Ausgabe 1/1999
Inhalt (23 Artikel)
Effect of cold rolling on the precipitation behavior of δ phase in INCONEL 718
W. C. Liu, M. Yao, Z. L. Chen
Precipitation of an intermetallic phase with Pt2Mo-type structure in alloy 625
M. Sundararaman, Lalit Kumar, G. Eswara Prasad, P. Mukhopadhyay, S. Banerjee
Part I-the effects of pre-dissolved hydrogen on cleavage and grain boundary fracture initiation in metastable beta Ti-3Al-8V-6Cr-4Mo-4Zr
Michelle A. Gaudett, John R. Scully
Analysis and prevention of cracking phenomenon occurring during cold forging of two AISI 1010 steel pulleys
Dong-Kuk Kim, Suk Young Kang, Sunghak Lee, Kyung Jong Lee
The effects of grain-refining precipitates on the development of toughness in 4340 steel
M. J. Leap, J. C. Wingert
Modeling high-temperature stress-strain behavior of cast aluminum alloys
Tracy J. Smith, Huseyin Sehitoglu, Eric Fleury, Hans J. Maier, John Allison
Microstructural zones in the primary solidification structure of weldment of 9Cr-1Mo steel
M. Vijayalakshmi, S. Saroja, V. Thomas Paul, R. Mythili, V. S. Raghunathan
Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications
S. K. Datta, S. N. Tewari, J. E. Gatica, W. Shih, L. Bentsen
The effect of shot particles on the fatigue of Kaowool fiber-reinforced 339 aluminum
William J. Baxter, A. Alostaz, I. Jasiuk
Thermal expansion of morphologically textured short-fiber composites
Martin L. Dunn, Hassel Ledbetter, Zhuang Li
Synthesis of one-dimensional nanostructures—β-SiC nanorods with and without amorphous SiO2 wrapping layers
G. W. Meng, L. D. Zhang, Y. Qin, C. M. Mo, S. Y. Zhang, H. J. Li, S. P. Feng
Observation of fatigue damage process in SiC fiber-reinforced Ti-15-3 composite at high temperature
Y. Tanaka, C. Masuda, Y. -F. Liu, Y. Kagawa, S. Q. Guo
Communications
Correlation of microstructure and microfracture mechanism of five work rolls
Gwihwan Byun, Seungchan Oh, Chang Gil Lee, Sunghak Lee
Communications
Wear behavior of in situ Al-based composites containing TiB2, Al2O3, and Al3Ti particles
S. Q. Wu, H. G. Zhu, S. C. Tjong