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Erschienen in:
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2009 | OriginalPaper | Buchkapitel

13. Thermal Interface Materials

verfasst von : Ravi Prasher, PhD, Chia-Pin Chiu, PhD

Erschienen in: Materials for Advanced Packaging

Verlag: Springer US

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Abstract

Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling components. This chapter reviews the progress made in the TIM development in the past five years. Rheology based modeling and design is discussed for the widely used polymeric TIMs. The recently emerging technology of nanoparticles and nanotubes is also discussed for TIM applications. This chapter also includes TIM testing methodology and concludes with suggestion for the future TIM development directions.

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Vorheriges Kapitel Die Attach Adhesives and Films
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Metadaten
Titel
Thermal Interface Materials
verfasst von
Ravi Prasher, PhD
Chia-Pin Chiu, PhD
Copyright-Jahr
2009
Verlag
Springer US
Buch
Materials for Advanced Packaging

Print ISBN: 978-0-387-78218-8

Electronic ISBN: 978-0-387-78219-5

Copyright-Jahr: 2009

DOI
https://doi.org/10.1007/978-0-387-78219-5_13

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