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Erschienen in: Journal of Materials Science: Materials in Electronics 4/2018

02.12.2017

What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product

verfasst von: E. Suhir

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 4/2018

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Abstract

High operational reliability of an electronic material or a device intended for aerospace applications is critical, and, in the author’s opinion, cannot be assured, if the underlying physics of failure is not well understood and the never-zero probability of failure is not predicted and made adequate for the particular material, device and application. The situation is the same in some other areas of electronics materials engineering, such as military, medical, or long-haul communications, where high level of reliability is required. The situation is different in today’s commercial electronics, where cost and time-to-market are typically more important than high reliability. Failure-oriented-accelerated-testing (FOAT) of aerospace electronics materials and products and its role in making a viable device into a reliable product is addressed and discussed vs. very popular today highly-accelerated-life-testing (HALT). The differences of the two accelerated test procedures and objectives is briefly discussed. FOAT is an essential part of the recently suggested probabilistic design for reliability (PDfR) approach in electronics engineering. It is argued that high (adequate) reliability level of aerospace electronics materials and devices cannot be achieved and assured, if their never-zero probability-of-failure is not quantified for the given (anticipated) combination of the loading conditions (stresses, stimuli) and time in operation. It is the application of the FOAT, the heart of the highly effective and highly flexible PDfR concept, that should be employed and mastered, when high reliability of a material or a device is imperative. The general concepts are illustrated by numerical examples. They are based on an analytical modeling approach, as the FOAT models are.

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Literatur
1.
Zurück zum Zitat M. Silverman, IEEE CPMT ASTR tutorial, Toronto, 2012, 2013 and private communications (2012) M. Silverman, IEEE CPMT ASTR tutorial, Toronto, 2012, 2013 and private communications (2012)
2.
Zurück zum Zitat JEDEC standard, JESD-47 stress-test-driven qualification of integrated circuits (2016) JEDEC standard, JESD-47 stress-test-driven qualification of integrated circuits (2016)
3.
Zurück zum Zitat E. Suhir, Probabilistic design for reliability. Chip Scale Rev. 14, 24 (2010) E. Suhir, Probabilistic design for reliability. Chip Scale Rev. 14, 24 (2010)
4.
Zurück zum Zitat E. Suhir, Boltzmann–Arrhenius–Zhurkov (BAZ) model in physics-of-materials problems, Mod. Phys. Lett. B 27, 133009 (2013) E. Suhir, Boltzmann–Arrhenius–Zhurkov (BAZ) model in physics-of-materials problems, Mod. Phys. Lett. B 27, 133009 (2013)
5.
Zurück zum Zitat E. Suhir, Applied Probability for Engineers and Scientists. (McGraw-Hill, New York, 1997) E. Suhir, Applied Probability for Engineers and Scientists. (McGraw-Hill, New York, 1997)
6.
Zurück zum Zitat E. Suhir, B. Poborets, Solder glass attachment in cerdip/cerquad packages: thermally induced stresses and mechanical reliability, in Proceedings of the 40th Electrical Computer and Technical Conference, Las Vegas, Nevada, May 1990 (See also: ASME Journal of Electronic Packaging, vol. 112, No. 2 (1990)) E. Suhir, B. Poborets, Solder glass attachment in cerdip/cerquad packages: thermally induced stresses and mechanical reliability, in Proceedings of the 40th Electrical Computer and Technical Conference, Las Vegas, Nevada, May 1990 (See also: ASME Journal of Electronic Packaging, vol. 112, No. 2 (1990))
7.
Zurück zum Zitat E. Suhir, Three-step concept in modeling reliability: Boltzmann–Arrhenius–Zhurkov physics-of-failure-based equation sandwiched between two statistical models. Microelectron. Reliab. 54, 2594–2603 (2014) E. Suhir, Three-step concept in modeling reliability: Boltzmann–Arrhenius–Zhurkov physics-of-failure-based equation sandwiched between two statistical models. Microelectron. Reliab. 54, 2594–2603 (2014)
Metadaten
Titel
What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product
verfasst von
E. Suhir
Publikationsdatum
02.12.2017
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 4/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-8224-4

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