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Erschienen in: Microsystem Technologies 8/2009

01.08.2009 | Technical Paper

Experimental validation of compact damping models of perforated MEMS devices

verfasst von: Timo Veijola, Giorgio De Pasquale, Aurelio Somà

Erschienen in: Microsystem Technologies | Ausgabe 8/2009

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Abstract

Measured damping coefficients of six different perforated micromechanical test structures are compared with damping coefficients given by published compact models. The motion of the perforated plates is almost translational, the surface shape is rectangular, and the perforation is uniform validating the assumptions made for compact models. In the structures, the perforation ratio varies from 24 to 59%. The study of the structure shows that the compressibility and inertia do not contribute to the damping at the frequencies used (130–220 kHz). The damping coefficients given by all four compact models underestimate the measured damping coefficient by approximately 20%. The reasons for this underestimation are discussed by studying the various flow components in the models.

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Literatur
Zurück zum Zitat Feng C, Zhao P, Liu DQ (2007) Squeeze-film effects in MEMS devices with perforated plates for small amplitude vibration. Microsyst Technol 13:623–633 Feng C, Zhao P, Liu DQ (2007) Squeeze-film effects in MEMS devices with perforated plates for small amplitude vibration. Microsyst Technol 13:623–633
Zurück zum Zitat Kim ES, Cho YH, Kim MU (1999) Effect of holes and edges on the squeeze film damping of perforated micromechanical structures. In: Proceedings of IEEE micro electro mechanical systems conference, pp 296–301 Kim ES, Cho YH, Kim MU (1999) Effect of holes and edges on the squeeze film damping of perforated micromechanical structures. In: Proceedings of IEEE micro electro mechanical systems conference, pp 296–301
Zurück zum Zitat Mehner JE, Dötzel W, Schauwecker B, Ostergaard D (2003) Reduced order modeling of fluid structural interactions in mems based on modal projection techniques. In: Proceedings of transducers’03, Boston, pp 1840–1843 Mehner JE, Dötzel W, Schauwecker B, Ostergaard D (2003) Reduced order modeling of fluid structural interactions in mems based on modal projection techniques. In: Proceedings of transducers’03, Boston, pp 1840–1843
Zurück zum Zitat Mohite SS, Kesari H, Sonti VR, Pratap R (2005) Analytical solutions for the stiffness and damping coefficients of squeeze films in MEMS devices with perforated back plates. J Micromech Microeng 15:2083–2092. doi:10.1088/0960-1317/15/11/013 CrossRef Mohite SS, Kesari H, Sonti VR, Pratap R (2005) Analytical solutions for the stiffness and damping coefficients of squeeze films in MEMS devices with perforated back plates. J Micromech Microeng 15:2083–2092. doi:10.​1088/​0960-1317/​15/​11/​013 CrossRef
Zurück zum Zitat Pandey AK, Pratap R (2008) A comparative study of analytical squeeze film damping models in rigid perforated MEMS structures with experimental results. Microfluidics Nanofluidics 4:205–218. doi:10.1007/s10404-007-0165-4 CrossRef Pandey AK, Pratap R (2008) A comparative study of analytical squeeze film damping models in rigid perforated MEMS structures with experimental results. Microfluidics Nanofluidics 4:205–218. doi:10.​1007/​s10404-007-0165-4 CrossRef
Zurück zum Zitat Sattler R, Wachutka G (2004) Compact models for squeeze-film damping in the slip flow regime. In Proceeidings of the 7th international conference on modeling and simulation of microsystems, MSM2004, Boston, pp 243–246 Sattler R, Wachutka G (2004) Compact models for squeeze-film damping in the slip flow regime. In Proceeidings of the 7th international conference on modeling and simulation of microsystems, MSM2004, Boston, pp 243–246
Zurück zum Zitat Schrag G, Wachutka G (2004) Accurate system-level damping model for highly perforated micromechanical devices. Sensors Actuator A Phys 111:222–228CrossRef Schrag G, Wachutka G (2004) Accurate system-level damping model for highly perforated micromechanical devices. Sensors Actuator A Phys 111:222–228CrossRef
Zurück zum Zitat Somà A, De Pasquale G (2007) Identification of test structures for reduced order modeling of the squeeze film damping in MEMS. In: Proceedings of DTIP symposium on design, test, integration and packaging of MEMS and MOEMS, Stresa, pp 230–239 Somà A, De Pasquale G (2007) Identification of test structures for reduced order modeling of the squeeze film damping in MEMS. In: Proceedings of DTIP symposium on design, test, integration and packaging of MEMS and MOEMS, Stresa, pp 230–239
Zurück zum Zitat Somà A, De Pasquale G (2008) Numerical and experimental comparison of MEMS suspended plates dynamic behaviour under Squeeze film damping effect. Analog Integr Circuits Signal Process 57:213–224 Somà A, De Pasquale G (2008) Numerical and experimental comparison of MEMS suspended plates dynamic behaviour under Squeeze film damping effect. Analog Integr Circuits Signal Process 57:213–224
Zurück zum Zitat Veijola T (2006b) Analytic damping model for a square perforation cell. In: Proceedings of the 9th international conference on modeling and simulation of microsystems, Boston, pp 554–557 Veijola T (2006b) Analytic damping model for a square perforation cell. In: Proceedings of the 9th international conference on modeling and simulation of microsystems, Boston, pp 554–557
Zurück zum Zitat Veijola T, Mattila T (2001) Compact squeezed-film damping model for perforated surface. In: Proceedings of transducers’01, Munich, pp 1506–1509 Veijola T, Mattila T (2001) Compact squeezed-film damping model for perforated surface. In: Proceedings of transducers’01, Munich, pp 1506–1509
Zurück zum Zitat Veijola T, De Pasquale G, Somà A (2008) Comparison between damping coefficients of measured perforated structures and compact models. In: Proceedings of DTIP symposium on design, test, integration and packaging of MEMS and MOEMS, Nice, pp 236–241 Veijola T, De Pasquale G, Somà A (2008) Comparison between damping coefficients of measured perforated structures and compact models. In: Proceedings of DTIP symposium on design, test, integration and packaging of MEMS and MOEMS, Nice, pp 236–241
Metadaten
Titel
Experimental validation of compact damping models of perforated MEMS devices
verfasst von
Timo Veijola
Giorgio De Pasquale
Aurelio Somà
Publikationsdatum
01.08.2009
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 8/2009
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-009-0793-6

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