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Erschienen in: Microsystem Technologies 7/2008

01.07.2008 | Technical Paper

Experimental characterization of electrostatically actuated in-plane bending of microcantilevers

verfasst von: A. Ballestra, E. Brusa, M. Gh Munteanu, A. Somà

Erschienen in: Microsystem Technologies | Ausgabe 7/2008

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Abstract

Experimental validation of numerical models developed by the authors to predict the static behaviour of microelectrostatic actuators is described. Cantilever microbeams, currently used in connection with RF-MEMS and micro-scale material testing were analysed. A set of microcantilevers, bending in the plane of the wafer, i.e. in the same plane as the profiling system’s target, was tested. This differs from the popular case of out-of-plane microbeams, usually studied in the literature. Geometry nonlinearity caused by large deflection of the microbeam was investigated and nonlinear coupled formulation of electromechanical equilibrium was performed. Coupled-field analysis was implemented using the Finite Element Method (FEM), to predict displacements and pull-in voltage measured by Fogale Zoomsurf 3D, subsequently plotting the displacement-versus-voltage curve to complete model validation. FEM nonlinear analysis, based on iterative approach with mesh morphing, and FEM non-incremental approach, including a special element proposed by the authors, are compared to the linear solution and to experimental results. Geometry nonlinearity appears relevant in microbeam modelling and requires a nonlinear solution of the coupled problem. Investigative work, which compared the results of 2D and 3D models to experimental data, revealed that some three dimensional effects are significant in model validation, but the 2D approach may be effective in predicting static behaviour provided that at least a microbeam thickness equivalent is adopted.

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Metadaten
Titel
Experimental characterization of electrostatically actuated in-plane bending of microcantilevers
verfasst von
A. Ballestra
E. Brusa
M. Gh Munteanu
A. Somà
Publikationsdatum
01.07.2008
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 7/2008
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-008-0597-0

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