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Polymer Science, Series D
Erschienen in: Polymer Science, Series D 3/2023

01.09.2023

Modern Phenolic Adhesives for Aviation and Engineering. Part 1. The Effect of Modifying Additives

verfasst von: D. A. Aronovich, A. P. Petrova

Erschienen in: Polymer Science, Series D | Ausgabe 3/2023

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Abstract

Phenolic adhesives used in modern engineering industries, including aircraft and rocket manufacturing, are reviewed. Ways to modify adhesives to achieve high performance characteristics are discussed.
Vorheriger Artikel Technological and Performance Characteristics of an Epoxy Binder Treated by Prepreg Technology with a Hardening Temperature below 140°C
Nächster Artikel Use of Lactam-Containing Plastisols from Halogenated Polymers for Improving the Strength of Adhesion between an Ethylene–Propylene Elastomer Composite and a Metal

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Literatur
1.
Global Phenolic Resins Market Size Report, 2022–2030. http://​www.​polarismarketres​earch.​com/​industry-analysis/​phenolic-resin-market.​
2.
L. Pilato, Phenolic Resins: A Century of Progress (Springer, Berlin, 2010).CrossRef
3.
A. Gardziella, L. Pilato, and A. Knop, Phenolic resins: Chemistry, Applications, Standardization, Safety and Ecology (Springer, Berlin, 2000).CrossRef
4.
A. P. Petrova and G. V. Malysheva, Adhesive, Adhesive Binder, and Adhesive Prepregs: Tutorial (VIAM, Moscow, 2017) [in Russian].
5.
A. Pizzi and K. L. Mittal, (Eds.). “Phenolic Resin Adhesives,” Chap. 8, in Handbook of Adhesive Technology, 3rd ed. (Taylor and Francis, New York, 2018), pp. 223–261.
6.
K. Hirano and M. Asami, “Phenolic resins–100 years of progress and their future,” React. Funct. Polym. 73, 256—269 (2013).CrossRef
7.
M. N. Amiraslanova, “Paint and adhesive compositions based on phenolic oligomers,” Plast. Massy, Nos. 11—12, 51—54 (2014).
8.
9.
L. A. Pilato, J. H. Koo, G. A. Wissler, and S. Lao, “A review–phenolic and related resins and their nanomodification into phenolic resin FRP systems,” J. Adv. Mater 40, 5–16 (2008).
10.
M. Asima, N. Saba, M. Jawaid, et al., “A review on phenolic resin and its composites,” Curr. Anal. Chem. 14, 185–197 (2018).CrossRef
11.
A. P. Alieva, “Composite materials based on phenol-formaldehyde resins,” Prom. Proizvod. Ispol’z. Elastomerov, No. 1, 34—43 (2021).
12.
A. P. Alieva, “Prospects for obtaining phenol-formaldehyde resins,” Plast. Massy Nos. 9—10, 22—26 (2021).CrossRef
13.
Three Bond News No. 36 (1991). https://​threebond-europe.​com/​wp-content/​uploads/​technical-news-pdf/​tech36.​pdf.​
14.
P. Sasidharan Achary and R. Ramaswamy, “Modification of a nitrile-phenolic bonding agent by addition of an interfacial agent: Effect on the practical adhesion between nitrile rubber and metal,” J. Adhes. Sci. Technol. 3, 587–594 (1989).CrossRef
15.
P. Sasidharan Achary, C. Gouri, and R. Ramaswamy, “Reactive bonding of natural rubber to metal by a nitrile-phenolic adhesive,” J. Appl. Polym. Sci. 81, 2597–2608 (2001).CrossRef
16.
3M™ Scotch-Weld™ Structural Adhesive Film AF30. https://​multimedia.​3m.​com/​mws/​media/​241232O/​3mtm-scotch-weldtm-structural-adhesive-film-af30.​ pdf.
17.
P. Santhana Gopala Krishnan, N. Venkatesan, and K. Adhinarayana, “Effect of phenolic resin structure on the bonding properties of nitrile rubber-based adhesives,” J. Adhes. Sci. Technol. 18, 1483–1495 (2004).CrossRef
18.
H. Maa, G. Wei, X. Zhang, et al., “Effect of elastomeric nanoparticles on properties of phenolic resin,” Polym. 46, 10568–10573 (2005).CrossRef
19.
