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Journal of Materials Science: Materials in Electronics

Erschienen in:

19.08.2020

Signal transfer via smart conductive networks for high temperature performing wearable electronics

verfasst von: Ercan Karabulut, Senem Kurşun Bahadır

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 18/2020

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Abstract

High temperature performing textile conductive networks for wearable electronic applications are demonstrated. Different types of conductive yarns, namely steel, copper, and silver-coated were used as signal transmission tracks in order to configure the smart conductive network architecture. Conductive networks were formed between the layers of high temperature-resistant fabric substrates which of the following substrates most likely consist of reactively sputtered aluminum particles, polybenzimidazoles (PBI), aramid, and glass fibers. The specimens were constructed using welding and conventional sewing techniques and their operating characteristics in terms of high temperature resistance (limited flame spread, convective heat transfer, radiant heat) and electrical properties (conductivity and signal quality in data transfer) were determined. As a result of thermal tests, the excellent performances among conductive networks are attributed to steel and copper threads used as signal transmission line hidden in the interface among aluminum, 100 % aramid (nonwoven), and epoxy layer used as a substrate. The efficient exploitation of smart conductive networks will boost the viability of data transfer quality among wearable electronic components performing at high temperatures.

Vorheriger Artikel Dynamic behaviors of ferroelectric domain structures in Eu-doped PMN-PT transparent ceramics studied by piezoresponse force microscopy

Nächster Artikel Fabrication of high thermal conductive epoxy composite by adding hybrid of expanded graphite, iron (III) oxide, and silver flakes

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Titel: Signal transfer via smart conductive networks for high temperature performing wearable electronics
verfasst von: Ercan Karabulut
Senem Kurşun Bahadır
Publikationsdatum: 19.08.2020
Verlag: Springer US
Erschienen in: Journal of Materials Science: Materials in Electronics / Ausgabe 18/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-020-04161-5

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