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Erschienen in:
01.02.2014
Microstructure and thermo-physical properties of a SiC/pure-Al composite for electronic packaging
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2014
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Abstract
A preform comprised of 70 vol% SiC particles was infiltrated with commercially pure aluminium to produce the electronic packaging composite. A dense and uniform microstructure was found in the composite. The incorporation of high volume fraction of SiC particles led to a reduction of coefficient of thermal expansion while maintaining a relatively high thermal conductivity. The correlation between the microstructure features and thermo-physical properties was discussed. The performance of the electronic assemblies using the composite baseplate was evaluated. After 80 thermal shocks (–55 to 150 °C), the thermal resistance kept almost constant, demonstrating the potential application of this composite in the electronic packaging.