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Applied Composite Materials
Erschienen in: Applied Composite Materials 3/2013

01.06.2013

Thermomechanical Analysis of Shape-Memory Composite Tape Spring

verfasst von: H. Yang, L. Y. Wang

Erschienen in: Applied Composite Materials | Ausgabe 3/2013

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Abstract

Intelligent materials and structures have been extensively applied for satellite designs in order to minimize the mass and reduce the cost in the launch of the spacecraft. Elastic memory composites (EMCs) have the ability of high-strain packaging and shape-memory effect, but increase the parts and total weight due to the additional heating system. Shape-memory sandwich structures Li and Wang (J. Intell. Mater. Syst. Struct. 22(14), 1605–1612, 2011) can overcome such disadvantage by using the metal skin acting as the heating element. However, the high strain in the micro-buckled metal skin decreases the deployment efficiency. This paper aims to present an insight into the folding and deployment behaviors of shape-memory composite (SMC) tape springs. A thermomechanical process was analyzed, including the packaging deformation at an elevated temperature, shape frozen at the low temperature and shape recovery after reheating. The result shows that SMC tape springs can significantly decrease the strain concentration in the metal skin, as well as exhibiting excellent shape frozen and recovery behaviors. Additionally, possible failure modes of SMC tape springs were also analyzed.
Vorheriger Artikel Production Principles and Technological Development of Novel Woven Spacer Preforms and Integrated Stiffener Structures
Nächster Artikel Resin Flow of an Advanced Grid-Stiffened Composite Structure in the Co-Curing Process

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Metadaten
Titel
Thermomechanical Analysis of Shape-Memory Composite Tape Spring
verfasst von
H. Yang
L. Y. Wang
Publikationsdatum
01.06.2013
Verlag
Springer Netherlands
Erschienen in
Applied Composite Materials / Ausgabe 3/2013
Print ISSN: 0929-189X
Elektronische ISSN: 1573-4897
DOI
https://doi.org/10.1007/s10443-012-9271-x

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