nach oben

Rare Metals

Erschienen in:

16.01.2020

Solder paste metamorphism

verfasst von: Fu-Wen Zhang, Hui-Jun He, Zhi-Gang Wang, Gang Lin, Jie Zhu, Jiang-Song Zhang, Shao-Ming Zhang

Erschienen in: Rare Metals | Ausgabe 5/2021

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

Solder paste quality can be improved from microstructure and surface status of the solder powder. In this work, the micro-morphology of solder paste was observed and the particle surface condition was analyzed. Also, the conditions of corrosion and the corrosion products in different organic acid groups (activators) were analyzed. The result shows that the SnO passive film on the solder powder surface reacts with the COO– in the active agent of the solder paste. This reaction led the passivation layer to be peeled off. It also caused the change in solder powders’ physical and chemical properties and made the metal boundary to be cold-welded. This is the root cause of solder paste exsiccation and deterioration. The study on the details shows that to obtain high-quality solder paste, one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.

Vorheriger Artikel Synergistic inhibitive effect of cysteine and iodide ions on corrosion behavior of copper in acidic sulfate solution

Nächster Artikel Improving phase transition temperature of VO2 via Ge doping: a combined experimental and theoretical study

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

[1]

Tummala RR, Rymaszewski EJ, Klopfenstein AG. Microelectronics Packaging Handbook. 2nd ed. New York: International Thompson; 1997. 65.CrossRef

[2]

Nuty TA, Ekere NN. Monitoring the effects of storage on the rheological properties of solder paste. J Mater Sci Mater Electron. 2000;11:433.CrossRef

[3]

Xu XY. Investigation on Viscosity and Stability of Lead-Free Solder Paste. Nanjing: Southeast University; 2015. 3.

[4]

Chen LC, Zhao ZH, Wang RJ. Effect of solder powder on the stability of solder paste. Rare Met. 2009;28(10):414.

[5]

Han S, Zhao MQ, Song N. Optimization on storage stability of Sn0.3Ag0.7Cu solder paste. Electron Compon Mater. 2016;35(2):60.

[6]

Yu XY, Zhao MQ, Chen XD, Yang YJ. Effect of solvent on storage stability of SnAgCu solder paste. Electron Compon Mater. 2014;33(10):63.

[7]

Jin S, Xu J, He HJ, Lu CT. Oxidation characteristics of SnAgCu lead-free solder powder. Powder Metall Ind. 2013;23(2):17.

[8]

Fouzder T, Gain AK, Chan DK. Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates. J Mater Sci Mater Electron. 2017;28(22):16921.CrossRef

[9]

Kotadia HR, Howes PD, Mannan SH. A review: on the development of low melting temperature Pb-free solders. Microelectron Reliab. 2014;54:1253.CrossRef

[10]

Gain AK, Zhang L, Chan YC. Microstructure, elastic modulus and shear strength of alumina (Al₂O₃) nanoparticles-doped tin-silver-copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates. J Mater Sci Mater Electron. 2015;26(9):7039.CrossRef

[11]

Gain AK, Chan YC. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads. Intermetallics. 2012;29:48.CrossRef

[12]

Gain AK, Chan YC, Yung WKC. Microstructure, thermal analysis and hardness of a Sn–Ag–Cu-1 wt% nano-TiO₂ composite solder on flexible ball grid array substrates. Microelectron Reliab. 2011;51:975.CrossRef

[13]

Gong M. Metal Corrosion Theory and Corrosion Control. Beijing: Chemical Industry Press; 2009. 711.

[14]

Landolt D. Corrosion and Surface Treatment. Swiss: Encyclopedia of Life Support Systems (EOLSS); 2016.

[15]

Landolt Dieter. Corrosion and Surface Chemistry of Metals. Swiss: EPFL Press; 2007. 15.CrossRef

[16]

Xie DJ, Chan YC, Lai JKL. An experimental approach to pore-free reflow soldering. IEEE Trans Compon Packag Manuf Technol. 1996;19(1):148.CrossRef

[17]

Tian Y, Chan YC, Lai JK, Pak ST. The effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints. IEEE Trans Compon Packag Manuf Technol Part B. 1997;20(2):146.CrossRef

[18]

Rabiatull S, Idris A, Zuleikha S, Malek ZAA. Wettability study of lead free solder paste and its effect towards multiple reflow. In: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015). Malaysia: Kuantan; 2016. 38.

[19]

Baduch Dosten, Minogur Gerad. Fundamentals of Solder Paste Technology. Glob SMT Packag. 2007;12:14.

[20]

Turbini LJ, Smith BA, Brokaw J, Williams J, Gamalski J. The effect of solder paste residues on RF signal integrity. J Electron Mater. 2000;29(10):1164.CrossRef

[21]

Tuominen A, Nummenpaa P, Liukkonen T. The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow. Solder Surf Mt Technol. 2004;16(1):44.CrossRef

[22]

Song F, Lee SWR. Corrosion of Sn–Ag–Cu lead-free solders and the corresponding effects on board level solder joint reliability. In: Electronic Components and Technology Conference. Nice; 2006. 891.

