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Erschienen in: Journal of Materials Science: Materials in Electronics 12/2012

01.12.2012

Mechanical characterization of glass–ceramics substrate with embedded microstructure

verfasst von: Eszter Horváth, Gábor Hénap, Ádám Török, Gábor Harsányi

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 12/2012

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Abstract

One of the biggest challenge in the microfluidic channel fabrication in glass–ceramics or so called low temperature co-fired ceramics (LTCC) is the elimination of channel deformation during lamination. In this paper the expected deformation of the substrate and the sacrificial layer (starch powder and 3D printed UV polymerized material) during the lamination process of microfluidic structure fabrication is described. The choice of sacrificial volume material (SVM) plays an important role in channel deformation. Two types of SVM were investigated considering the width of the channel and the applicability. Uniaxial compression and Jenike shear test was used to obtain the mechanical parameters of starch SVM. To determine the stress–strain characteristics of LTCC uniaxial compression experiment was conducted. The shape of the laminated LTCC containing embedded channel was modeled by finite element method using the mechanical parameters obtained by the measurements. A design rule is given considering the channel width and the choice of SVM based on the simulation results.

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Literatur
1.
Zurück zum Zitat W. Smetana, B. Balluch, G. Stangl, E. Gaubitzer, M. Edetsberger, G. Köhler, A multi-sensor biological monitoring module built up in LTCC-technology. Microelectron. Eng. 84, 1240–1243 (2007)CrossRef W. Smetana, B. Balluch, G. Stangl, E. Gaubitzer, M. Edetsberger, G. Köhler, A multi-sensor biological monitoring module built up in LTCC-technology. Microelectron. Eng. 84, 1240–1243 (2007)CrossRef
2.
Zurück zum Zitat W. Jones Kinzy, L. Yanging, W. Peng, Z. Marc, Chemical structural and mechanical properties of LTCC tapes. Int. J. Microcircuits Electron. Packag. 23(4), 469–473 (2000) W. Jones Kinzy, L. Yanging, W. Peng, Z. Marc, Chemical structural and mechanical properties of LTCC tapes. Int. J. Microcircuits Electron. Packag. 23(4), 469–473 (2000)
3.
Zurück zum Zitat K. Malecha, L.J. Golonka, Microchannel fabrication process in LTCC ceramics. Microelectron. Reliab. 48, 866–871 (2008)CrossRef K. Malecha, L.J. Golonka, Microchannel fabrication process in LTCC ceramics. Microelectron. Reliab. 48, 866–871 (2008)CrossRef
4.
Zurück zum Zitat H. Birol, T. Maeder, C. Jacq, S. Straessler, P. Ryser, Fabrication of low-temperature co-fired ceramics micro-fluidic devices using sacrificial carbon layers. Int. J. Appl. Ceram. Technol. 2, 364 (2005)CrossRef H. Birol, T. Maeder, C. Jacq, S. Straessler, P. Ryser, Fabrication of low-temperature co-fired ceramics micro-fluidic devices using sacrificial carbon layers. Int. J. Appl. Ceram. Technol. 2, 364 (2005)CrossRef
5.
Zurück zum Zitat H. Birol, T. Maeder, P. Ryser, Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC). Sensors Actuators A 130–131, 560–567 (2006)CrossRef H. Birol, T. Maeder, P. Ryser, Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC). Sensors Actuators A 130–131, 560–567 (2006)CrossRef
6.
Zurück zum Zitat M.R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, J.J. Santiago-Aviles, Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST). Sensors Actuat. A Phys. 89, 222–241 (2001)CrossRef M.R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, J.J. Santiago-Aviles, Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST). Sensors Actuat. A Phys. 89, 222–241 (2001)CrossRef
7.
Zurück zum Zitat W. Smetana, B. Balluch, G. Stangl, S. Lüftl, S. Seidler, Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-technology. Microelectron. Reliab. 49, 592–599 (2009)CrossRef W. Smetana, B. Balluch, G. Stangl, S. Lüftl, S. Seidler, Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-technology. Microelectron. Reliab. 49, 592–599 (2009)CrossRef
8.
