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Erschienen in: Journal of Materials Science: Materials in Electronics 1/2019

12.11.2018

Yb3+/Tb3+/Ho3+: phosphate nanophase embedded glass ceramics: enhanced upconversion emission and temperature sensing behavior

verfasst von: Yong Chen, Xiangyu Liu, Jiwen Xu, Tao Yang, Zhenchun Li, Guohua Chen

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2019

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Abstract

Yb3+/Tb3+/Ho3+ tri-doped transparent phosphate glass–ceramics (GCs) were successfully synthetized by a conventional melt-quenching technique with subsequent glass crystallization. The formation of phosphate nanocrystals (NCs) with leucite structure was confirmed by X-ray diffraction (XRD), transmission electron microscopy (TEM), high-resolution TEM (HRTEM), selected-area electron diffraction (SAED). The variation of the decay curves confirms the accumulation of active centers into the NCs lattice. Hence, the UC emission intensity of Yb3+/Tb3+/Ho3+ doped GC610 sample is greatly enhanced relative to that in precursor glass (PG). And the UC energy transfers processes were systematically analysis. The result shows that the energy transfer of Ho3+→Tb3+ exists while Yb3+ as a sensitizer ion. Furthermore, the temperature-dependent UC luminescence and temperature sensing behaviors of the prepared materials based on the thermally coupled levels of Tb3+: 5D4 and Ho3+: 5F5 in the temperature range of 298–648 K were systematically investigated, to explore its possible application as optical thermometric medium, by utilizing the fluorescence intensity ratio (FIR) technique. The relative sensitivity (Sr) of 7.5 × 10−3 K−1 and absolute sensitivity (Sa) of 22 × 10−3 K−1 are achieved in the Yb3+/Tb3+/Ho3+ tri-doped GC. This GC materials is a very promising candidate for optical temperature sensors.

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Metadaten
Titel
Yb3+/Tb3+/Ho3+: phosphate nanophase embedded glass ceramics: enhanced upconversion emission and temperature sensing behavior
verfasst von
Yong Chen
Xiangyu Liu
Jiwen Xu
Tao Yang
Zhenchun Li
Guohua Chen
Publikationsdatum
12.11.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-0347-8

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