20.
Adhesives based on phenol-formaldehyde resins modified with rubbers (phenol rubber adhesives). http://​kraska.​biz/​sinteticheskie-klei/​klei-na-osnove-fenoloformaldegi​dnyx-smol-modificirovannyx​-kauchukami-fenolokauchukovy​e-klei/​.​
21.
A. P. Petrova, N. F. Lukina, L. A. Dement’eva, and L. I. Anikhovskaya, “Film structural adhesives,” Polym. Sci., Ser. D 8, 138–143 (2015).
22.
V. N. Kirillov, V. A. Ufimov, A. K. Shvedkova, and E. V. Nikolaev, “Study of the influence of climatic factors and mechanical loading on the structure and mechanical properties of PCM,” Aviats. Mater. Tekhnol., No. 4, 41–45 (2011).
23.
L. A. Varghese and E. T. Thachil, “Studies on the adhesive properties of neoprene-phenolic blends,” J. Adhes. Sci. Technol. 18, 181–193 (2004).CrossRef
24.
L. A. Varghese and E. T. Thachil, “Performance of neoprene-phenolic adhesives on different substrates,” J. Adhes. Sci. Technol. 20, 1625–1635 (2006).CrossRef
25.
D. Zheleva, “Mechanisms of interaction between the components in adhesive compositions based on chloroprene rubber,” J. Chem. Technol. Metall. 48, 535–542 (2013).
26.
I. N. Ismail, Z. A. M. Ishak, M. F. Jaafar, et al., “Thermomechanical properties of toughened phenolic resol resin,” Solid State Sci. Technol. 17, 155–165 (2009).
27.
J. A. Bishopp, “The history of Redux(R) and the Redux bonding process,” Int. J. Adhes. Adhes. 17, 287–301 (1997).CrossRef
28.
A. Higgins, “Adhesive bonding of aircraft structures,” Int. J. Adhes. Adhes. 20, 367—376 (2000).CrossRef
29.
Redux (adhesive). https://​wikizero.​com/​en/​Redux_​ (adhesive).
30.
S. Abrahami, T. Hauffman, J. de Kok, et al., “Adhesive bonding and corrosion performance investigated as a function of auminum oide chemistry and adhesives,” Corrosion: J. Sci. Eng. 73, 903–914 (2017).CrossRef
31.
A. Kwakernaak, J. Hofstede, J. Poulis, and R. Benedictus, “Improvements in Bonding Metals for Aerospace and Other Applications,” in Welding and Joining of Aerospace Materials (Woodhead Publ., Cambridge, 2012), pp. 235–287.
32.
S. D. Sinyakov, O. B. Zastrogina, and B. F. Pavlyuk. “Compositions based on phenol-formaldehyde resins modified with polyvinyl acetals (review),” Novosti Materialoved. Nauka Tekh., Nos. 1—2, 56—67 (2018).
33.
O. V. Shuklina and N. F. Lukina, “Properties of the new heat-resistant adhesive VS-10T-U,” Klei. Germetiki. Tekhnol. No. 5, 8—9 (2012).
34.
N. F. Lukina, A. P. Petrova, and E. V. Kotova, “Adhesive for high temperature tensometry,” Klei. Germetiki. Tekhnol., No. 1, 7—12 (2021).
35.
Bonding in Mechanical Engineering: A Handbook, Ed. by G. V. Malysheva (Nauka i Tekhnologii, Moscow, 2005), Vol. 1 [in Russian].
36.
C. Wang, Y. D. Huang, and B. Wang, “Study on heat-resistant property of adhesive/carbon-carbon composites joints, Int. J. Adhes. Adhes 26, 206–211 (2006).CrossRef
37.
E. N. Kablov, L. I. Anikhovskaya, N. F. Lukina, et al., “Heat resistant adhesive composition,” RF Patent No. 2276679 (2006).
38.
A. P. Petrova and N. F. Lukina, “The influence of glued-material composition on properties of adhesive joints,” Polym. Sci. Ser. D 7, 290–292 (2014).CrossRef
39.
N. F. Lukina and A. P. Petrova, “Properties and application of adhesives in instrument technology,” Trudy VIAM 204336 (2005). https://​viam.​ru/​sites/​default/​files/​scipub/​2005/​2005-204336.​pdf.​
40.
