Skip to main content
Erschienen in: Advances in Manufacturing 3/2013

01.09.2013

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

verfasst von: Liang Xu, Di Jiang, Yi-Feng Fu, Stephane Xavier, Shailendra Bansropun, Afshin Ziaei, Shan-Tung Tu, Johan Liu

Erschienen in: Advances in Manufacturing | Ausgabe 3/2013

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Due to their unique thermal, electronic and mechanical properties, carbon nanotubes (CNTs) have aroused various attentions of many researchers. Among all the techniques to fabricate CNTs, plasma enhanced chemical vapor deposition (PECVD) has been extensively developed as one growth technique to produce vertically-aligned carbon nanotubes (VACNTs). Though CNTs show a trend to be integrated into nanoelectromechanical system (NEMS), CNT growth still remains a mysterious technology. This paper attempts to reveal the effects of substrates and underlayers to CNT synthesis. We tried five different substrates by substituting intrinsic Si with high resistivity ones and by increasing the thickness of SiO2 insulativity layer. And also, we demonstrated an innovative way of adjusting CNT density by changing the thickness of Cu underlayer.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Che J, Çagin T, Goddard WA (2000) Thermal conductivity of carbon nanotubes. Nanotechnology 11(2):65–69CrossRef Che J, Çagin T, Goddard WA (2000) Thermal conductivity of carbon nanotubes. Nanotechnology 11(2):65–69CrossRef
2.
Zurück zum Zitat Huxtable ST, Cahill DG, Shenogin S, Xue L, Ozisik R, Barone P, Usrey M, Strano MS, Siddons G, Shim M, Keblinski P (2003) Interfacial heat flow in carbon nanotube suspensions. Nat Mater 2(11):731–734CrossRef Huxtable ST, Cahill DG, Shenogin S, Xue L, Ozisik R, Barone P, Usrey M, Strano MS, Siddons G, Shim M, Keblinski P (2003) Interfacial heat flow in carbon nanotube suspensions. Nat Mater 2(11):731–734CrossRef
3.
Zurück zum Zitat Allaoui A, Bai S, Cheng H, Bai J (2002) Mechanical and electrical properties of a MWNT/epoxy composite. Compos Sci Technol 62(15):1993–1998CrossRef Allaoui A, Bai S, Cheng H, Bai J (2002) Mechanical and electrical properties of a MWNT/epoxy composite. Compos Sci Technol 62(15):1993–1998CrossRef
4.
Zurück zum Zitat Salvetat JP, Bonard JM, Thomson NH, Kulik AJ, Forró L, Benoit W, Zuppiroli L (1999) Mechanical properties of carbon nanotubes. Appl Phys A 69(3):255–260 Salvetat JP, Bonard JM, Thomson NH, Kulik AJ, Forró L, Benoit W, Zuppiroli L (1999) Mechanical properties of carbon nanotubes. Appl Phys A 69(3):255–260
5.
Zurück zum Zitat McEuen PL, Fuhrer MS, Park H (2002) Single-walled carbon nanotube electronics. IEEE Trans Nanotechnol 1(1):78–85CrossRef McEuen PL, Fuhrer MS, Park H (2002) Single-walled carbon nanotube electronics. IEEE Trans Nanotechnol 1(1):78–85CrossRef
6.
Zurück zum Zitat Lau AKT, Hui D (2002) The revolutionary creation of new advanced materials—carbon nanotube composites. Compos Part B: Eng 33(4):263–277 Lau AKT, Hui D (2002) The revolutionary creation of new advanced materials—carbon nanotube composites. Compos Part B: Eng 33(4):263–277
7.
Zurück zum Zitat Thostenson ET, Ren Z, Chou TW (2001) Advances in the science and technology of carbon nanotubes and their composites: a review. Compos Sci Technol 61(13):1899–1912 Thostenson ET, Ren Z, Chou TW (2001) Advances in the science and technology of carbon nanotubes and their composites: a review. Compos Sci Technol 61(13):1899–1912
8.
Zurück zum Zitat Bohr MT (2002) Nanotechnology goals and challenges for electronic applications. IEEE Trans Nanotechnol 1(1):56–62CrossRef Bohr MT (2002) Nanotechnology goals and challenges for electronic applications. IEEE Trans Nanotechnol 1(1):56–62CrossRef
9.
Zurück zum Zitat Jang JE, Cha SN, Choi YJ, Kang DJ, Butler TP, Hasko DG, Jung JE, Kim JM, Amaratunga GAJ (2008) Nanoscale memory cell based on a nanoelectromechanical switched capacitor. Nat Nanotechnol 3(1):26–30CrossRef Jang JE, Cha SN, Choi YJ, Kang DJ, Butler TP, Hasko DG, Jung JE, Kim JM, Amaratunga GAJ (2008) Nanoscale memory cell based on a nanoelectromechanical switched capacitor. Nat Nanotechnol 3(1):26–30CrossRef
10.
Zurück zum Zitat Huczko A (2000) Template-based synthesis of nanomaterials. Appl Phys A 70(4):365–376CrossRef Huczko A (2000) Template-based synthesis of nanomaterials. Appl Phys A 70(4):365–376CrossRef
