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Computational Mechanics

01.01.2015 | Original Paper

Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon

verfasst von: Shantanu S. Mulay, Gauthier Becker, Renaud Vayrette, Jean-Pierre Raskin, Thomas Pardoen, Montserrat Galceran, Stéphane Godet, Ludovic Noels

Erschienen in: Computational Mechanics | Ausgabe 1/2015

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Abstract

Micro-electro-mechanical systems (MEMS) made of polycrystalline silicon are widely used in several engineering fields. The fracture properties of polycrystalline silicon directly affect their reliability. The effect of the orientation of grains on the fracture behaviour of polycrystalline silicon is investigated out of the several factors. This is achieved, firstly, by identifying the statistical variation of the fracture strength and critical strain energy release rate, at the nanoscopic scale, over a thin freestanding polycrystalline silicon film having mesoscopic scale dimensions. The fracture stress and strain at the mesoscopic level are found to be closely matching with uniaxial tension experimental results. Secondly, the polycrystalline silicon film is considered at the continuum MEMS scale, and its fracture behaviour is studied by incorporating the nanoscopic scale effect of grain orientation. The entire modelling and simulation of the thin film is achieved by combining the discontinuous Galerkin method and extrinsic cohesive law describing the fracture process.

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Fußnoten
1
These units are modified in the simulation setup to avoid bad conditioning numbers.
 