S. N. Gladkikh and M. G. Mokrushin, “Heat- and high-temperature-resistant adhesives for joining carbon and ceramic materials,” Polym. Sci. Ser. D 3, 258–262 (2010).CrossRef
41.
S. N. Gladkikh, A. E. Dvoretskii, and A. I. Vyalov, “New adhesives developed by JSC “Kompozit” for products of rocket and space technology//Adhesion materials,” in Proceedings of Scientific and Technical Conference (VIAM, Moscow, 2016).
42.
W. Miao, W. Cheng, Zh. Wang, et al., “Influence of n-butyl acrylate and maleic anhydride copolymer on the structure and properties of phenolic resin,” Mater. Today 23, 100879 (2020).
43.
P. S. Parameswaran and M. G. Bhuvaneswary, and Th. Thachil Eby. “Control of microvoids in resol phenolic resin using unsaturated polyester,” J. Appl. Polym. Sci. 113, 802–810 (2009).CrossRef
44.
N. M. Rovkina and N. G. Tyukavkina, “Modification of resole-type phenol-formaldehyde resins with monoepoxides,” Al’manakh Sovrem. Nauki Obrazov., No. 11, Part 1, 161—165 (2009).
45.
L. P. Rong, X. H. Liu, X. Li, et al., “Study on properties of epoxy modified phenolic resin emulsion,” Chem. Bonding 38, 27–30 (2016).
46.
D. Ying, W. Zhe, R. Xiaofang, and C. Xiaoyan, “Synthesis of phenol-formaldehyde resin modified with epoxy resin,” Petrochem. Technol. 41, 583–587 (2012).
47.
V. Krasinskyi, E. Spišák, I. Gajdoš, and T. Garbacz, “Heat-resistant coatings on the basis of phenol-formaldehyde compositions,” Mater. Sci. Forum 818, 105–108 (2015).CrossRef
48.
C. Vu Manh, Nguyen D. Duc., and L. Sinh Hoang, et al., “Improvement the mode I interlaminar fracture toughness of glass fiber reinforced phenolic resin by using epoxidized soybean oil,” Polym. Bull. 75, 4769–4782 (2018).CrossRef
49.
L. A. Varghese, B. T. Abraham, and E. T. Thachil, “Adhesive properties of neoprene-phenolic-EPN blends,” Prog. Rubber, Plast. Recycl. Technol. 22, 253–268 (2006).CrossRef
50.
L. A. Varghese, PhD Thesis (Kochi, India, 2006). http://​citeseerx.​ist.​psu.​edu/​viewdoc/​download?​doi=​ 10.1.1.886.859&rep=rep1&type=pdf.
51.
Modification of phenol-formaldehyde resins. http://​www.​tehnology-pro.​ru/​modifikaciya-fenoloformaldegi​dnykh-smol.​html.​
52.
W. Yang, M. Rallini, M. Natali, et al., “Preparation and properties of adhesives based on phenolic resin containing lignin micro and nanoparticles: A comparative study,” Mater. Des. 161, 55–63 (2019).CrossRef
53.
Q. Fang, H. Cui, and G. Du, “Montmorillonite reinforced phenol formaldehyde resin: Preparation, characterization, and application in wood bonding,” Int. J. Adhes. Adhes. 49, 33–37 (2014).CrossRef
54.
F. Javanbakht, B. Razavi, M. Salami Kalajahi, et al., “Fabrication of high thermal stable cured novolac/Cloisite 30b nanocomposites by chemical modification of resin structure,” Polym. Adv. Technol., 1–7 (2019). https://​doi.​org/​10.​1002/​pat.​4761
55.
D. X. Wang, Z. M. Chen, G. X. Zhang, et al., “Study on fast-curing phenol-formaldehyde resin adhesive,” Chem. Adhes. 38, 447–449 (2016).
56.
G. Özbay, E. S. Kokten, and A. Ozcifci, “Synthesis and characterization of resol type phenol-formaldehyde resin improved by SiO2-NP,” Wood Res. 66, 161–170 (2021).CrossRef
57.
