, Esrom H, Charbonnier M, Romand M, Kogelschatz U (2001) Surface modification of polyimide using dielectric barrier discharge treatment. Surf Coat Technol 142:455–459CrossRef
26.
Zurück zum Zitat Tóth Z, Szörényi T, Toth A (1993) Ar+ laser-induced forward transfer (LIFT): a novel method for micrometer-size surface patterning. Appl Surf Sci 69(1):317–320CrossRef Tóth Z, Szörényi T, Toth A (1993) Ar+ laser-induced forward transfer (LIFT): a novel method for micrometer-size surface patterning. Appl Surf Sci 69(1):317–320CrossRef
27.
Zurück zum Zitat McCaskie JE, Tsiamis C (1985) Metal plating on plastics. US Patent 4,520,046 McCaskie JE, Tsiamis C (1985) Metal plating on plastics. US Patent 4,520,046
28.
Zurück zum Zitat Yang C-Y (2012) Method for preparing electronic component-mounting device. US Patent App. 13/471,108 Yang C-Y (2012) Method for preparing electronic component-mounting device. US Patent App. 13/471,108
29.
Zurück zum Zitat Hooke R (2014) Method of making shaped charges and explosively formed projectiles. US Patent 8,813,651 Hooke R (2014) Method of making shaped charges and explosively formed projectiles. US Patent 8,813,651
30.
Zurück zum Zitat Hoyt R, Wrobel J, Cushing J, Jaster M, Voronka N, Frank S, Slostad J, Paritsky L (2014) Structures with internal microstructures to provide multifunctional capabilities. US Patent 14/462,541 Hoyt R, Wrobel J, Cushing J, Jaster M, Voronka N, Frank S, Slostad J, Paritsky L (2014) Structures with internal microstructures to provide multifunctional capabilities. US Patent 14/462,541
31.
Zurück zum Zitat Nath J, Shen Y, Nealis E (2014) Systems and methods for manufacturing passive waveguide components. US Patent App. 14/453,563 Nath J, Shen Y, Nealis E (2014) Systems and methods for manufacturing passive waveguide components. US Patent App. 14/453,563
32.
Zurück zum Zitat McCaskie JE (2006) Plating on plastics: a survey of mechanisms for adhering metal films to plastic surfaces. Met Finish 104(5):31–39CrossRef McCaskie JE (2006) Plating on plastics: a survey of mechanisms for adhering metal films to plastic surfaces. Met Finish 104(5):31–39CrossRef
33.
Zurück zum Zitat Mallory GO, Hajdu JB (1990) Electroless plating: fundamentals and applications. William Andrew, New York Mallory GO, Hajdu JB (1990) Electroless plating: fundamentals and applications. William Andrew, New York
34.
Zurück zum Zitat Arnold JR (2003) High quality copper-nickel-chromium plating on plastics: a continuous process and its challenges. Plat Surf Finish 91:355–379 Arnold JR (2003) High quality copper-nickel-chromium plating on plastics: a continuous process and its challenges. Plat Surf Finish 91:355–379
35.
Zurück zum Zitat Kulkarni MV, Elangovan K, Hemachandra Reddy K (2012) Improvements in impact resistance property of metal plated abs and Nylon6 thermoplastics. FS J Eng Res 1(1):31–33 Kulkarni MV, Elangovan K, Hemachandra Reddy K (2012) Improvements in impact resistance property of metal plated abs and Nylon6 thermoplastics. FS J Eng Res 1(1):31–33
37.
Zurück zum Zitat Tang X, Wang J, Wang C, Shen B (2011) A novel surface activation method for Ni/Au electroless plating of acrylonitrile–butadiene–styrene. Surf Coat Technol 206(6):1382–1388CrossRef Tang X, Wang J, Wang C, Shen B (2011) A novel surface activation method for Ni/Au electroless plating of acrylonitrile–butadiene–styrene. Surf Coat Technol 206(6):1382–1388CrossRef
38.
Zurück zum Zitat Garcia A, Berthelot T, Viel P, Mesnage A, Jégou P, Nekelson F, Roussel S, Palacin S (2010) ABS polymer electroless plating through a one-step poly(acrylic acid) covalent grafting. ACS Appl Mater Interfaces 2(4):1177–1183CrossRef Garcia A, Berthelot T, Viel P, Mesnage A, Jégou P, Nekelson F, Roussel S, Palacin S (2010) ABS polymer electroless plating through a one-step poly(acrylic acid) covalent grafting. ACS Appl Mater Interfaces 2(4):1177–1183CrossRef
39.
Zurück zum Zitat Kuzmik JJ (1990) Electroless plating: fundamentals and applications (Reprint Edition). In: Mallory GO, Hajdu JB (eds). The American Electroplaters and Surface Finishers Society, Orlanda, FL, pp 377–399 Kuzmik JJ (1990) Electroless plating: fundamentals and applications (Reprint Edition). In: Mallory GO, Hajdu JB (eds). The American Electroplaters and Surface Finishers Society, Orlanda, FL, pp 377–399
40.
