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Erschienen in: Journal of Materials Science 20/2018

10.07.2018 | Chemical routes to materials

Synthesis and structure evolution of phenolic resin/silicone hybrid composites with improved thermal stability

verfasst von: Jin Yun, Lixin Chen, Xiaofei Zhang, Hui Zhao, Ziyou Wen, Defu Zhu

Erschienen in: Journal of Materials Science | Ausgabe 20/2018

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Abstract

Phenolic resin/silicone hybrid composites (MPR) were prepared by a facile and low-cost method. FTIR results show that polycondensation of siloxane occurs in the presence of catalyst and water in the system, and siloxane oligomer was formed. During the curing process, the transesterification reaction between siloxane oligomer and phenolic resin (PR) makes silicon incorporated into PR. The TGA results indicate that introducing Si–O structure into PR can effectively improve the thermal stability of the resin. Compared with cured neat PR, temperatures at 5 and 10% mass loss of cured MPR can be improved by 43 and 36 °C. Its char yield at 800 °C was increased by about 9.1%. Cured MPR has been characterized by FTIR, XPS, XRD and Raman spectra to discuss the chemical state changes of silicon during pyrolysis process, as well as the effect of silicon on the char yield. On the one hand, the formation of Si–O–C structure can reduce the number of phenyl hydroxyl groups, which contributes to the reduced weight loss. On the other hand, the results indicate that Si–Ox structure was formed from the oxidation of Si–CH3 and hydrolysis of Si–O–C structures. According to Raman analyses, introducing silicone into the system cannot help to promote the formation of a more ordered structure. Additionally, the mechanical properties of cured MPR have also been improved.

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Metadaten
Titel
Synthesis and structure evolution of phenolic resin/silicone hybrid composites with improved thermal stability
verfasst von
Jin Yun
Lixin Chen
Xiaofei Zhang
Hui Zhao
Ziyou Wen
Defu Zhu
Publikationsdatum
10.07.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 20/2018
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-018-2384-3

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