G. Hernández-Padrón, F. Rojas, and V. M. Castaño, “Ordered SiO2–(phenolic-formaldehyde resin) in situ nanocomposites,” Nanotecnology 15, 98–103 (2003).CrossRef
58.
J. Yun, L. Chen, X. Zhang, et al., “Synthesis and structure evolution of phenolic resin/silicone hybrid composites with improved thermal stability,” J. Mater. Sci. 53, 14185–14203 (2018).CrossRef
59.
Z. Fang and J. Suo, “Synthesis and characterization of phenolic resol resin blended with silica sol and PVA,” J. Appl. Polym. Sci. 119, 744–751 (2010).CrossRef
60.
Z. Yudong, L. Sangho, Y. Mitra, et al., “Phenolic resin–trisilanolphenyl polyhedral oligomeric silsesquioxane (POSS) hybrid nanocomposites: Structure and properties,” Polymer 47, 2984–2996 (2006).CrossRef
61.
J. Chen, W. Zhang, J. Liu, et al., “Improved thermal stability of phenolic resin by graphene-encapsulated nano-SiO2 hybrids,” J. Therm. Anal. Calorim. 135, 2377–2387 (2018).CrossRef
62.
J.-G. Wang, Q.-G. Guo, L. Liu, and J.-R. Song, “Study on the microstructural evolution of high temperature adhesives for graphite bonding,” Carbon 40, 2447–2452 (2002).CrossRef
63.
J. Wang, N. Jiang, and H. Jiang, “Effect of the evolution of phenol–formaldehyde resin on the high-temperature bonding,” Int. J. Adhes. Adhes. 29, 718–723 (2009).CrossRef
64.
J. Wang, N. Jiang, Q. Guo, et al., “Study on the structural evolution of modified phenol–formaldehyde resin adhesive for the high-temperature bonding of graphite,” J. Nucl. Mater. 348, 2 (2006).CrossRef
65.
J. Wang, Q. Guo, L. Liu, and J. Song, “The Preparation and Performance of High-Temperature Adhesives for Graphite Bonding,” Int. J. Adhes. Adhes. 25, 495–501 (2005).CrossRef
66.
S. A. Haddadi, M. Mahdavian-Ahadi, and F. Abbasi, “Effect of nanosilica and boron carbide on adhesion strength of high temperature adhesive based on phenolic resin for graphite bonding,” Ind. Eng. Chem. Res. 53, 11747–11754 (2014).CrossRef
67.
H. Jiang, J. Wang, S. Wu, et al., “Study on the property of boron carbide-modified phenol-formaldehyde resin for silicon carbide bonding,” Russ. J. Appl. Chem. 87, 904–908 (2014).CrossRef
68.
J. Wang, N. Jiang, H. Jiang, et al., “The high-temperatures bonding of graphite/ceramics by organ resin matrix adhesive,” Int. J. Adhes. Adhes. 26, 532–536 (2006).CrossRef
69.
70.
N. H. Tai, M. K. Yeh, and J. H. Liu, “Enhancement of the mechanical properties of carbon nanotube/phenolic composites using a carbon nanotube network as the reinforcement,” Carbon 42, 2774–2777 (2004).CrossRef
71.
Y. A. Kim, S. Kamio, T. Tajiri, et al., “Enhanced thermal conductivity of carbon fiber/phenolic resin composites by the introduction of carbon nanotube,” Appl. Phys. Lett. 90, 093125 (2007).CrossRef
72.
I. S. Epifanovskii, A. N. Ponomarev, A. A. Donskoi, and S. V. Kashirin, “Modification of the properties of polymer materials by low concentrations of fulleroids,” Perspektivnye Mater. No. 2, 15—18 (2006).
73.
R. Lin, L. Fang, X. Li, et al., “Study on phenolic resins modified by copper nanoparticles,” Polym. J. 38, 178–183 (2006).CrossRef
74.
75.
L. Zhi, T. Zhao, and Y. Yu, “Preparation of phenolic resin/silver nanocomposites via in situ reduction,” Scripta Materialia 47, 875–879 (2002).CrossRef
76.
Y. Lee, K. Jun, and K. Lee, “Phenol-derived carbon sealant inspired by a coalification process,” Angew. Chemie Int. Ed. 59, 3864–3870 (2020).CrossRef
77.
