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Erschienen in: Journal of Nanoparticle Research 3/2017

01.03.2017 | Research Paper

Silver nanosheet-coated copper nanowire/epoxy resin nanocomposites with enhanced electrical conductivity and wear resistance

verfasst von: Ningning Zeng, Jingyi Ma, Yujuan Zhang, Guangbin Yang, Shengmao Zhang, Pingyu Zhang

Erschienen in: Journal of Nanoparticle Research | Ausgabe 3/2017

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Abstract

Silver (Ag) nanosheet-coated Cu nanowires (denoted as Cu@AgNWs) were prepared with a facile transmetalation reaction method. The effect of reaction conditions on the morphology and microstructure of the as-prepared Cu@AgNWs was investigated, and the thermal stability of Cu@AgNWs was evaluated by thermogravimetric analysis. In the meantime, the as-prepared Cu@AgNWs were used as the nanofillers of epoxy resin (EP), and their effect on the electrical conductivity and wear resistance of the EP-matrix composites was examined. Results indicate that the as-prepared Cu@AgNWs consist of CuNW core and Ag nanosheet shell. The Ag nanosheet shell can well inhibit the oxidation of the CuNW core, thereby providing the as-prepared Cu@AgNWs with good thermal stability even at an elevated temperature of 230 °C. The reaction temperature, Cu/Ag molar ratio, Cu dispersion concentration, and the dropping speed of silver ammonia reagent are suggested to be 40 °C, 5:1, 1% (mass fraction), and poured directly, respectively. Resultant Cu@AgNWs exhibit desired morphology and performance and can effectively increase the electrical conductivity and wear resistance of EP. This could make it feasible for the Cu@AgNW-EP composite to be applied as an electrostatic conductive material.

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Metadaten
Titel
Silver nanosheet-coated copper nanowire/epoxy resin nanocomposites with enhanced electrical conductivity and wear resistance
verfasst von
Ningning Zeng
Jingyi Ma
Yujuan Zhang
Guangbin Yang
Shengmao Zhang
Pingyu Zhang
Publikationsdatum
01.03.2017
Verlag
Springer Netherlands
Erschienen in
Journal of Nanoparticle Research / Ausgabe 3/2017
Print ISSN: 1388-0764
Elektronische ISSN: 1572-896X
DOI
https://doi.org/10.1007/s11051-017-3784-z

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