Simulation Methodology of Diamond Burnishing

The paper presents computer simulation results of the equivalent stress distribution in the surface layer of the diamond burnishing and ultrasonic burnishing products. Finite element analysis was carried out using Third Wave AdvantEdge (TWA) and Solid Works CAE systems. The simulation considered the physical and mechanical properties of both processed and tool materials. The elastic modulus of the processed material E_pm was found to have the most significant influence on equivalent stresses in the surface layer of the processed materials, which predetermines the operational properties of products. The E_pm values served as a basis in simulation experiments to study the effect of the technological parameters (burnishing force P, burnishing speed V, burnishing depth t, and the burnisher radius r) on equivalent stresses σ_eq in the surface layer of the burnished material. The primary influencing technological factors in the analysis of the equivalent stress distribution during diamond ultrasonic burnishing were the vibration frequency of the tool f, the radius of its working surface r, and the elastic modulus of the solder E_sol. As a result of the simulation, rational values of the technological parameters of the diamond burnishing and ultrasonic burnishing were determined. The study showed that the optimal choice of the technological parameters should consider both the equivalent stress distribution in the surface layer of the products and the factors influencing the tool wear observed under a particular processing mode.