Zurück zum Zitat Hanna F, Hamid ZA, Aal AA (2004) Controlling factors affecting the stability and rate of electroless copper plating. Mater Lett 58(1):104–109CrossRef Hanna F, Hamid ZA, Aal AA (2004) Controlling factors affecting the stability and rate of electroless copper plating. Mater Lett 58(1):104–109CrossRef
43.
Zurück zum Zitat Liu H-P, Li N, Bi S-F, Li D-Y, Zou Z-L (2008) Effect of organic additives on the corrosion resistance properties of electroless nickel deposits. Thin Solid Films 516(8):1883–1889CrossRef Liu H-P, Li N, Bi S-F, Li D-Y, Zou Z-L (2008) Effect of organic additives on the corrosion resistance properties of electroless nickel deposits. Thin Solid Films 516(8):1883–1889CrossRef
44.
Zurück zum Zitat Lu G, Li X, Jiang H (1996) Electrical and shielding properties of ABS resin filled with nickel-coated carbon fibers. Compos Sci Technol 56(2):193–200CrossRef Lu G, Li X, Jiang H (1996) Electrical and shielding properties of ABS resin filled with nickel-coated carbon fibers. Compos Sci Technol 56(2):193–200CrossRef
45.
Zurück zum Zitat Walsh F, De León CP, Kerr C, Court S, Barker B (2008) Electrochemical characterisation of the porosity and corrosion resistance of electrochemically deposited metal coatings. Surf Coat Technol 202(21):5092–5102CrossRef Walsh F, De León CP, Kerr C, Court S, Barker B (2008) Electrochemical characterisation of the porosity and corrosion resistance of electrochemically deposited metal coatings. Surf Coat Technol 202(21):5092–5102CrossRef
46.
Zurück zum Zitat Agarwala RC, Agarwala V, Sharma R (2006) Electroless ni-p based nanocoating technology—a review. Synth React Inorg Met-Org Nano-Met Chem 36(6):493–515CrossRef Agarwala RC, Agarwala V, Sharma R (2006) Electroless ni-p based nanocoating technology—a review. Synth React Inorg Met-Org Nano-Met Chem 36(6):493–515CrossRef
47.
Zurück zum Zitat Balaraju J, Narayanan TS, Seshadri S (2003) Electroless Ni–P composite coatings. J Appl Electrochem 33(9):807–816CrossRef Balaraju J, Narayanan TS, Seshadri S (2003) Electroless Ni–P composite coatings. J Appl Electrochem 33(9):807–816CrossRef
48.
Zurück zum Zitat Tzeng S-S, Chang F-Y (2001) EMI shielding effectiveness of metal-coated carbon fiber-reinforced ABS composites. Mater Sci Eng A 302(2):258–267CrossRef Tzeng S-S, Chang F-Y (2001) EMI shielding effectiveness of metal-coated carbon fiber-reinforced ABS composites. Mater Sci Eng A 302(2):258–267CrossRef
49.
Zurück zum Zitat Charbonnier M, Romand M, Goepfert Y (2006) Ni direct electroless metallization of polymers by a new palladium-free process. Surf Coat Technol 200(16):5028–5036CrossRef Charbonnier M, Romand M, Goepfert Y (2006) Ni direct electroless metallization of polymers by a new palladium-free process. Surf Coat Technol 200(16):5028–5036CrossRef
50.
Zurück zum Zitat Sahoo P, Das SK (2011) Tribology of electroless nickel coatings—a review. Mater Des 32(4):1760–1775CrossRef Sahoo P, Das SK (2011) Tribology of electroless nickel coatings—a review. Mater Des 32(4):1760–1775CrossRef
51.
Zurück zum Zitat Sudagar J, Lian J, Sha W (2013) Electroless nickel, alloy, composite and nano coatings—a critical review. J Alloys Compd 571:183–204CrossRef Sudagar J, Lian J, Sha W (2013) Electroless nickel, alloy, composite and nano coatings—a critical review. J Alloys Compd 571:183–204CrossRef
52.
Zurück zum Zitat Agarwala R, Agarwala V (2003) Electroless alloy/composite coatings: a review. Sadhana 28(3–4):475–493CrossRef Agarwala R, Agarwala V (2003) Electroless alloy/composite coatings: a review. Sadhana 28(3–4):475–493CrossRef
53.
Zurück zum Zitat Equbal A, Dixit NK, Sood AK (2013) Electroless plating on plastic. IJSER 4 Equbal A, Dixit NK, Sood AK (2013) Electroless plating on plastic. IJSER 4
54.
Zurück zum Zitat Maul J, Frushour BG, Kontoff JR, Eichenauer H, Ott K-H, Schade C (2000) Polystyrene and styrene copolymers. In: Ullmann’s encyclopedia of industrial chemistry. Wiley, New York. doi:10.1002/14356007.a21_615.pub2 Maul J, Frushour BG, Kontoff JR, Eichenauer H, Ott K-H, Schade C (2000) Polystyrene and styrene copolymers. In: Ullmann’s encyclopedia of industrial chemistry. Wiley, New York. doi:10.​1002/​14356007.​a21_​615.​pub2
59.
