Deformation Behavior and Microstructure Evolution of the Cu-2Ni-0.5Si-0.15Ag Alloy During Hot Compression

Hot deformation behavior of the Cu-2Ni-0.5Si-0.15Ag alloy was investigated by hot compression tests using the Gleeble-1500D thermo-simulator in the 873 K to 1073 K (600 °C to 800 °C) temperatures range with the 0.01 to 5 s⁻¹ strain rate. The flow stress strongly depends on the deformation parameters, including temperature and strain rate. The flow stress decreases with the deformation temperature and increases with the strain rate. The constitutive relationship between the peak stress, the strain rate, and the deformation temperature can be described by the Zener–Hollomon Z parameter in the hyperbolic sine function with the hot deformation activation energy of 316 kJ/mol. The dynamic recrystallization (DRX) is one of the important softening mechanisms of the Cu-2Ni-0.5Si-0.15Ag alloy during hot deformation. The DRX behavior of the Cu-2Ni-0.5Si-0.15Ag alloy is strongly affected by the Z parameter. Lower Z parameter leads to more adequate DRX proceeding.