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Microsystem Technologies

Micro- and Nanosystems Information Storage and Processing Systems

Microsystem Technologies OnlineFirst articles

18.11.2017 | Technical Paper

Laminated process effect of high-density redistributed trace lines on the risk estimation of induced-stress failure for 3D-IC embedded interposer

The embedded interposer carrier (EIC) technology for 3D-integrated circuits (3D-ICs) play an important role as a promising candidate to deal with the assembly/bonding processes of thin stacked chip and substrate. However, peeling stress of the …

17.11.2017 | Technical Paper

Design and manufacturing of X-band RF MEMS switches

In this article, we present the results of the design of different geometries for X-band RF MEMS switches. A number of mechanical and RF optimizations are described along with the results of test manufacturing and measurements. Different concepts …

17.11.2017 | Technical Paper

Response of thermoelastic microbeams to a periodic external transverse excitation based on MCS theory

In this paper, we investigated the dynamics vibration of clamped–clamped microbeams exposed to associate exterior cross excitation. The theory of modified couple stress (MCS) and thermoelasticity model based on replacing Fourier’s law (LS) are …

17.11.2017 | Technical Paper

Cell therapy using an array of ultrathin hollow microneedles

Cell transplantation traditionally employs needles to inject donor cells into tissues to treat certain diseases. However, it is difficult for the current method to achieve multiple parallel equidistant injections, which are ideal for cell therapy.

17.11.2017 | Technical Paper

Electrodeposition of Si–DLC nanocomposite film and its electronic application

In this study, a silicon doped diamond-like carbon (DLC) nanocomposite film was deposited electrochemically and it was used to fabricate an Ag/Si–DLC/p-Si metal–interlayer–semiconductor (MIS) Schottky diode. Methanol (CH3OH) was used as carbon and …

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Featuring rapid publication of important results, Microsystem Technologies examines electromechanical, materials, design, and manufacturing issues of microsystems and their components. It integrates the knowledge, experience, and capabilities of academic and industrial specialists in many fields. Moreover, it contributes to the economically and ecologically sound production of reliable, high performance MEMS and information storage and processing systems.

The journal’s coverage of MEMS/NEMS addresses sensors, actuators, and other micro/nanosystems as well as micromechatronic systems integration. Coverage of information storage systems includes magnetic recording, optical recording, and other recording devices. Lastly, under the category of processing systems, the journal explores copiers, printers, scanners, and digital cameras. All contributions meet international archival quality standards.

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