60.
Zurück zum Zitat Kulich DM, Gaggar S, Lowry V, Stepien R (2004) Acrylonitrile–butadiene–styrene (ABS) polymers. Kirk-Othmer Encyclopedia of Chemical Technology Kulich DM, Gaggar S, Lowry V, Stepien R (2004) Acrylonitrile–butadiene–styrene (ABS) polymers. Kirk-Othmer Encyclopedia of Chemical Technology
61.
Zurück zum Zitat Moore J (1973) Acrylonitrile–butadiene–styrene (ABS)-a review. Composites 4(3):118–130CrossRef Moore J (1973) Acrylonitrile–butadiene–styrene (ABS)-a review. Composites 4(3):118–130CrossRef
62.
Zurück zum Zitat ABS material data sheet. teststandard.com/data_sheets/ABS_Data_sheet.pdf ABS material data sheet. teststandard.com/data_sheets/ABS_Data_sheet.pdf
63.
Zurück zum Zitat Lifton VA, Lifton G, Simon S (2014) Options for additive rapid prototyping methods (3D printing) in MEMS technology. Rapid Prototyp J 20(5):403–412CrossRef Lifton VA, Lifton G, Simon S (2014) Options for additive rapid prototyping methods (3D printing) in MEMS technology. Rapid Prototyp J 20(5):403–412CrossRef
65.
Zurück zum Zitat Yuan L (2008) A preliminary research on development of a fiber-composite, curved FDM system. National University of Singapore Yuan L (2008) A preliminary research on development of a fiber-composite, curved FDM system. National University of Singapore
67.
Zurück zum Zitat Yan XG, Gu PENG (1996) A review of rapid prototyping technologies and systems. Comput Aided Des 28(4):307–318CrossRef Yan XG, Gu PENG (1996) A review of rapid prototyping technologies and systems. Comput Aided Des 28(4):307–318CrossRef
68.
Zurück zum Zitat Diegel O, Reay S, Singamneni S, Withell A (2010) Tools for sustainable product design: additive manufacturing. J Sustain Dev 3(3):68–75CrossRef Diegel O, Reay S, Singamneni S, Withell A (2010) Tools for sustainable product design: additive manufacturing. J Sustain Dev 3(3):68–75CrossRef
71.
Zurück zum Zitat Crump SS (1992) Apparatus and method for creating three-dimensional objects. US Patent 5,121,329 Crump SS (1992) Apparatus and method for creating three-dimensional objects. US Patent 5,121,329
72.
Zurück zum Zitat Sachs EM, Haggerty JS, Cima MJ, Williams PA (1993) Three-dimensional printing techniques. US Patent 5,204,055 Sachs EM, Haggerty JS, Cima MJ, Williams PA (1993) Three-dimensional printing techniques. US Patent 5,204,055
73.
Zurück zum Zitat Gross BC, Erkal JL, Lockwood SY, Chen C, Spence DM (2014) Evaluation of 3D printing and its potential impact on biotechnology and the chemical sciences. Anal Chem. doi:10.1021/ac403397r Gross BC, Erkal JL, Lockwood SY, Chen C, Spence DM (2014) Evaluation of 3D printing and its potential impact on biotechnology and the chemical sciences. Anal Chem. doi:10.​1021/​ac403397r
74.
Zurück zum Zitat Chen S, Patel N, Schaffer D, Maharbiz M (2011) Trap and corral: a two-step approach for constructing and constraining dynamic cell contact events in differentiating progenitor cell populations. J Micromech Microeng 21(5):054027CrossRef Chen S, Patel N, Schaffer D, Maharbiz M (2011) Trap and corral: a two-step approach for constructing and constraining dynamic cell contact events in differentiating progenitor cell populations. J Micromech Microeng 21(5):054027CrossRef
75.
Zurück zum Zitat Kannan S, Senthilkumaran D (2014) Assessment of mechanical properties of Ni-coated abs plastics using FDM process. IJMME-IJENS 14(3):30–35 Kannan S, Senthilkumaran D (2014) Assessment of mechanical properties of Ni-coated abs plastics using FDM process. IJMME-IJENS 14(3):30–35
76.
Zurück zum Zitat Monzon MD, Diaz N, Benitez AN, Marrero MD, Hernandez PM (2010) Advantages of fused deposition modeling for making electrically conductive plastic. Int Conf Manuf Autom. doi:10.1109/ICMA.2010.36 Monzon MD, Diaz N, Benitez AN, Marrero MD, Hernandez PM (2010) Advantages of fused deposition modeling for making electrically conductive plastic. Int Conf Manuf Autom. doi:10.​1109/​ICMA.​2010.​36
77.
