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Erschienen in:
01.09.2011
Effects of temperature and strain rate on fracture properties of amorphous silicon nitride
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 9/2011
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Abstract
The high temperature mechanical behaviours of silicon nitride are difficult to be investigated because it is hard to measure these structural changes in the mechanical test. Atomistic simulation is a proper way to investigate the structural-mechanical mechanism at high temperatures. In this paper, the structural and fracture properties of amorphous silicon nitride (a-Si3N4) were studied at different temperatures. The simulation results consist with the experiments on radial distribution function, temperature-dependent yield stress and Young’s modulus. Moreover, the effects of strain rate on mechanical properties were also studied, the results show a higher strain rate lead to larger yield stress and Young’s modulus.