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Erschienen in: Microsystem Technologies 12/2019

18.07.2019 | Technical Paper

Design, fabrication and reliability study of piezoelectric ZnO based structure for development of MEMS acoustic sensor

verfasst von: Ashish Kumar, Mahanth Prasad, Vijay Janyani, R. P. Yadav

Erschienen in: Microsystem Technologies | Ausgabe 12/2019

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Abstract

This paper reports a piezoelectric zinc oxide (ZnO) based acoustic sensor for high sound pressure level (SPL) with wide bandwidth for audio and aeroacoustic applications. The proposed structure has been simulated using finite element method (FEM) based MEMS-CAD tool Coventorware and optimized the dimensions of the diaphragm for a large dynamic range of 100-180 dB sound pressure level (SPL) and large bandwidth (22 kHz). The resonant frequency of the simulated structure is 67 kHz. Optimized structure dimensions have been chosen and fabricated the structure. The diaphragm structure has been released using bulk micromachining wet etching process. The ZnO thin film of 1.71 µm has been deposited using radio frequency (RF) sputtering technique and characterized using X-ray powder diffraction (XRD) and atomic force microscopy (AFM). The resonant frequency of the fabricated device is measured using laser doppler vibrometer (LDV) and found to be 65 kHz. The experimental sensitivity of the fabricated device is measured and is found to be 80 μV/Pa. The reliability testing of the fabricated structure was performed. The maximum current that can be passed across aluminum (Al) and deposited ZnO edge was found to be 2.69 A without any damage. The electrical characterization such as capacitance, loss (tan \(\delta\)) of fabricated device parameters were measured and the effects of frequency variation on both were also studied.

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Metadaten
Titel
Design, fabrication and reliability study of piezoelectric ZnO based structure for development of MEMS acoustic sensor
verfasst von
Ashish Kumar
Mahanth Prasad
Vijay Janyani
R. P. Yadav
Publikationsdatum
18.07.2019
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 12/2019
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-019-04524-x

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