nach oben

Journal of Materials Engineering and Performance

Erschienen in:

01.04.2013

Characterization and Adhesion in Cu/Ru/SiO₂/Si Multilayer Nano-scale Structure for Cu Metallization

verfasst von: N. Chawla, S. H. Venkatesh, D. R. P. Singh, T. L. Alford

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 4/2013

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/SiO₂ and Cu/SiO₂ samples under scratch loading conditions. Cu/Ru/SiO₂ samples showed higher elastic recovery and hardness when compared to the Cu/SiO₂ samples. In the case of Cu/Ru/SiO₂ samples, Ru acts as a glue layer between the Cu and the SiO₂ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/SiO₂ samples compared to Cu/SiO₂ samples. Our results show that Cu/Ru/SiO₂ thin films present significant potential to be used in Cu metallization.

Vorheriger Artikel Fatigue Properties of Borosilicate Glass Coated with Two-Layered Ceramic Thin Films

Nächster Artikel Effect of Annealing Temperature in Al 1145 Alloy Sheets on Formability, Void Coalescence, and Texture Analysis

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

M. Lane, R.H. Dauskardt, N. Krishna, and I. Hashim, Adhesion and Reliability of Copper Interconnects with Ta and TaN Barrier Layers, J. Mater. Res., 2000, 15, p 1CrossRef

C.S.H. Riege and C.V. Thompson, Electromigration in Cu Interconnects with Very Different Grain Structures, Appl. Phys. Lett., 2001, 78, p 22CrossRef

S. Hara, T. Kumagai, S. Izumi, and S. Sakai, Multiscale Analysis on the Onset of Nanoindentation-Induced Delamination: Effect of High-Modulus Ru Overlayer, Acta Mater., 2009, 57, p 4209–4216CrossRef

H. Kim, T. Koseki, T. Ohba, T. Ohta, Y. Kojima, H. Sato, and Y. Shimogakia, Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization, J. Electrochem. Soc., 2005, 152, p 594–600CrossRef

M. Lane, Interface Fracture, Annu. Rev. Mater. Res., 2003, 33, p 29CrossRef

M.R. Turner and A.G. Evans, An Experimental Study of the Mechanisms of Crack Extension Along an Oxide/Metal, Acta Mater., 1996, 44, p 863CrossRef

Y.Y. Wang, M.S. Wong, W.J. Chia, J. Rechner, and W.D. Sproul, Synthesis and Characterization of Highly Textured Polycrystalline AlN/TiN Superlattice Coatings, J. Vac. Sci. Technol., 1998, 16, p 3341CrossRef

J.S. Juneja, P.-I. Wang, T. Karabacak, and T.-M. Lu, Dielectric Barriers, Pore Sealing, and Metallization, Thin Solid Films, 2006, 504, p 239–242CrossRef

R. Chan, T.N. Arunagiri, Y. Zhang, O. Chyan, R.M. Wallace, M.J. Kim, and T.Q. Hurd, Diffusion Studies of Copper on Ruthenium Thin Film, Electrochem. Solid-State Lett., 2004, 7, p 154–157CrossRef

10.

P. Benjamin and C. Weaver, Measurement of Adhesion of Thin Films, Proc. R. Soc. Lond., 1960, 254, p 163–176CrossRef

11.

X. Lu, B. Shi, L.K.Y. Li, J. Luo, and J. Mou, Nanoindentation and Nanotribological Behavior of Fe-N/Ti-N Multilayers with Different Thickness of Fe-N Layers, Wear, 2001, 247, p 15–23CrossRef

12.

S.P. Wen, R.L. Zong, F. Zeng, S. Guo, and F. Pan, Nanoindentation and Nanoscratch Behaviors of Ag/Ni Multilayers, Appl. Surf. Sci., 2009, 255(8), p 4558–4562CrossRef

13.

P.C. Wo, P.R. Munroe, Z. Xie, Z. Zhou, and K.Y. Li, Three-dimensional Visualization of Scratch-Induced Subsurface Damage in TiSiN/TiN Multilayer Coating Using Focused Ion Beam Scanning Electron Microscopic Tomography Technique, J. Am. Ceram. Soc., 2011, 94(5), p 1598–1604CrossRef

14.

A. Vyas, K.Y. Li, and Y.G. Shen, Influence of Deposition Conditions on Mechanical and Tribological Properties of Nanostructured TiN/CN_x Multilayer Films, Surf. Coat. Technol., 2009, 203(8), p 967–975CrossRef

15.

S.J. Bull and E.G. Berasetegui, An Overview of the Potential of Quantitative Coating Adhesion Measurement by Scratch Testing, Tribol. Int., 2006, 39, p 99–114CrossRef

16.

M. Larsson, M. Olsson, P. Hedenqvist, and S. Hogmark, Mechanisms of Coating Failure as Demonstrated by Scratch and Indentation Testing of Tin Coated HSS, Surf. Eng., 2000, 16, p 436–444CrossRef

17.

S.D. McAdams, T.Y. Tsui, G.M. Pharr, and W.C. Oliver, MRS Symposium Proceedings, Vol. 356, p 809–814, 1995

18.

P. Bertrand-Lambotte, J.L. Loubet, C. Verpy, and S. Pavan, Understanding of Automotive Clearcoats Scratch Resistance, Thin Solid Films, 2002, 420–421, p 281–286CrossRef

19.

A. Karimi, Y. Wang, T. Cselle, and M. Morstein, Fracture Mechanisms in Nanoscale Layered Hard Thin Films, Thin Solid Films, 2002, 420–421, p 275–280CrossRef

20.

B.J. Briscoe, E. Pelillo, and S.K. Sinha, Scratch Hardness and Deformation Maps for Polycarbonate and Polyethylene, Polym. Eng. Sci., 1996, 36, p 2996–3005CrossRef

21.

D.R.P. Singh and N. Chawla, Scratch Resistance of Al/SiC Nanolaminates, J. Mater. Res., 27, 2012

Titel: Characterization and Adhesion in Cu/Ru/SiO2/Si Multilayer Nano-scale Structure for Cu Metallization
verfasst von: N. Chawla
S. H. Venkatesh
D. R. P. Singh
T. L. Alford
Publikationsdatum: 01.04.2013
Verlag: Springer US
Erschienen in: Journal of Materials Engineering and Performance / Ausgabe 4/2013
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-012-0359-0

Premium Partner

Marktübersichten

Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.

Zur Marktübersicht

Springer Professional

Abstract

Bitte loggen Sie sich ein, um Zugang zu Ihrer Lizenz zu erhalten.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Weitere Artikel der Ausgabe 4/2013

An Experiment on Magnetic Pulse Uniaxial Tension of AZ31 Magnesium Alloy Sheet at Room Temperature

Development of Process Maps in Two-Wire Tandem Submerged Arc Welding Process of HSLA Steel

Incorporating Nano-silica as a Binder to Improve Corrosion Resistance of High Alumina Refractory Castables

Two-Point Incremental Forming with Partial Die: Theory and Experimentation

Taguchi Optimization of Pulsed Current GTA Welding Parameters for Improved Corrosion Resistance of 5083 Aluminum Welds

Fatigue Properties of Borosilicate Glass Coated with Two-Layered Ceramic Thin Films

Premium Partner

Marktübersichten