Literatur
1.
DelRio FW, Dunn ML, Boyce BL, Corwin AD, De Boer MP (2006) The effect of nanoparticles on rough surface adhesion. J Appl Phys 99(10):104304CrossRef
2.
Suwito W, Dunn ML, Cunningham SJ, Read DT (1999) Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures. J Appl Phys 85(7):3519–3534CrossRef
3.
Sharpe WN Jr, Turner K, Edwards R (1999) Tensile testing of polysilicon. Exp Mech 39(3):162–170CrossRef
4.
Sharpe W, Jackson KM, Hemker K, Xie Z (2001) Effect of specimen size on Young’s modulus and fracture strength of polysilicon. Microelectromechanical Syst J 10(3):317–326CrossRef
5.
Coenen E, Kouznetsova V, Bosco E, Geers M (2012) A multi-scale approach to bridge microscale damage and macroscale failure: a nested computational homogenization-localization framework. Int J Fract 178(1–2):157–178. doi:10.​1007/​s10704-012-9765-4 CrossRef
6.
Nguyen VP, Lloberas-Valls O, Stroeven M, Sluys LJ (2012) Computational homogenization for multiscale crack modeling. Implementational and computational aspects. Int J Numer Methods Eng 89(2):192–226. doi:10.​1002/​nme.​3237 CrossRefMathSciNetMATH
7.
Mercatoris BCN, Massart TJ (2011) A coupled two-scale computational scheme for the failure of periodic quasi-brittle thin planar shells and its application to masonry. Int J Numer Methods Eng 85(9):1177–1206. doi:10.​1002/​nme.​3018 CrossRefMATH
8.
9.
Verhoosel CV, Remmers JJC, Gutiérrez MA, de Borst R (2010) Computational homogenization for adhesive and cohesive failure in quasi-brittle solids. Int J Numer Methods Eng 83(8–9):1155–1179CrossRefMATH
10.
11.
12.
13.
14.
Wu L, Tjahjanto D, Becker G, Makradi A, Jèrusalem A, Noels L (2013) A micro-meso-model of intra-laminar fracture in fiber-reinforced composites based on a discontinuous Galerkin/cohesive zone method. Eng Fract Mech 104:162–183
15.
Dugdale DS (1960) Yielding of steel sheets containing slits. J Mech Phys Solids 8(2):100–104CrossRef
16.
17.
18.
19.
20.
de Borst R, Gutiérrez MA, Wells GN, Remmers JJC, Askes H (2004) Cohesive-zone models, higher-order continuum theories and reliability methods for computational failure analysis. Int J Numer Methods Eng 60(1):289–315. doi:10.​1002/​nme.​963 CrossRefMATH
21.
Hillerborg A, Modéer M, Petersson PE (1976) Analysis of crack formation and crack growth in concrete by means of fracture mechanics and finite elements. Cement Concrete Res 6(6):773–781CrossRef
22.
Camacho GT, Ortiz M (1996) Computational modelling of impact damage in brittle materials. Int J Solids Struct 33(20–22):2899–2938CrossRefMATH
23.
Ortiz M, Pandolfi A (1999) Finite-Deformation Irreversible Cohesive Elements for Three-Dimensional Crack Propagation Analysis. Int J Numer Methods Eng 44(9):1267–1282CrossRefMATH
24.
Noels L, Radovitzky R (2006) A general discontinuous Galerkin method for finite hyperelasticity. Formulation and numerical applications. Int J Numer Methods Eng 68(1):64–97CrossRefMathSciNetMATH
25.
Mergheim J, Kuhl E, Steinmann P (2004) A hybrid discontinuous Galerkin/interface method for the computational modelling of failure. Commun Numer Methods Eng 20(7):511–519CrossRefMathSciNetMATH
26.
27.
Becker G, Geuzaine C, Noels L (2011) A one field full discontinuous Galerkin method for Kirchhoff-Love shells applied to fracture mechanics. Comput Methods Appl Mechanics Eng 200(45–46):3223–3241CrossRefMathSciNetMATH
28.
Becker G, Noels L (2013) A full-discontinuous Galerkin formulation of nonlinear Kirchhoff-Love shells: elasto-plastic finite deformations, parallel computation, and fracture applications. Int J Numer Methods Eng 93(1):80–117CrossRefMathSciNet
29.
30.
31.
Greek S, Ericson F, Johansson S, Fürtsch M, Rump A (1999) Mechanical characterization of thick polysilicon films: Young’s modulus and fracture strength evaluated with microstructures. J Micromech Microeng 9(3):245
32.
Sharpe WN, Yuan B, Vaidyanathan R, Edwards RL (1996) New test structures and techniques for measurement of mechanical properties of MEMS materials. In: Microlithography and Metrology in Micromachining II, Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 2880, Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 2880, pp. 78–91
33.
Van Arsdell W, Brown S (1999) Subcritical crack growth in silicon MEMS. Microelectromechanical Syst J 8(3):319–327CrossRef
34.
Gravier S, Coulombier M, Safi A, Andre N, Boe A, Raskin JP, Pardoen T (2009) New on-chip nanomechanical testing laboratory—applications to aluminum and polysilicon thin films. Microelectromechanical Syst J 18(3):555–569CrossRef
35.
Escobedo-Cousin E, Olsen SH, Pardoen T, Bhaskar U, Raskin JP (2011) Experimental observations of surface roughness in uniaxially loaded strained Si microelectromechanical systems-based structures. Appl Phys Lett 99(24):241906CrossRef
36.
Bhaskar U, Passi V, Houri S, Escobedo-Cousin E, Olsen SH, Pardoen T, Raskin JP (2012) On-chip tensile testing of nanoscale silicon free-standing beams. J Mater Res 27(03):571–579CrossRef
37.
Passi V, Bhaskar U, Pardoen T, Sodervall U, Nilsson B, Petersson G, Hagberg M, Raskin JP (2012) High-Throughput On-Chip Large Deformation of Silicon Nanoribbons and Nanowires. Microelectromechanical Syst J 21(4):822–829
38.
Ureña F, Olsen SH, Šiller L, Bhaskar U, Pardoen T, Raskin JP (2012) Strain in silicon nanowire beams. J Appl Phys 112(11):114506CrossRef
39.
Kumar Bhaskar U, Pardoen T, Passi V, Raskin JP (2013) Piezoresistance of nano-scale silicon up to 2 GPa in tension. Appl Phys Lett 102(3):031911–031911-4CrossRef
40.
Noels L, Radovitzky R (2008) An explicit discontinuous Galerkin method for non-linear solid dynamics: formulation, parallel implementation and scalability properties. Int J Numer Methods Eng 74(9):1393–1420. doi:10.​1002/​nme.​2213 CrossRefMathSciNetMATH
41.
42.
Yi T, Li L, Kim CJ (2000) Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength. Sens Actuators A 83(1–3):172–178CrossRef
43.
Sato K, Yoshioka T, Ando T, Shikida M, Kawabata T (1998) Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip. Sens Actuators A 70(1–2):148–152CrossRef
44.
Gilman JJ (1960) Direct measurements of the surface energies of crystals. J Appl Phys 31(12):2208–2218CrossRef
45.
Messmer C, Bilello JC (1981) The surface energy of Si, GaAs, and GaP. J Appl Phys 52(7):4623–4629CrossRef
46.
Hopcroft M, Nix W, Kenny T (2010) What is the Young’s modulus of silicon? Microelectromechanical Syst J 19(2):229–238CrossRef
47.
Alzebdeh K, Ostoja-Starzewski M (1996) Micromechanically based stochastic finite elements: length scales and anisotropy. Probab Eng Mech 11(4):205–214CrossRef
48.
Ostoja-Starzewski M (1998) Random field models of heterogeneous materials. Int J Solids Struct 35(19):2429–2455CrossRefMATH
49.
Lucas V, Wu L, Arnst M, Jean-Claude G, Paquay S, Nguyen VD, Noels L (2014) Prediction of macroscopic mechanical properties of a polycrystalline microbeam subjected to material uncertainties. In: Cunha A, Caetano E, Ribeiro P, Müller G (eds) Proceedings of the 9th International Conf erence on Structural Dynamics, EURODYN 2014, pp. 2691–2698
50.
Galceran M, Albou A, Renard K, Coulombier M, Jacques P, Godet S (2013) Automatic crystallographic characterization in a transmission electron microscope: applications to twinning induced plasticity steels and al thin films. Microsc Microanal 19(03):693–697CrossRef
51.
Tsuchiya T, Tabata O, Sakata J, Taga Y, Specimen size effect on tensile strength of surface micromachined polycrystalline silicon thin films. In: Micro Electro Mechanical Systems, 1997. MEMS ’97, Proceedings, IEEE. Tenth Annual International Workshop on (1997), pp. 529–534
Metadaten
Titel
Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon
verfasst von
Shantanu S. Mulay
Gauthier Becker
Renaud Vayrette
Jean-Pierre Raskin
Thomas Pardoen
Montserrat Galceran
Stéphane Godet
Ludovic Noels
Publikationsdatum
01.01.2015
Verlag
Springer Berlin Heidelberg
Erschienen in
Computational Mechanics / Ausgabe 1/2015
Print ISSN: 0178-7675
Elektronische ISSN: 1432-0924
DOI
https://doi.org/10.1007/s00466-014-1083-4

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