Journal of Materials Engineering and Performance

Journal of Materials Engineering and Performance OnlineFirst articles

13.11.2018

A Systematic Study on the Dynamic Softening Behavior of a Heat-Resistant Alloy Considering Thermal and Microstructural Effects

Deep understanding of the relationships among flow softening behaviors, microstructure evolution and process parameters is an essential issue due to the varied strain rate and temperature in industrial hot working schedules. In this research …

13.11.2018

Influence of Cell Anisotropy and Relative Density on Compressive Deformation Responses of LM13-Cenosphere Hybrid Foam

This article deals with closed-cell aluminum alloy LM13-cenosphere hybrid foams (ACHFs) with cell anisotropy prepared through stir casing technique. The compressive deformation behavior of hybrid foams in both transverse and longitudinal …

13.11.2018

Influence of Local Inhomogeneity of Thermomechanical Treatment Conditions on Microstructure Evolution in Aluminum Alloys

The influence of local inhomogeneity of the stress–strain condition on structure and texture evolution during thermomechanical treatment of aluminum alloys is studied in this work. For this purpose, laboratory rolling and plane strain tests that …

13.11.2018

Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties

The addition of Ni on lead-free solder alloys Sn0.7Cu was tested in this study. A small amount of Ni was added to the solder alloys to evaluate the thermal behavior, microstructure, and mechanical properties of the composite solders after …

13.11.2018

Synthesis and Structural Characterization of Sb-Doped TiFe2Sn Heusler Compounds

Ternary Heusler compounds form a numerous class of intermetallics, which include two families with general compositions ABC and AB2C, usually referred to as half- and full-Heusler compounds, respectively. Given their tunable electronic properties …

Weitere Informationen

Titel

Journal of Materials Engineering and Performance

Verlag

Springer US

Abdeckung

Jahrgang 6/1998 - Jahrgang 27/2018

Print ISSN

1059-9495

Elektronische ISSN

1544-1024

DOI

https://doi.org/10.1007/11665.1544-1024

Zeitschriften-ID

11665