Zurück zum Zitat Kannan S, Senthilkumaran D, Elangovan, K. (2013) Development of composite materials by rapid prototyping technology using FDM method. IEEE, 281–283 Kannan S, Senthilkumaran D, Elangovan, K. (2013) Development of composite materials by rapid prototyping technology using FDM method. IEEE, 281–283
78.
Zurück zum Zitat Chandrasekhar U, Venkatesh K, Elangovan K, Rangaswamy T (2011) Integrated use of rapid prototyping and metal plating techniques for development of micro air vehicles. IJEST 3(1):188–193 Chandrasekhar U, Venkatesh K, Elangovan K, Rangaswamy T (2011) Integrated use of rapid prototyping and metal plating techniques for development of micro air vehicles. IJEST 3(1):188–193
79.
Zurück zum Zitat Equbal A, Sood AK (2015) Investigations on metallization in FDM build ABS part using electroless deposition method. J Manuf Process 19:22–31CrossRef Equbal A, Sood AK (2015) Investigations on metallization in FDM build ABS part using electroless deposition method. J Manuf Process 19:22–31CrossRef
80.
Zurück zum Zitat Saleh N, Hopkinson N, Hague RJ, Wise S (2004) Effects of electroplating on the mechanical properties of stereolithography and laser sintered parts. Rapid Prototyp J 10(5):305–315CrossRef Saleh N, Hopkinson N, Hague RJ, Wise S (2004) Effects of electroplating on the mechanical properties of stereolithography and laser sintered parts. Rapid Prototyp J 10(5):305–315CrossRef
81.
Zurück zum Zitat Kannan S, Senthilkumaran D (2014) Investigating the influence of electroplating layer thickness on the tensile strength for fused deposition processed ABS thermoplastics. IJET 6(2):1047–1052 Kannan S, Senthilkumaran D (2014) Investigating the influence of electroplating layer thickness on the tensile strength for fused deposition processed ABS thermoplastics. IJET 6(2):1047–1052
82.
Zurück zum Zitat Lurie KL, Smith GT, Khan SA, Liao JC, Ellerbee AK (2014) Three-dimensional, distendable bladder phantom for optical coherence tomography and white light cystoscopy. J Biomed Opt 19(3):036009CrossRef Lurie KL, Smith GT, Khan SA, Liao JC, Ellerbee AK (2014) Three-dimensional, distendable bladder phantom for optical coherence tomography and white light cystoscopy. J Biomed Opt 19(3):036009CrossRef
84.
Zurück zum Zitat Weng D, Landau U (1995) Direct electroplating on nonconductors. J Electrochem Soc 142(8):2598–2604CrossRef Weng D, Landau U (1995) Direct electroplating on nonconductors. J Electrochem Soc 142(8):2598–2604CrossRef
85.
Zurück zum Zitat Krishnan KH, John S, Srinivasan K, Praveen J, Ganesan M, Kavimani P (2006) An overall aspect of electroless Ni–P depositions—a review article. Metall Mater Trans A 37(6):1917–1926CrossRef Krishnan KH, John S, Srinivasan K, Praveen J, Ganesan M, Kavimani P (2006) An overall aspect of electroless Ni–P depositions—a review article. Metall Mater Trans A 37(6):1917–1926CrossRef
86.
Zurück zum Zitat Feldstein N (1981) Dispersions for activating non-conductors for electroless plating. US Patent 4,282,271 Feldstein N (1981) Dispersions for activating non-conductors for electroless plating. US Patent 4,282,271
87.
Zurück zum Zitat Feldstein N (1982) Electroless plating. US Patent 4,321,285 Feldstein N (1982) Electroless plating. US Patent 4,321,285
89.
Zurück zum Zitat Kirman T (1972) Electroless nickel plating process for nonconductors. US Patent 3,684,572 Kirman T (1972) Electroless nickel plating process for nonconductors. US Patent 3,684,572
90.
Zurück zum Zitat Feldstein N (1976) Electroless plating process employing non-noble metal hydrous oxide catalyst. US Patent 3,993,799 Feldstein N (1976) Electroless plating process employing non-noble metal hydrous oxide catalyst. US Patent 3,993,799
91.
Zurück zum Zitat Elmore G, Davis K (1969) Mechanism of bonding electroless metal to organic substrates. J Electrochem Soc 116(10):1455–1458CrossRef Elmore G, Davis K (1969) Mechanism of bonding electroless metal to organic substrates. J Electrochem Soc 116(10):1455–1458CrossRef
92.
Zurück zum Zitat Abu-Isa IA (1973) Metal plating of polymeric surfaces. Polym-Plast Technol Eng 2(1):29–65CrossRef Abu-Isa IA (1973) Metal plating of polymeric surfaces. Polym-Plast Technol Eng 2(1):29–65CrossRef
93.
Zurück zum Zitat Metal plating of thermoplastics (1971). US Patent 3,620,804 Metal plating of thermoplastics (1971). US Patent 3,620,804
94.
