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Metallurgical and Materials Transactions A
Erschienen in: Metallurgical and Materials Transactions A 7/2012

01.07.2012

Effect of Sn Addition in Preprecipitation Stage in Al-Cu Alloys: A Correlative Transmission Electron Microscopy and Atom Probe Tomography Study

verfasst von: Tomoyuki Homma, Michael P. Moody, David W. Saxey, Simon P. Ringer

Erschienen in: Metallurgical and Materials Transactions A | Ausgabe 7/2012

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Abstract

The effect of a trace addition of Sn (0.01 at. pct) in Al-1.7Cu (at. pct) alloy in the preprecipitation stage has been investigated by atom probe tomography (APT) and transmission electron microscopy (TEM). APT demonstrates that Sn clusters form independently of Cu in the as-quenched (AQ) state in Al-1.7Cu-0.01Sn alloy. The Sn clusters lead to the rapid nucleation of β-Sn precipitates during increased temperature aging. The APT analysis also indicates that Cu tends to cluster with Sn when the increased temperature aging commences. The TEM experiments revealed that GP zones formed during the first 30 seconds of aging at 473 K (200 °C) in both alloys. These GP zones were unstable and underwent a reversion reaction such that they were not detected after 180 seconds of aging. This process is thought to arise from heating rate effects and, at these higher temperatures, supplies a flux of Cu atoms that results in the heterogeneous nucleation of the θ′ (Al2Cu) phase.
Vorheriger Artikel Segregation of B, P, and C in the Ni-Based Superalloy, Inconel 718
Nächster Artikel Effect of Carbon Content on Microstructure and Mechanical Properties of 9 to 12 pct Cr Ferritic/Martensitic Heat-Resistant Steels

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Metadaten
Titel
Effect of Sn Addition in Preprecipitation Stage in Al-Cu Alloys: A Correlative Transmission Electron Microscopy and Atom Probe Tomography Study
verfasst von
Tomoyuki Homma
Michael P. Moody
David W. Saxey
Simon P. Ringer
Publikationsdatum
01.07.2012
Verlag
Springer US
Erschienen in
Metallurgical and Materials Transactions A / Ausgabe 7/2012
Print ISSN: 1073-5623
Elektronische ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-012-1111-y

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