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Polymer Bulletin

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25.03.2023 | ORIGINAL PAPER

Copper–strontium hydroxyapatite/chitosan/polyvinyl alcohol/gelatin electrospun composite and its biological studies for orthopedic applications

verfasst von: Narayanan Valarmathi, Kalidas Sabareeswari, Shanmugam Sumathi

Erschienen in: Polymer Bulletin | Ausgabe 2/2024

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Abstract

Sol–gel method is utilized to prepare copper and strontium substituted hydroxyapatite (Cu–Sr–HAP). Electrospinning method is utilized to prepare chitosan (CS)/polyvinyl alcohol (PVA)/gelatin (Gel) and (Cu–Sr–HAP)/CS/PVA/Gel composites. The structure of the electrospun composites is characterized by various analytical techniques such as X-ray diffraction (XRD), Fourier transforms infrared spectroscopy (FTIR), and scanning electron microscopy and energy-dispersive X-ray spectroscopy (SEM-EDAX). (Cu–Sr–HAP)/CS/PVA/Gel electrospun composite showed excellent antimicrobial activity compared to pure CS/PVA/Gel composite. In vitro biomineralization assay confirmed the formation of an apatite layer on the surface of (Cu–Sr–HAP)/CS/PVA/Gel composite. 65.45 ± 1.27 MPa tensile strength and 121.28 ± 1.76% elongation at break value are observed for the Cu–Sr–HAP)/CS/PVA/Gel electrospun composite.

Vorheriger Artikel Improvement of compressible regular solution model using Sanchez-Lacombe equation of state for phase behavior prediction of polymer blends

Nächster Artikel Gellan gum/guar gum films incorporated with honey as potential wound dressings

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Titel: Copper–strontium hydroxyapatite/chitosan/polyvinyl alcohol/gelatin electrospun composite and its biological studies for orthopedic applications
verfasst von: Narayanan Valarmathi
Kalidas Sabareeswari
Shanmugam Sumathi
Publikationsdatum: 25.03.2023
Verlag: Springer Berlin Heidelberg
Erschienen in: Polymer Bulletin / Ausgabe 2/2024
Print ISSN: 0170-0839
Elektronische ISSN: 1436-2449
DOI: https://doi.org/10.1007/s00289-023-04761-1

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