Zurück zum Zitat Magallón-Cacho L, Pérez-Bueno J, Meas-Vong Y, Stremsdoerfer G, Espinoza-Beltrán F (2011) Surface modification of acrylonitrile-butadiene-styrene (ABS) with heterogeneous photocatalysis (TiO2) for the substitution of the etching stage in the electroless process. Surf Coat Technol 206(6):1410–1415CrossRef Magallón-Cacho L, Pérez-Bueno J, Meas-Vong Y, Stremsdoerfer G, Espinoza-Beltrán F (2011) Surface modification of acrylonitrile-butadiene-styrene (ABS) with heterogeneous photocatalysis (TiO2) for the substitution of the etching stage in the electroless process. Surf Coat Technol 206(6):1410–1415CrossRef
95.
Zurück zum Zitat Krulik GA (1980) Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid. US Patent 4,182,784 Krulik GA (1980) Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid. US Patent 4,182,784
96.
Zurück zum Zitat Daneshmand S, Aghanajafi C, Nadooshan AA (2010) The effect of chromium coating in RP technology for airfoil manufacturing. Sadhana 35(5):569–584CrossRef Daneshmand S, Aghanajafi C, Nadooshan AA (2010) The effect of chromium coating in RP technology for airfoil manufacturing. Sadhana 35(5):569–584CrossRef
97.
Zurück zum Zitat Gabe D (1977) Corrosion and protection of sintered metal parts. Powder Metall 20(4):227–231CrossRef Gabe D (1977) Corrosion and protection of sintered metal parts. Powder Metall 20(4):227–231CrossRef
98.
Zurück zum Zitat Conlan W, Dutkewych O (1973) Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating. US Patent 3,769,061 Conlan W, Dutkewych O (1973) Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating. US Patent 3,769,061
99.
Zurück zum Zitat Weakley-Bollin SC (2010) The effect of injection molding conditions on the near-surface rubber morphology, surface chemistry and adhesion performance of semi-crystalline and amorphous polymers. University of Michigan, Ann Arbor Weakley-Bollin SC (2010) The effect of injection molding conditions on the near-surface rubber morphology, surface chemistry and adhesion performance of semi-crystalline and amorphous polymers. University of Michigan, Ann Arbor
100.
Zurück zum Zitat Beacom SE, Wedel RG (1970) Scanning electron microscopy of plastic surfaces as related to metal deposition. J Colloid Interface Sci 34(3):375–386CrossRef Beacom SE, Wedel RG (1970) Scanning electron microscopy of plastic surfaces as related to metal deposition. J Colloid Interface Sci 34(3):375–386CrossRef
101.
Zurück zum Zitat Kanani N (2004) Electroplating: basic principles, processes and practice. Elsevier, Oxford Kanani N (2004) Electroplating: basic principles, processes and practice. Elsevier, Oxford
102.
Zurück zum Zitat Kato K (1968) Electron microscope studies on the etching of ABS mouldings for electroplating. Polymer 9:419–424CrossRef Kato K (1968) Electron microscope studies on the etching of ABS mouldings for electroplating. Polymer 9:419–424CrossRef
103.
Zurück zum Zitat Dennis JK, Such TE (1993) Nickel and chromium plating. Elsevier, AmsterdamCrossRef Dennis JK, Such TE (1993) Nickel and chromium plating. Elsevier, AmsterdamCrossRef
104.
Zurück zum Zitat Donovan LP, Timmer RJ (2002) Decorative chrome electroplate on plastics. US Patent 6,468,672 Donovan LP, Timmer RJ (2002) Decorative chrome electroplate on plastics. US Patent 6,468,672
105.
Zurück zum Zitat Hurley JL (1975) Decorative electroplates for plastics. US Patent 3,868,229 Hurley JL (1975) Decorative electroplates for plastics. US Patent 3,868,229
106.
Zurück zum Zitat Narcus H (1979) Bright electroless plating process and plated articles produced thereby. US Patent 4,169,171 Narcus H (1979) Bright electroless plating process and plated articles produced thereby. US Patent 4,169,171
107.
Zurück zum Zitat Gutzeit G, Talmey P (1958) Chemical nickel plating processes and baths therefor. US Patent 2,935,425 Gutzeit G, Talmey P (1958) Chemical nickel plating processes and baths therefor. US Patent 2,935,425
108.
Zurück zum Zitat Jones RD (2005) Decoratively finished thermoplastic product and method for manufacturing same. US Patent App. 10/649,190 Jones RD (2005) Decoratively finished thermoplastic product and method for manufacturing same. US Patent App. 10/649,190
109.
Zurück zum Zitat Metal plating of plastics (1970). US Patent 3,501,332 Metal plating of plastics (1970). US Patent 3,501,332
110.
Zurück zum Zitat Marie OJ (1966) Method of electrodepositing a corrosion resistant nickel-chromium coating and products thereof. US Patent 3,282,810 Marie OJ (1966) Method of electrodepositing a corrosion resistant nickel-chromium coating and products thereof. US Patent 3,282,810
111.
