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2018 | OriginalPaper | Buchkapitel

6. Redundant Via Insertion for MP-DSAL

verfasst von : Seongbo Shim, Youngsoo Shin

Erschienen in: Physical Design and Mask Synthesis for Directed Self-Assembly Lithography

Verlag: Springer International Publishing

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Abstract

In MP-DSAL, vias that are physically close are clustered to form a GP and patterned together through DSAL process; in addition, GPs that are too close are created on a wafer using different masks through MP. It should be very careful to insert redundant vias in MP-DSAL since some redundant vias may cause large and complex via clusters, whose GPs is likely to cause DSA defect; some other redundant vias may cause MP coloring conflict. This chapter addresses redundant via insertion for MP-DSAL, which aims to insert maximum number of redundant vias while all GPs are manufacturable and no MP coloring conflict occur. The problem can be formulated as ILP, which is used as a reference for comparison to a graph-based heuristic algorithm.

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Vorheriges Kapitel Redundant Via Insertion for DSAL

Nächstes Kapitel DSAL Mask Synthesis

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Titel: Redundant Via Insertion for MP-DSAL
verfasst von: Seongbo Shim
Youngsoo Shin
Verlag: Springer International Publishing
Buch: Physical Design and Mask Synthesis for Directed Self-Assembly Lithography
Print ISBN: 978-3-319-76293-7

Electronic ISBN: 978-3-319-76294-4

Copyright-Jahr: 2018
DOI: https://doi.org/10.1007/978-3-319-76294-4_6

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