Ausgabe 3/2003
Inhalt (17 Artikel)
A critical review of microscale mechanical testing methods used in the design of microelectromechanical systems
V. T. Srikar, S. M. Spearing
A review of MEMS-based microscale and nanoscale tensile and bending testing
M. A. Haque, M. T. A. Saif
Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices
H. D. Espinosa, B. C. Prorok, B. Peng, K. H. Kim, N. Moldovan, O. Auciello, J. A. Carlisle, D. M. Gruen, D. C. Mancini
Mechanical measurements of adhesion in microcantilevers: Transitions in geometry and cyclic energy changes
E. E. Jones, K. D. Murphy, M. R. Begley
Fatigue damage evolution in silicon films for micromechanical applications
P. Shrotriya, S. Allameh, S. Brown, Z. Suo, W. O. Soboyejo
Elastic-plastic contact mechanics of indentations accounting for phase transformations
B. A. Galanov, V. Domnich, Y. Gogotsi
An experimental/computational approach to identify moduli and residual stress in MEMS radio-frequency switches
H. D. Espinosa, Y. Zhu, M. Fischer, J. Hutchinson
Stress wave interference effects during fracture of silicon micromachined specimens
A. M. Fitzgerald, T. W. Kenny, R. H. Dauskardt
Mixed-mode failure of thin films using laser-generated shear waves
J. Wang, N. R. Sottos, R. L. Weaver
Dynamic torsion testing of nanocrystalline coatings using high-speed photography and digital image correlation
F. Barthelat, Z. Wu, B. C. Prorok, H. D. Espinosa
Strain measurements in the nanometer range in a particulate composite using computer-aided moiré
C. A. Sciammarella, F. M. Sciammarella, T. Kim
Processing and characterization of epoxy/clay nanocomposites
I. M. Daniel, H. Miyagawa, E. E. Gdoutos, J. J. Luo