Zurück zum Zitat Omura Y (1997) Process for catalyzation in electroless plating. US Patent 5,660,883 Omura Y (1997) Process for catalyzation in electroless plating. US Patent 5,660,883
112.
Zurück zum Zitat Odekerken JM (1972) Process for coating an object with a bright nickel/chromium coatin. US Patent 3,644,183 Odekerken JM (1972) Process for coating an object with a bright nickel/chromium coatin. US Patent 3,644,183
113.
Zurück zum Zitat Eileen M (1972) Process for electroless plating of abs resins. US Patent 3,689,303 Eileen M (1972) Process for electroless plating of abs resins. US Patent 3,689,303
114.
Zurück zum Zitat Paul T, Crehan WJ (1953) Process of chemical nickel plating. US Patent 2,658,839 Paul T, Crehan WJ (1953) Process of chemical nickel plating. US Patent 2,658,839
115.
Zurück zum Zitat Patel GN, Bolikal D, Patel HH (1992) Chromic acid free etching of polymers for electroless plating. US Patent 07/488,256 Patel GN, Bolikal D, Patel HH (1992) Chromic acid free etching of polymers for electroless plating. US Patent 07/488,256
116.
Zurück zum Zitat Brown SD, Ottavio ED, Kuzmik JJ, Grunwald JJ (1972) Method of treating plastic substrates and process for plating thereon. US Patent 3682786 Brown SD, Ottavio ED, Kuzmik JJ, Grunwald JJ (1972) Method of treating plastic substrates and process for plating thereon. US Patent 3682786
117.
Zurück zum Zitat Kuzmik J (1974) Preparation of plastic substrates for electroless plating and solutions therefor. US Patent 3,790,400 Kuzmik J (1974) Preparation of plastic substrates for electroless plating and solutions therefor. US Patent 3,790,400
118.
Zurück zum Zitat Roubal J, Korpiun J (1977) Pretreatment of plastic materials for metal plating. US Patent 06/701,585 Roubal J, Korpiun J (1977) Pretreatment of plastic materials for metal plating. US Patent 06/701,585
119.
Zurück zum Zitat Amelio WJ, Jung DY, Markovich V, Sambucetti CJ (1986) Process for manufacturing a concentrate of a palladium-tin colloidal catalyst. US Patent 09/831,008 Amelio WJ, Jung DY, Markovich V, Sambucetti CJ (1986) Process for manufacturing a concentrate of a palladium-tin colloidal catalyst. US Patent 09/831,008
120.
Zurück zum Zitat Naruskevicius L, Rozovskis G, Vinkevicius J, Baranauskas M, Mobius A, Pies P (2004) Etching plastic surface under mild conditions, treating with solution containing cobalt, silver, tin, and/or lead salts having ph from about 7.5 to about 12.5, treating with sulfide solution, metallizing. US Patent US 6712948 B1 Naruskevicius L, Rozovskis G, Vinkevicius J, Baranauskas M, Mobius A, Pies P (2004) Etching plastic surface under mild conditions, treating with solution containing cobalt, silver, tin, and/or lead salts having ph from about 7.5 to about 12.5, treating with sulfide solution, metallizing. US Patent US 6712948 B1
121.
Zurück zum Zitat De De Minjer CH, vd Boom PFJ (1973) The nucleation with SnCl2–PdCl2 solutions of glass before electroless plating. J Electrochem Soc 120(12):1644–1650CrossRef De De Minjer CH, vd Boom PFJ (1973) The nucleation with SnCl2–PdCl2 solutions of glass before electroless plating. J Electrochem Soc 120(12):1644–1650CrossRef
122.
Zurück zum Zitat Lindsay JH, La Sala J, Ghorashi HM (1983) Etching and bonding oxygen to acrylonitrile-butadiene-styrene terpolymer or polyphenylene ethers, vacuum deposition, followed by electrodeposition of metal films. US Patent 4,395,313 Lindsay JH, La Sala J, Ghorashi HM (1983) Etching and bonding oxygen to acrylonitrile-butadiene-styrene terpolymer or polyphenylene ethers, vacuum deposition, followed by electrodeposition of metal films. US Patent 4,395,313
123.
Zurück zum Zitat Cohen R, Meek R (1976) The chemistry of palladium–tin colloid sensitizing processes. J Colloid Interface Sci 55(1):156–162CrossRef Cohen R, Meek R (1976) The chemistry of palladium–tin colloid sensitizing processes. J Colloid Interface Sci 55(1):156–162CrossRef
124.
Zurück zum Zitat Lindsay DJ, Feldstein N (1989) Activators for colloidal catalysts in electroless plating processes. US Patent 4,820,547 Lindsay DJ, Feldstein N (1989) Activators for colloidal catalysts in electroless plating processes. US Patent 4,820,547
125.
Zurück zum Zitat Comparison of sealing methods for FDM materials (2011). Stratasys Comparison of sealing methods for FDM materials (2011). Stratasys
126.
