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2024 | OriginalPaper | Buchkapitel

Multiphysics Coupling Simulation and Analysis of Influencing Factors on Temperature Rise Characteristics of Tri-Post Insulator GIL

verfasst von : F. F. Wu, S. Y. Xie, X. Lin, M. H. Chen, C. H. Zhang

Erschienen in: The Proceedings of 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023)

Verlag: Springer Nature Singapore

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Abstract

In this paper, a 1100 kV GIL thermal–mechanical-electrical multi-physics coupling simulation model was established, the evolution characteristics of the internal temperature field of the tri-post insulator GIL with external factors were investigated. The results show that the temperature of the GIL tri-post insulator gradually decreases from the conductor to the enclosure, and the internal temperature is slightly lower than the surface; the maximum thermal stress occurs at the edge of the insulator wrapped around the conduct. Under rated conditions, the maximum stress inside the insulator can be up to 180 MPa, and the thermal expansion difference between the upper and lower surfaces of the enclosure hardly changes with temperature. This study provides an important guarantee for the safe operation of GIL.

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Literatur
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Zurück zum Zitat Dong JN et al (2022) Effects of transient voltages on discharge inception of tri-post Insulator in DC-GIL. In: 2022 IEEE 4th international conference on dielectrics (ICD), pp 126–129 Dong JN et al (2022) Effects of transient voltages on discharge inception of tri-post Insulator in DC-GIL. In: 2022 IEEE 4th international conference on dielectrics (ICD), pp 126–129
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Zurück zum Zitat Li W et al (2021) The 3D accumulation characteristics of surface charges on actual 550 kV GIL tri-post insulator under AC voltage in SF6. In: 2021 IEEE conference on electrical insulation and dielectric phenomena (CEIDP), pp 359–362 Li W et al (2021) The 3D accumulation characteristics of surface charges on actual 550 kV GIL tri-post insulator under AC voltage in SF6. In: 2021 IEEE conference on electrical insulation and dielectric phenomena (CEIDP), pp 359–362
Metadaten
Titel
Multiphysics Coupling Simulation and Analysis of Influencing Factors on Temperature Rise Characteristics of Tri-Post Insulator GIL
verfasst von
F. F. Wu
S. Y. Xie
X. Lin
M. H. Chen
C. H. Zhang
Copyright-Jahr
2024
Verlag
Springer Nature Singapore
DOI
https://doi.org/10.1007/978-981-99-7413-9_67