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Erschienen in: Engineering with Computers 5/2023

11.12.2022 | Original Article

Automatic unstructured mesh generation approach for simulation of electronic packaging system

verfasst von: Kejie Fu, Jianjun Chen, Jie Li, Kaixin Yu, Jiangda He, Min Tang, Yao Zheng

Erschienen in: Engineering with Computers | Ausgabe 5/2023

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Abstract

An automatic unstructured mesh generation approach is presented to discretize complex electronic packaging systems for finite element analysis. Various novel schemes are developed to resolve the common issues (models contain geometrical defects, models contain small but necessary features, simulation properties are predefined on models, etc.) to automate the entire mesh generation pipeline. These schemes include employing Boolean operations with a few technical considerations to resolve the geometrical defects of the original model, defining a sizing function that can adapt to small features, and developing a new data structure named the unified topology model to connect a CAD model and the mesh resulting from the model. The proposed approach can generate quality meshes on certain models with geometrical defects, while state-of-the-art open-source tools (Netgen and Gmsh) generate nonconforming meshes on those models. Tests on complex configurations show that the proposed approach can achieve a speed-up of 3–5 times in comparison with state-of-the-art commercial tools (e.g., COMSOL Multiphysics). Simulation results are provided to demonstrate that the proposed approach can create a mesh with satisfactory quality.

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Metadaten
Titel
Automatic unstructured mesh generation approach for simulation of electronic packaging system
verfasst von
Kejie Fu
Jianjun Chen
Jie Li
Kaixin Yu
Jiangda He
Min Tang
Yao Zheng
Publikationsdatum
11.12.2022
Verlag
Springer London
Erschienen in
Engineering with Computers / Ausgabe 5/2023
Print ISSN: 0177-0667
Elektronische ISSN: 1435-5663
DOI
https://doi.org/10.1007/s00366-022-01764-w

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