Zurück zum Zitat McCarthy DL, Williams CB (2012) Creating complex hollow metal geometries using additive manufacturing and electroforming. In: International Solid Freeform Fabrication Symposium, pp 108–120 McCarthy DL, Williams CB (2012) Creating complex hollow metal geometries using additive manufacturing and electroforming. In: International Solid Freeform Fabrication Symposium, pp 108–120
127.
Zurück zum Zitat Wang Y, Bian C, Jing X (2013) Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process. Appl Surf Sci 271:303–310CrossRef Wang Y, Bian C, Jing X (2013) Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process. Appl Surf Sci 271:303–310CrossRef
128.
Zurück zum Zitat Wang G, Li N, Li D (2007) Effect of Pd ions in the chemical etching solution. J Univ Sci Technol Beijing Miner Metall Mater 14(3):286–289 Wang G, Li N, Li D (2007) Effect of Pd ions in the chemical etching solution. J Univ Sci Technol Beijing Miner Metall Mater 14(3):286–289
129.
Zurück zum Zitat Inagaki N, Kimura H (2009) Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst. J Appl Polym Sci 111(2):1034–1044 Inagaki N, Kimura H (2009) Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst. J Appl Polym Sci 111(2):1034–1044
130.
Zurück zum Zitat Arai S, Kanazawa T (2014) Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin. Surf Coat Technol 254:224–229CrossRef Arai S, Kanazawa T (2014) Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin. Surf Coat Technol 254:224–229CrossRef
131.
Zurück zum Zitat Li D, Yang C-L (2009) Acidic electroless copper deposition on aluminum-seeded ABS plastics. Surf Coat Technol 203(23):3559–3568CrossRef Li D, Yang C-L (2009) Acidic electroless copper deposition on aluminum-seeded ABS plastics. Surf Coat Technol 203(23):3559–3568CrossRef
132.
Zurück zum Zitat Helmut K, Eugen M-S (1972) Process for the pretreatment of plastic for the purpose of adhesive metallization. US Patent 3,702,285 Helmut K, Eugen M-S (1972) Process for the pretreatment of plastic for the purpose of adhesive metallization. US Patent 3,702,285
133.
Zurück zum Zitat Isa A, Vincent W (1974) Plating pre-treatment in acrylonitrile butadiene styrene. US Patent 3,847,648 Isa A, Vincent W (1974) Plating pre-treatment in acrylonitrile butadiene styrene. US Patent 3,847,648
134.
Zurück zum Zitat Kang DH, Choi JC, Choi JM, Kim TW (2010) An environment-friendly surface pretreatment of ABS plastic for electroless plating using chemical foaming agents. Trans Electr Electron Mater 11(4):174–177CrossRef Kang DH, Choi JC, Choi JM, Kim TW (2010) An environment-friendly surface pretreatment of ABS plastic for electroless plating using chemical foaming agents. Trans Electr Electron Mater 11(4):174–177CrossRef
135.
Zurück zum Zitat Zhao W, Ma Q, Li L, Li X, Wang Z (2014) Surface modification of ABS by photocatalytic treatment for electroless copper plating. J Adhes Sci Technol 28(5):499–511CrossRef Zhao W, Ma Q, Li L, Li X, Wang Z (2014) Surface modification of ABS by photocatalytic treatment for electroless copper plating. J Adhes Sci Technol 28(5):499–511CrossRef
136.
Zurück zum Zitat Kim GG, Kang JA, Kim SJ, Kim SJ, Shin SH (2007) Improved adhesion to ABS plastics by a photocatalytic reaction. In: Materials science forum. Trans Tech Publication, Dürnten, pp 75–78 Kim GG, Kang JA, Kim SJ, Kim SJ, Shin SH (2007) Improved adhesion to ABS plastics by a photocatalytic reaction. In: Materials science forum. Trans Tech Publication, Dürnten, pp 75–78
137.
Zurück zum Zitat European Parliament and the Council, 2002/95/EC, 2003 European Parliament and the Council, 2002/95/EC, 2003
138.
Zurück zum Zitat WHO regional publications (2000), Air quality guidelines for Europe. 2nd edn. Copenhagen WHO regional publications (2000), Air quality guidelines for Europe. 2nd edn. Copenhagen
139.
Zurück zum Zitat Bazzaoui M, Martins J, Bazzaoui E, Albourine A, Wang R, Hong P-D (2013) A simple method for acrylonitrile butadiene styrene metallization. Surf Coat Technol 224:71–76CrossRef Bazzaoui M, Martins J, Bazzaoui E, Albourine A, Wang R, Hong P-D (2013) A simple method for acrylonitrile butadiene styrene metallization. Surf Coat Technol 224:71–76CrossRef
140.
Zurück zum Zitat Parkinson R, Hart T, Electroplating on plasticts. NiDi Technical Series, Nickel Development Institute Parkinson R, Hart T, Electroplating on plasticts. NiDi Technical Series, Nickel Development Institute
141.
