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Erschienen in: Polymer Science, Series D 2/2022

01.06.2022

The Effect of Fillers on Thermal-Conductivity Materials Based on Silicon–Organic Oligomers (Review)

verfasst von: M. A. Ilyukhina, A. P. Petrova, V. V. Timonin

Erschienen in: Polymer Science, Series D | Ausgabe 2/2022

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Abstract

In this paper, we analyze and generalize survey information on the use of fillers of various chemical natures in the composition of organosilicon compositions based available literature data. Methods for increasing thermal conductivity by using fillers of various nature and dispersion are considered.

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Metadaten
Titel
The Effect of Fillers on Thermal-Conductivity Materials Based on Silicon–Organic Oligomers (Review)
verfasst von
M. A. Ilyukhina
A. P. Petrova
V. V. Timonin
Publikationsdatum
01.06.2022
Verlag
Pleiades Publishing
Erschienen in
Polymer Science, Series D / Ausgabe 2/2022
Print ISSN: 1995-4212
Elektronische ISSN: 1995-4220
DOI
https://doi.org/10.1134/S1995421222020058

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