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Erschienen in:
01.12.2007
Photoresist patterned thick-film piezoelectric elements on silicon
Erschienen in: Journal of Electroceramics | Ausgabe 4/2007
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Abstract
A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 μm and a film thickness of 100 μm. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d
33 value of 60 pCN−1.