Zurück zum Zitat Li Z, Li N, Yin L, He Y, Wang Z (2009) An environment-friendly surface pretreatment of ABS resin prior to electroless plating. Electrochem Solid-State Lett 12(12):D92–D95CrossRef Li Z, Li N, Yin L, He Y, Wang Z (2009) An environment-friendly surface pretreatment of ABS resin prior to electroless plating. Electrochem Solid-State Lett 12(12):D92–D95CrossRef
142.
Zurück zum Zitat European Parliament and the Council, 2005/90/EC, 2006 European Parliament and the Council, 2005/90/EC, 2006
143.
Zurück zum Zitat Yang Z, He Y, Li Z, Li N, Wang Z (2011) Adhesion improvement of ABS resin to electroless copper by H2SO4–MnO2 colloid with ultrasound-assisted treatment. J Adhes Sci Technol 25(11):1211–1221CrossRef Yang Z, He Y, Li Z, Li N, Wang Z (2011) Adhesion improvement of ABS resin to electroless copper by H2SO4–MnO2 colloid with ultrasound-assisted treatment. J Adhes Sci Technol 25(11):1211–1221CrossRef
144.
Zurück zum Zitat Ma Q, Zhao W, Li X, Li L, Wang Z (2013) Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement. Int J Adhes Adhes 44:243–249CrossRef Ma Q, Zhao W, Li X, Li L, Wang Z (2013) Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement. Int J Adhes Adhes 44:243–249CrossRef
145.
Zurück zum Zitat Brandes M (2007) Advances in methods for plating on plastics tout advantages over conventional technologies: alternative plating procedures negate the need for chromic sulfuric acid, resulting in a more environmentally friendly process for electroplaters. Met Finish 105(3):35–40CrossRef Brandes M (2007) Advances in methods for plating on plastics tout advantages over conventional technologies: alternative plating procedures negate the need for chromic sulfuric acid, resulting in a more environmentally friendly process for electroplaters. Met Finish 105(3):35–40CrossRef
146.
Zurück zum Zitat Brocherieux A, Dessaux O, Goudmand P, Gengembre L, Grimblot J, Brunel M, Lazzaroni R (1995) Characterization of nickel films deposited by cold remote nitrogen plasma on acrylonitrile–butadiene–styrene copolymer App. Surf Sci 90:47–58CrossRef Brocherieux A, Dessaux O, Goudmand P, Gengembre L, Grimblot J, Brunel M, Lazzaroni R (1995) Characterization of nickel films deposited by cold remote nitrogen plasma on acrylonitrile–butadiene–styrene copolymer App. Surf Sci 90:47–58CrossRef
147.
Zurück zum Zitat Tsuru Y, Mochinaga K, Ooyagi Y, Foulkes FR (2003) Application of vapor-deposited carbon and zinc as a substitute for palladium catalyst in the electroless plating of nickel. Surf Coat Technol 169:116–119CrossRef Tsuru Y, Mochinaga K, Ooyagi Y, Foulkes FR (2003) Application of vapor-deposited carbon and zinc as a substitute for palladium catalyst in the electroless plating of nickel. Surf Coat Technol 169:116–119CrossRef
148.
Zurück zum Zitat Tang X, Bi C, Han C, Zhang B (2009) A new palladium-free surface activation process for Ni electroless plating on ABS plastic. Mater Lett 63(11):840–842CrossRef Tang X, Bi C, Han C, Zhang B (2009) A new palladium-free surface activation process for Ni electroless plating on ABS plastic. Mater Lett 63(11):840–842CrossRef
149.
Zurück zum Zitat Yen P-C (1995) Improved ABS plastic activating treatment for electroless copper plating. Polymer 36(17):3399–3400CrossRef Yen P-C (1995) Improved ABS plastic activating treatment for electroless copper plating. Polymer 36(17):3399–3400CrossRef
150.
Zurück zum Zitat Ono S, Naitoh K, Osaka T (1999) Initial propagation stage of direct copper plating on non-conducting substrates. Electrochim Acta 44(21):3697–3705CrossRef Ono S, Naitoh K, Osaka T (1999) Initial propagation stage of direct copper plating on non-conducting substrates. Electrochim Acta 44(21):3697–3705CrossRef
151.
Zurück zum Zitat Gui-Xiang W, Ning L, Hui-Li H, Yuan-Chun Y (2006) Process of direct copper plating on ABS plastics. Appl Surf Sci 253(2):480–484CrossRef Gui-Xiang W, Ning L, Hui-Li H, Yuan-Chun Y (2006) Process of direct copper plating on ABS plastics. Appl Surf Sci 253(2):480–484CrossRef
Metadaten
Titel
Plating on acrylonitrile–butadiene–styrene (ABS) plastic: a review
verfasst von
Sharon Olivera
Handanahally Basavarajaiah Muralidhara
Krishna Venkatesh
Keshavanarayana Gopalakrishna
Chinnaganahalli Suryaprakash Vivek
Publikationsdatum
04.01.2016
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 8/2016
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-015-9668-7

Weitere Artikel der Ausgabe 8/2016

Journal of Materials Science 8/2016 Zur Ausgabe

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.