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Erschienen in:
2020 | OriginalPaper | Buchkapitel
3. Thermal Conductivity Measurements via the Bolometric Effect
verfasst von : T. Serkan Kasirga
Erschienen in: Thermal Conductivity Measurements in Atomically Thin Materials and Devices
Verlag: Springer Singapore
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Abstract
In this chapter I will introduce the measurement of thermal conductivity using the bolometric effect. The bolometric effect is defined as the resistivity change of a material due to heating. Indeed, the bolometric effect forms the basis of many modern technological sensors and devices. For instance, most commonly used integrated circuit thermometers are based on the well calibrated resistivity change of a Pt strip. Another example is the thermal imaging sensors. A cooled array of high temperature coefficient of resistance material can sensitively detect the infrared spectrum due to the change in the electrical resistance of the active material.