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Journal of Materials Science: Materials in Electronics

Erschienen in:

27.01.2021

Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing

verfasst von: Kai-kai Xu, Liang Zhang, Nan Jiang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 3/2021

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Abstract

Sn is the main interconnect material for three-dimensional (3D) Packaging of chip stacking in electronic packaging. In this paper, the intermetallic compound (IMC) produced through an interfacial reaction between Sn-xCNTs (x = 0, 0.075 wt%) solder and a Cu substrate was evaluated at 130 °C, 150 °C, and 170 °C for 30, 50, 100 h and after multiple reflows (3, 6, 9). In Sn-0.075CNTs system, CNTs inhibited the growth of Cu₆Sn₅ and refine the microstructure of solder joint. The growth rate of IMC decreased after reflowing and aging for 100 h. Compared to pure Sn/Cu system, the thickness of Cu₆Sn₅ and Cu₃Sn was the thinner when the CNTs addition amount was 0.075 wt%. Some voids and cracks were formed in solder joints after reflowing and thermal aging. At this time, the IMC growth activation energies of Sn solder is 33.256 kJ/mol, and that of Sn-0.075CNTs composite solder is 58.19 kJ/mol.

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N. Odashima, O. Minho, M. Kajihara et al., Formation of intermetallic compounds and microstructure evolution due to isothermal reactive diffusion at the interface between solid Co and liquid Sn. J. Electron. Mater. 49(2), 1568–1576 (2020)CrossRef

M. Zhao, L. Zhang, Z.Q. Liu et al., Structure and properties of Sn–Cu lead-free solders in electronics packaging. Sci. Technol. Adv. Mater. 20(1), 421–444 (2019)CrossRef

K.K. Xu, L. Zhang, L. Sun et al., The influence of carbon nanotubes on the properties of Sn solder. Mater. Trans. 61(3), 718–722 (2020)CrossRef

J. Mittal, K. Lin, Diffusion of elements during reflow aging of Sn–Zn solder in liquid state on Ni/Cu substrate theoretical and experimental study. Soldering Surf. Mount Technol. 30(3), 137–144 (2018)CrossRef

L. Zhang, Z.Q. Liu, Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm). J. Mater. Sci. 31(3), 2466–2480 (2020)

F. Peng, W. Liu, Y. Huang et al., Effect of stearic acid coating on anti-oxidation property of Sn–Ag–Cu solder powder. Solder. Surf. Mount Technol. 31(1), 68–74 (2019)CrossRef

H. Chen, T. Chou, C. Fleshman et al., Investigating the effect of Ag content on mechanical properties of Sn–Ag–Cu Micro-BGA joints. J. Electron. Mater. 48(10), 6866–6871 (2019)CrossRef

H. Ye, S.B. Xue, J.D. Luo et al., Properties and interfacial microstructure of Sn–Zn–Ga solder joint with rare earth Pr addition. Mater. Des. 46, 816–823 (2013)CrossRef

M.Y. Xiong, L. Zhang, H. Peng et al., Stress analysis and structural optimization of 3D IC package based on the Taguchi method. Soldering Surf. Mount Technolo. 32(1), 42–47 (2020)CrossRef

10.

L. Zhang, Z.Q. Liu, S.W. Chen et al., Materials, processing and reliability of low temperature bonding in 3D chip stacking. J. Alloy. Compd. 750, 980–995 (2018)CrossRef

11.

L. Sun, M.H. Chen, L. Zhang, Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints. J. Alloy. Compd. 786, 677–687 (2019)CrossRef

12.

M.Y. Xiong, L. Zhang, L. Sun et al., Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints. Vacuum 167, 301–306 (2019)CrossRef

13.

T. Hu, Y. Li, Y.C. Chan et al., Effect of nano Al₂O₃ particles doping on electromigration and mechanical properties of Sn-58Bi solder joints. Microelectron. Reliab. 55(8), 1226–1233 (2015)CrossRef

14.

C. Lee, K.D. Min, H.J. Park et al., Effect of Sn-decorated MWCNTs on the mechanical reliability of Sn-58Bi Solder. Electron. Mater. Lett. 15(6), 693–701 (2019)CrossRef

15.

R.M. Shalaby, H. Elzanaty, Effect of nano-Al₂O₃ particles on the microstructure and mechanical performance of melt-spun process Sn-3.5Ag composite solder. J. Mater. Sci. 31, 5907–5913 (2020)

16.

M. Yang, H.J. Ji, S. Wang et al., Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering. J. Alloy. Compd. 679, 18–25 (2016)CrossRef

17.

M.Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn–Ag–Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54(2), 1741–1768 (2019)CrossRef

18.

Mookam N, Tunthawiroon P, Kanlayasiri K. Effects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering. 9th International Conference on Mechatronics and Manufacturing. 2018, 361:012008

19.

N. Mookam, K. Kanlayasiri, Evolution of intermetallic compounds between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate during thermal aging. J. Mater. Sci. Technol. 28(1), 53–59 (2012)CrossRef

20.

S. Furtauer, D. Li, D.M. Cupid et al., The Cu–Sn phase diagram, Part I: new experimental results. Intermetallics 16, 142–147 (2013)CrossRef

21.

J. Bang, D. Yu, Y. Ko et al., Intermetallic compound growth between Sn–Cu–Cr lead-free solder and Cu substrate. Microelectron. Reliab. 99(99), 62–73 (2019)CrossRef

22.

K.N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer, New York, 2007), p. 117

23.

L. Tsao, S.Y. Chang, C.I. Lee et al., Effects of nano-Al₂O₃ additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Mater. Design 31(10), 4831–4835 (2010)CrossRef

24.

D. Ma, W.D. Wang, S.K. Lahiri, Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow. J. Appl. Phys. 91(5), 3312 (2002)CrossRef

25.

J. Bang, D. Yu, Y. Ko et al., Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint[J]. J. Alloy. Compd. 728, 992–1001 (2017)CrossRef

26.

N. Dariavach, P. Callahan, J. Liang et al., Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates. J. Electron. Mater. 35(7), 1581–1592 (2006)CrossRef

27.

J. Yoon, B. Noh, B. Kim et al., Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints. J. Alloy. Compd. 486(1), 142–147 (2009)CrossRef

28.

J.W. Yoon, Y.H. Lee, D.G. Kim et al., Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate. J. Alloy. Compd. 381(1–2), 151–157 (2004)CrossRef

29.

L.C. Tsao, Suppressing effect of 0.5 wt% nano-TiO₂ addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. J. Alloys Compd. 509(33), 8441–8448 (2011)CrossRef

Titel: Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing
verfasst von: Kai-kai Xu
Liang Zhang
Nan Jiang
Publikationsdatum: 27.01.2021
Verlag: Springer US
Erschienen in: Journal of Materials Science: Materials in Electronics / Ausgabe 3/2021
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-020-04755-z

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