11.
Zurück zum Zitat Jiang D, Wang T, Chen S, Ye L, Liu J (2013) Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application. Microelectron Eng 103:177–180CrossRef Jiang D, Wang T, Chen S, Ye L, Liu J (2013) Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application. Microelectron Eng 103:177–180CrossRef
12.
Zurück zum Zitat Fu Y, Nabiollahi N, Wang T, Wang S, Hu Z, Carlberg B, Zhang Y, Wang X, Liu J (2012) A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity. Nanotechnology 23(4):045304CrossRef Fu Y, Nabiollahi N, Wang T, Wang S, Hu Z, Carlberg B, Zhang Y, Wang X, Liu J (2012) A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity. Nanotechnology 23(4):045304CrossRef
13.
Zurück zum Zitat Huang ZP, Wang DZ, Wen JG, Sennett M, Gibson H, Ren ZF (2002) Effect of nickel, iron and cobalt on growth of aligned carbon nanotubes. Appl Phys A 74(3):387–391CrossRef Huang ZP, Wang DZ, Wen JG, Sennett M, Gibson H, Ren ZF (2002) Effect of nickel, iron and cobalt on growth of aligned carbon nanotubes. Appl Phys A 74(3):387–391CrossRef
14.
Zurück zum Zitat Kim SM, Gangloff L (2011) Thermal chemical vapor deposition (T-CVD) growth of carbon nanotubes on different metallic underlayers. Phys E: Low-Dimens Syst Nanostruct 43(8):1481–1485CrossRef Kim SM, Gangloff L (2011) Thermal chemical vapor deposition (T-CVD) growth of carbon nanotubes on different metallic underlayers. Phys E: Low-Dimens Syst Nanostruct 43(8):1481–1485CrossRef
15.
Zurück zum Zitat Hu JL, Yang CC, Huang JH (2008) Vertically-aligned carbon nanotubes prepared by water-assisted chemical vapor deposition. Diam Relat Mater 17(12):2084–2088CrossRef Hu JL, Yang CC, Huang JH (2008) Vertically-aligned carbon nanotubes prepared by water-assisted chemical vapor deposition. Diam Relat Mater 17(12):2084–2088CrossRef
16.
Zurück zum Zitat Ziaei A, Charles M, Le Baillif M, Xavier S, Caillard A, Cojocaru Cs (2010) Capacitive and ohmic RF NEMS switches based on vertical carbon nanotubes. Int J Microw Wirel Technol 2(5):433–440 Ziaei A, Charles M, Le Baillif M, Xavier S, Caillard A, Cojocaru Cs (2010) Capacitive and ohmic RF NEMS switches based on vertical carbon nanotubes. Int J Microw Wirel Technol 2(5):433–440
17.
Zurück zum Zitat Feng Z, Lueck MR, Temple DS, Steer MB (2012) High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits. IEEE Trans Microw Theory Tech 60(7):2066–2072CrossRef Feng Z, Lueck MR, Temple DS, Steer MB (2012) High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits. IEEE Trans Microw Theory Tech 60(7):2066–2072CrossRef
18.
Zurück zum Zitat Zhang F, Shi L, Li C (2005) Cpw transmission insertion loss on Si and Soi substrates. Microw J 48(11):138–142 Zhang F, Shi L, Li C (2005) Cpw transmission insertion loss on Si and Soi substrates. Microw J 48(11):138–142
19.
Zurück zum Zitat Teo KBK, Chhowalla M, Amaratunga GAJ, Milne WI, Legagneux P, Pirio G, Gangloff L, Pribat D, Semet V, Binh VT, Bruenger WH, Eichholz J, Hanssen H, Friedrich D, Lee SB, Hasko DG, Ahmed H (2003) Fabrication and electrical characteristics of carbon nanotube-based microcathodes for use in a parallel electron-beam lithography system. J Vac Sci Technol B: Microelectron Nanometer Struct 21(2):693–697CrossRef Teo KBK, Chhowalla M, Amaratunga GAJ, Milne WI, Legagneux P, Pirio G, Gangloff L, Pribat D, Semet V, Binh VT, Bruenger WH, Eichholz J, Hanssen H, Friedrich D, Lee SB, Hasko DG, Ahmed H (2003) Fabrication and electrical characteristics of carbon nanotube-based microcathodes for use in a parallel electron-beam lithography system. J Vac Sci Technol B: Microelectron Nanometer Struct 21(2):693–697CrossRef
Metadaten
Titel
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD
verfasst von
Liang Xu
Di Jiang
Yi-Feng Fu
Stephane Xavier
Shailendra Bansropun
Afshin Ziaei
Shan-Tung Tu
Johan Liu
Publikationsdatum
01.09.2013
Verlag
Springer Berlin Heidelberg
Erschienen in
Advances in Manufacturing / Ausgabe 3/2013
Print ISSN: 2095-3127
Elektronische ISSN: 2195-3597
DOI
https://doi.org/10.1007/s40436-013-0036-z

Weitere Artikel der Ausgabe 3/2013

Advances in Manufacturing 3/2013 Zur Ausgabe

EditorialNotes

Guest editorial

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.