[23]

Mori M, Miura K, Sasaki T, Ohtsuka T. Corrosion of tin alloys in sulfuric and nitric acids. Corros Sci. 2002;44:887.CrossRef

[24]

Du B, Lu YP, Lei YP, Yang YL, Yang HM. Study of a new flux for SnAgCu solder paste with low silver content. Vac Electron. 2011;4:27.

[25]

Iwasaki T, Kim JH, Mizuhashi S, Munetake S. Encapsulation of Lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance. J Electron Mater. 2005;34(5):647.CrossRef

[26]

Bai R, Zhao MQ, Fan H. Study on ethylene glycol ether free flux and solder paste. Electron Process Technol. 2012;33(2):71.

[27]

Hwang JS. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Germany: Springer; 1988. 283.

[28]

Yang XY, Al-Duri B. Kinetic modeling of liquid-phase adsorption of reactive dyes on activated carbon. J Colloid Interface Sci. 2005;28(7):25.CrossRef

[29]

Zhou YX, Lei YP, Li K, Wang Y. Technic adaptability of lead-free solder paste. Electron Process Technol. 2009;30(4):37.

[30]

Huang HZ, Wei XQ, Tan DQ, Zhou L. Effects of phosphorus addition on the properties of Sn–9Zn lead-free solder alloy. Int J Miner Metall Mater. 2013;20(6):563.CrossRef

[31]

Mhd Noor EE, Ogundipe AS. Effect of fluxes on Sn–Zn–Bi solder alloys on copper substrate. Solder Surf Mt Technol. 2017;5(14):12.

[32]

Amalu EH, Lau WK, Ekere NN. A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectron Eng. 2011;88(7):1610.CrossRef

[33]

Yu CY, Wang KJ, Duh JG. Interfacial reaction of Sn and Cu–xZn substrates after reflow and thermal aging. J Electron Mater. 2010;39(2):230.CrossRef

[34]

Hu CS, Wang FH, Wu W. Review of progress in thermal barrier coating. Corros Sci Prot Technol. 2000;12(3):160.

[35]

Kim SH, Choi Y, Kim YS, Paik KW. Effect of flux activators on the solder wettability of solder anisotropic conductive films. IEEE Trans Compon Packag Manuf Technol. 2015;5(1):3.CrossRef

[36]

Qin JH, Liu BQ, Gu LD, Li JM. Research of influencing factors on solder paste viscosity. Electron Compon Mater. 2011;30(7):40.

[37]

Xue J, Zhao MQ, Fan H, Zhan JF. Research on the solvents optimization of SnAgCu lead-free solder paste. Electron Compon Mater. 2011;30(2):36.

[38]

Berenguer R, Quijada C, Morallón E. Electrochemical characterization of SnO₂ electrodes doped with Ru and Pt. Electrochim Acta. 2009;54(14):5230.CrossRef

[39]

Idris SRA, Farihan N, Kahar H. Effect of flux onto intermetallic compound formation and growth. In: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015). Malaysia: Kuantan; 2016. 34.

Titel: Solder paste metamorphism
verfasst von: Fu-Wen Zhang
Hui-Jun He
Zhi-Gang Wang
Gang Lin
Jie Zhu
Jiang-Song Zhang
Shao-Ming Zhang
Publikationsdatum: 16.01.2020
Verlag: Nonferrous Metals Society of China
Erschienen in: Rare Metals / Ausgabe 5/2021
Print ISSN: 1001-0521
Elektronische ISSN: 1867-7185
DOI: https://doi.org/10.1007/s12598-019-01356-6

Premium Partner

Marktübersichten

Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.

Zur Marktübersicht

Springer Professional

Abstract

Bitte loggen Sie sich ein, um Zugang zu Ihrer Lizenz zu erhalten.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Weitere Artikel der Ausgabe 5/2021

Synergistic inhibitive effect of cysteine and iodide ions on corrosion behavior of copper in acidic sulfate solution

Zr–Ti–Al–Fe–Cu bulk metallic glasses for biomedical device application

Enhanced catalytic performance for selective oxidation of propene with O2 over bimetallic Au–Cu/SiO2 catalysts

Structural, mechanical, thermodynamic and electronic properties of Pt3M (M = Al, Co, Hf, Sc, Y, Zr) compounds under high pressure

Interfacial bonding mechanism of Cu/Al composite plate produced by corrugated cold roll bonding

Magnetization reversal behavior and first-order reversal curve diagrams in high-coercivity Zr-doped α-Fe/Nd2Fe14B nanocomposite alloys

Premium Partner

Marktübersichten