J. Sun, R. H. Lin, and W. X. Bo, et al., “Sodium silicate as catalyst and modifier for phenol-formaldehyde resin,” Appl. Mech. Mater. 184–185, 1198– 1206 (2012).
78.
Y. Chai, J. Liu, Y. Zhao, and N. Yan, “Characterization of modified phenol formaldehyde resole resins synthesized in situ with various boron compounds,” Ind. Eng. Chem. Res. 55, 9840–9850 (2016).CrossRef
79.
P. M. Valetskii and A. P. Petrova, “Polymer adhesives based on carborane-containing compounds,” Trudy VIAM 2004, 204186 (2004). https://​viam.​ru/​sites/​default/​files/​scipub/​2004/​2004-204186.​pdf.​
80.
A. P. Petrova and A. B. Laptev, “Phenolic rubber adhesives modified with carboranes,” Klei. Germetiki. Tekhnol. No. 6, 2—6 (2017).
81.
A. P. Petrova and A. B. Laptev, “Thermal stability of carborane-containing adhesive systems based on phenol-formaldehyde oligomers,” Klei. Germetiki. Tekhnol., No. 7, 2—6 (2017).
82.
A. P. Petrova, G. N. Zadorozhnaya, O. A. Akulova, et al., “Heat resistant adhesive composition,” RF Patent No. 2002786 (1993).
83.
E. N. Kablov, V. T. Minakov, A. P. Petrova, et al., “Heat resistant adhesive composition,” RF Patent No. 2203917 (2003).
84.
A. P. Petrova, “Influence of carborane groups on the curing processes of carborane-containing adhesives of various chemical nature. Part 1. Curing adhesives based on phenol-formaldehyde oligomers,” Novosti Materialoved. Nauka Tekh. Vols. 3—4, 42—55 (2017).
85.
86.
A. P. Petrova, “Phenolic-rubber carborane-containing adhesive with intrinsic ferromagnetism,” Plast. Massy, No. 11, 3—4 (2006).
87.
Z. Bin, S. Ming-ming, Z. Xu-gang, et al., “High temperature-resistant adhesive of modified phenolic resin with polyborosiloxane,” Polym. Mater. Sci. Eng. 101746532 (2008).
88.
“Preparation method of polyborosiloxane modified phenol formaldehyde resin (PF) adhesive with high temperature resistance,” Patent CN103805116A (2014).
89.
V. D. Solodovnik, A. B. Davydov, Z. G. Ivanova, et al. “Study of the properties and possibilities of using organosilicon polymers as heat-resistant adhesives,” Plast. Massy, No. 3, 39—44 (1963).
90.
P. Xu and F. Yang, “Modification of phenolic resin composites by hyperbranched polyborate and polybenzoxazine,” Polym. Compos. 33, 1960– 1968 (2012).CrossRef
91.
S. A. Sosunov, G. V. Komarov, S. V. Bukharov, and G. A. Kravetskii, “Heat-resistant compounds of materials with phenol-furfural-formaldehyde adhesives,” Plast. Massy, No. 9, 40–41 (2003).
92.
E. K. Syzdykov, A. V. Zhavoronkov, A. I. Loginov, et al., “Compound adhesive,” RF Patent No. 2473582 (2013).
93.
Y. D. Zhang, H. F. Hu, Ch. R. Zhang, and G. D. Li, “Online-joining of C/SiC-C/SiC via slurry reaction and precursor infiltration and pyrolysis process with C/SiC pins,” Key Eng. Mater. 531–532, 135–140 (2012).
94.
S. A. Sosunov, G. V. Komarov, S. V. Bukharov, and G. A. Kravetsky, “Heat-resistant compounds of carbon materials with phenol-furfural-formaldehyde adhesives,” Plastics, No. 9, 40–41 (2003).
Metadaten
Titel
Modern Phenolic Adhesives for Aviation and Engineering. Part 1. The Effect of Modifying Additives
verfasst von
D. A. Aronovich
A. P. Petrova
Publikationsdatum
01.09.2023
Verlag
Pleiades Publishing
Erschienen in
Polymer Science, Series D / Ausgabe 3/2023
Print ISSN: 1995-4212
Elektronische ISSN: 1995-4220
DOI
https://doi.org/10.1134/S1995421223030024

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