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Erschienen in:
2001 | OriginalPaper | Buchkapitel
Wafer-Level Test
verfasst von : Gobinda Das, Franco Motika, Eugene Atwood
Erschienen in: Area Array Interconnection Handbook
Verlag: Springer US
Enthalten in: Professional Book Archive
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Successful development and manufacture of semiconductor components is highly dependent on test verification at several critical steps throughout the process and at multiple levels of packaging. An effective test methodology spans a broad range of products, diverse test systems and product-handling equipment, and encompasses several test techniques. A reliable and cost-effective product contacting method is a key requirement for all of these test techniques to be successful.