Opening Ceremony in Shanghai
Assembling chips, soldering components and having them tested - all this is now possible for customers of Heraeus Electronics in Shanghai. In the newly opened Innovation Center, the company can now develop and test its own material systems.
Chips can be precisely assembled from wafers at 250 μm and metal-ceramic substrates can be pre-applied with solder paste. In addition, surface-mounted components (SMD) can be subjected to the reflow process in the soldering oven. Ten developers are involved in simulation, design and prototype construction, testing and qualification of material systems. Customers from the power electronics and semiconductor industries can rely on 18 highly developed machines. The area covers 400 m2 and is to be further expanded.
Modern furnaces and long-term tests
The innovation center in Shanghai houses various modern machines such as a vacuum brazing furnace with two chambers, which can also be equipped with nitrogen, and a wire bonder for thin and thick aluminum-copper wires and strips. There are also test stands for long-term tests, where material systems are subjected to the highest demands for weeks or even months. Examples include high- and low-temperature storage, temperature changes in the two-chamber system and power cycling, in which heat dissipation can be tested.
In the sintering furnace, chips can be bonded with subtrates at temperatures of up to 400 °C. The chips can also be bonded with subtrates at temperatures of up to 400 °C. The Heraeus mAgic sinter paste, which can be processed in the sintering furnace with hydrogen and in the absence of oxygen, produces a reliable and adhesive bond and the copper surface of the metal-ceramic substrate does not oxidize. For example, chips can be bonded to copper using Heraeus sinter pastes and solder pastes.
No limits for complexity
Optical microscopy and automatic microscopy make it possible to detect even the smallest lint, scratches and discolorations on surfaces. This is essential, especially during sintering, to detect holes and flaws. In the shear test, chips and bond wires can be used to check how much force is required before the respective component is detached - a way of clearly quantifying how good a connection is in terms of quality and durability.