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Meccanica
Erschienen in: Meccanica 2/2015

01.02.2015 | Experimental Solid Mechanics

Three-dimensional digital image correlation measurement of mechanical properties of soft materials

verfasst von: Wei-Chung Wang, Yu-An Chiang, Ken-Jen Yu, Yi-Chieh Ho, Hung-Tsan Shen, Ting-Yu Chang, Ya-Hsin Chang, Chun-Sheng Tsao

Erschienen in: Meccanica | Ausgabe 2/2015

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Abstract

The rapid development of soft materials in recent years gives revolutionary impact on electronics and biomedical industries. To better control the quality and key technology, mechanical properties of soft materials employed in electronics and biomedical industries must be accurately determined. By employing the non-destructive, non-contact and whole-field characteristics of the three-dimensional (3D) digital image correlation (DIC) method, mechanical properties of three kinds soft materials, i.e. epoxy resin used in photoviscoelasticity, optical films used in backlight modules of the thin film transistor liquid display (TFT-LCD) and artificial meshes used in biomedical applications were investigated in this paper. It was found that satisfactory accuracy and measurement range can be obtained from the 3D-DIC method on the measurement of mechanical properties of soft materials.
Vorheriger Artikel Prediction of concrete compressive strength by combined non-destructive methods
Nächster Artikel Constitutive behavior and failure criteria for composites under static and dynamic loading

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Metadaten
Titel
Three-dimensional digital image correlation measurement of mechanical properties of soft materials
verfasst von
Wei-Chung Wang
Yu-An Chiang
Ken-Jen Yu
Yi-Chieh Ho
Hung-Tsan Shen
Ting-Yu Chang
Ya-Hsin Chang
Chun-Sheng Tsao
Publikationsdatum
01.02.2015
Verlag
Springer Netherlands
Erschienen in
Meccanica / Ausgabe 2/2015
Print ISSN: 0025-6455
Elektronische ISSN: 1572-9648
DOI
https://doi.org/10.1007/s11012-014-9947-4

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