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Erschienen in:
02.01.2020
Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 3/2020
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Abstract
To meet the needs of high-temperature packaging for high-power devices, a novel Au–30Ga solder was designed and prepared, and its solderability was characterized in this work. The results showed that it was a eutectic alloy with a melting point of 450 ℃, consisting of AuGa phase and AuGa2 phase. The novel Au–30Ga solder possessed high thermal conductivity, excellent wettability and higher working temperature than traditional Au-based solders. The shear strength of Au–30Ga/Ni joint can reach 77.1 MPa, which was much higher than that of Au–20Sn/Ni and Au–12Ge/Ni joints. The addition of a trace amount of Ni helped to enhance the shear strength of the Au–30Ga/Ni joint, but had no significant effect on the microstructure of the Au–30Ga/Ni joint. Two Ni–Ga intermetallic compound layers were formed at the Au–30Ga/Ni interface, which thickened with an increase in soldering time. In addition, a new Au7Ga3 phase would be observed in the seam when the reflow time was more than 5 min.