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Journal of Materials Science
Erschienen in: Journal of Materials Science 4/2014

01.02.2014

Modeling the growth kinetics of a multi-component stoichiometric compound

verfasst von: Haifeng Wang, Feng Liu, D. M. Herlach

Erschienen in: Journal of Materials Science | Ausgabe 4/2014

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Abstract

The maximal entropy production principle was applied to model the growth kinetics of a multi-component stoichiometric compound. Compared with the solid-solution phase and the non-stoichiometric compound, the dissipation by the trans-interface diffusion makes the interface slow down by decreasing the effective interface mobility and does not result in solute trapping or disorder trapping. An application to the crystallization of a CuZr stoichiometric compound shows that the transition from the thermodynamic-controlled to the kinetic-controlled growth can be predicted.
Vorheriger Artikel Electromagnetic interference shielding effectiveness of SiCf/SiC composites with PIP–SiC interphase after thermal oxidation in air
Nächster Artikel Investigation of the effect of addition of calcium stearate on the properties of low-density polyethylene/poly(ε-caprolactone) blends

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Fußnoten
1
For the solid-solution phase, \( \Updelta g \) can be divided into the driving free energy for the interface migration \( \Updelta g_{\text{C}} \) and the trans-interface diffusion \( \Updelta g_{\text{D}} \) by moving the tangent of the solid curve at \( C_{\text{S}} \) to \( C_{\text{L}}^{ *} \) in the liquid curve [22]; please see the two parallel dotted lines in Fig. 1.
 
2
The driving free energy for each dissipation process cannot be self-derived by the MEPP for the nonlinear thermodynamics and needs to be prescribed by the TEP or the molar Gibbs energy diagram [34].
 
3
The Gibbs free energy as a function of the concentration follows the parabola function.
 
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Metadaten
Titel
Modeling the growth kinetics of a multi-component stoichiometric compound
verfasst von
Haifeng Wang
Feng Liu
D. M. Herlach
Publikationsdatum
01.02.2014
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 4/2014
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-013-7835-2

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