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Erschienen in:
01.07.2012
Polycrystalline silicon films fabricated by rapid thermal annealing
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 7/2012
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Abstract
Poly-crystalline silicon (poly-Si) films were fabricated by rapid thermal annealing (RTA) of amorphous silicon films which were deposited on quartz by hot wire chemical vapor deposition. An insertion of Cr layer can significantly suppress the peeling of Si films during the RTA process. The effect of RTA parameters on the structural properties of poly-Si films was investigated by Raman spectroscopy, X-ray diffraction and scanning electron microscopy. The results show that the crystallinity of the poly-Si films is increased with the increase of RTA temperature and duration. A sharp peak at about 520 cm−1 is observed in the Raman spectra of poly-Si films annealed at 900 and 1,100 °C for 15 s indicating the excellent crystallinity of the poly-Si films fabricated by RTA. Poly-Si films with high crystalline fraction of 97.3 % were obtained by RTA at 1,100 °C for 20 s.