Zurück zum Zitat L.E. Khoong, Y.M. Tan, Y.C. Lam, Study of deformation and porosity evolution of low temperature co-fired ceramic for embedded structures fabrication. J. Eur. Ceram. Soc. 29(13), 2737–2745 (2009)CrossRef L.E. Khoong, Y.M. Tan, Y.C. Lam, Study of deformation and porosity evolution of low temperature co-fired ceramic for embedded structures fabrication. J. Eur. Ceram. Soc. 29(13), 2737–2745 (2009)CrossRef
9.
Zurück zum Zitat K. Malecha, L.J. Golonka, Three-dimensional structuration of zero-shrinkage LTCC ceramics for microfluidic applications. Microelectron. Reliab. 49, 585–591 (2009)CrossRef K. Malecha, L.J. Golonka, Three-dimensional structuration of zero-shrinkage LTCC ceramics for microfluidic applications. Microelectron. Reliab. 49, 585–591 (2009)CrossRef
10.
Zurück zum Zitat D. Jurkow, H. Roguszczak, L. Golonka Parametric, Cold chemical lamination of ceramic green tapes. J. Eur. Ceram. Soc. 29(2009), 703–709 (2009)CrossRef D. Jurkow, H. Roguszczak, L. Golonka Parametric, Cold chemical lamination of ceramic green tapes. J. Eur. Ceram. Soc. 29(2009), 703–709 (2009)CrossRef
11.
Zurück zum Zitat H. Bartsch de Torres, C. Rensch, M. Fischer, A. Schober, M. Hoffmann, J. Müller, Thick film flow sensor for biological microsystems. Sensors Actuators A 160, 109–115 (2010)CrossRef H. Bartsch de Torres, C. Rensch, M. Fischer, A. Schober, M. Hoffmann, J. Müller, Thick film flow sensor for biological microsystems. Sensors Actuators A 160, 109–115 (2010)CrossRef
12.
Zurück zum Zitat P. Espinoza-Vallejos, J.H. Zhong, M.R. Gongora-Rubio, L. Sola-Laguna, J.J. Santiago-Aviles, Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures. Mater. Res. Soc. Symp. Proc. 518(2), 3–79 (1998) P. Espinoza-Vallejos, J.H. Zhong, M.R. Gongora-Rubio, L. Sola-Laguna, J.J. Santiago-Aviles, Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures. Mater. Res. Soc. Symp. Proc. 518(2), 3–79 (1998)
13.
Zurück zum Zitat J. Selejdak, R. Stasiak-Betlejewska, Determinants of quality of printing on foil. J. Machine Eng. 7(2), 111–117 (2007) J. Selejdak, R. Stasiak-Betlejewska, Determinants of quality of printing on foil. J. Machine Eng. 7(2), 111–117 (2007)
14.
Zurück zum Zitat I. Dyakov, O. Prentkovskis, Optimization problems in designing automobiles. Transport 23(4), 316–322 (2008)CrossRef I. Dyakov, O. Prentkovskis, Optimization problems in designing automobiles. Transport 23(4), 316–322 (2008)CrossRef
15.
Zurück zum Zitat D.C. Drucker, W. Prager, Soil mechanics and plastic analysis for limit design. Q. Appl. Math. 10(2), 157–165 (1952) D.C. Drucker, W. Prager, Soil mechanics and plastic analysis for limit design. Q. Appl. Math. 10(2), 157–165 (1952)
16.
Zurück zum Zitat P.R. Laity, L. Han, J. Elliott, R.E. Cameron, Variations in compaction behaviour for tablets of different size and shape, revealed by small-angle X-ray scattering. J. Pharm. Sci. 99(10), 4380–4389 (2010) P.R. Laity, L. Han, J. Elliott, R.E. Cameron, Variations in compaction behaviour for tablets of different size and shape, revealed by small-angle X-ray scattering. J. Pharm. Sci. 99(10), 4380–4389 (2010)
17.
Zurück zum Zitat E.A. de Souza Neto, D. Peric, D.R.J. Owen, Computational Methods for Plasticity, Theory and Applications (Wiley, London, 2008). 2008CrossRef E.A. de Souza Neto, D. Peric, D.R.J. Owen, Computational Methods for Plasticity, Theory and Applications (Wiley, London, 2008). 2008CrossRef
18.
Zurück zum Zitat R.G. Holdich, Fundamentals of Particle Technology (Midland Information Technology and Publishing, Loughborough, 2002) R.G. Holdich, Fundamentals of Particle Technology (Midland Information Technology and Publishing, Loughborough, 2002)
20.
Zurück zum Zitat I. Fridtjov, Continuum Mechanics (Springer, Berlin, 2008) I. Fridtjov, Continuum Mechanics (Springer, Berlin, 2008)
Metadaten
Titel
Mechanical characterization of glass–ceramics substrate with embedded microstructure
verfasst von
Eszter Horváth
Gábor Hénap
Ádám Török
Gábor Harsányi
Publikationsdatum
01.12.2012
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 12/2012
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-012-0718-5

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