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Journal of Materials Engineering and Performance
Erschienen in: Journal of Materials Engineering and Performance 4/2017

13.03.2017

Facile Electrochemical Method to Improve Surface Features of Pure Copper in Dilute Basic Solutions

verfasst von: Arash Fattah-alhosseini, Omid Imantalab, Farid Reza Attarzadeh, Navid Attarzadeh

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 4/2017

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Abstract

Electrochemical properties of coarse and nano-grained pure copper can be modified and improved effectively through applying cyclic potentiodynamic passivation (CPP) treatment. It is found that the success of this method depends up to a large extent on grain size. Eight passes of accumulative roll bonding processing are successfully used at room temperature to produce nano-grained pure copper. Transmission electron microscopy image and selected area diffraction pattern both attest to the occurrence of intense grain refinement under the influence of aforementioned process, in which an average grain size <100 nm is attainable. Using several electrochemical characterization methods reveals that CPP treatment fully exploits potentials of nano-grained samples to form a dense and thick protective passive film. It is speculated that high-quality passive layers relate to the presence of high-density structural defects on the surface of nano-grained samples.
Vorheriger Artikel Rapid Tempering of Martensitic Stainless Steel AISI420: Microstructure, Mechanical and Corrosion Properties
Nächster Artikel Influence of Al2O3 Particle Size on Microstructure, Mechanical Properties and Abrasive Wear Behavior of Flame-Sprayed and Remelted NiCrBSi Coatings

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Literatur
1.
H.S. Khatak and B. Raj, Corrosion of Austenitic Stainless Steels: Mechanism, Mitigation and Monitoring, Elsevier, Amsterdam, 2002CrossRef
2.
X. Liu, P. Chu, and C. Ding, Surface Modification of Titanium, Titanium Alloys, and Related Materials for Biomedical Applications, Mater. Sci. Eng. R Rep., 2004, 47, p 49–121CrossRef
3.
A. Shahryari, F. Azari, H. Vali, and S. Omanovic, The Positive Influence of Electrochemical Cyclic Potentiodynamic Passivation (CPP) of a SS316LS Surface on Its Response to Fibronectin and Pre-Osteoblasts, Phys. Chem. Chem. Phys., 2009, 11, p 6218–6224CrossRef
4.
A. Shahryari, S. Omanovic, and J.A. Szpunar, Enhancement of Biocompatibility of 316LVM Stainless Steel by Cyclic Potentiodynamic Passivation, J. Biomed. Mater. Res. A, 2009, 89, p 1049–1062CrossRef
5.
A. Shahryari, W. Kamal, and S. Omanovic, The Effect of Surface Roughness on the Efficiency of the Cyclic Potentiodynamic Passivation (CPP) Method in the Improvement of General and Pitting Corrosion Resistance of 316LVM Stainless Steel, Mater. Lett., 2008, 62, p 3906–3909CrossRef
6.
M. Vuković, The Formation and Growth of Hydrous Oxide Film on Stainless Steel in Alkaline Solution by Potential Cycling, Corros. Sci., 1995, 37, p 111–120CrossRef
7.
A.L.M. Costa, A.C.C. Reis, L. Kestens, and M.S. Andrade, Ultra Grain Refinement and Hardening of IF-Steel During Accumulative Roll-Bonding, Mater. Sci. Eng. A, 2005, 406, p 279–285CrossRef
8.
M. Eizadjou, H.D. Manesh, and K. Janghorban, Microstructure and Mechanical Properties of Ultra-Fine Grains (UFGs) Aluminum Strips Produced by ARB Process, J. Alloys Compd., 2009, 474, p 406–415CrossRef
9.
R. Jamaati and M.R. Toroghinejad, Effect of Stacking Fault Energy on Mechanical Properties of Nanostructured FCC Materials Processed by the ARB Process, Mater. Sci. Eng. A, 2014, 606, p 443–450CrossRef
10.
A. Rezaee-Bazzaz, S. Ahmadian, and H. Reihani, Modeling of Microstructure and Mechanical Behavior of Ultra Fine Grained Aluminum Produced by Accumulative Roll-Bonding, Mater. Des., 2011, 32, p 4580–4585CrossRef
11.
F. Salimyanfard, M.R. Toroghinejad, F. Ashrafizadeh, M. Hoseini, and J.A. Szpunar, Investigation of Texture and Mechanical Properties of Copper Processed by New Route of Equal Channel Angular Pressing, Mater. Des., 2013, 44, p 374–381CrossRef
12.
M.R. Toroghinejad, R. Jamaati, J. Dutkiewicz, and J.A. Szpunar, Investigation of Nanostructured Aluminum/Copper Composite Produced by Accumulative Roll Bonding and Folding Process, Mater. Des., 2013, 51, p 274–279CrossRef
13.
L.S. Toth and C. Gu, Ultrafine-Grain Metals by Severe Plastic Deformation, Mater. Charact., 2014, 92, p 1–14CrossRef
14.
M. Karimi and M.R. Toroghinejad, An Alternative Method for Manufacturing High-Strength CP Ti–SiC Composites by Accumulative Roll Bonding Process, Mater. Des., 2014, 59, p 494–501CrossRef
15.
M. Karimi, M.R. Toroghinejad, and K. Farmanesh, Multi-Response Optimization on the Annealing of Accumulative Roll Bonded Monolithic Ti and Ti–SiCp Composites, Mater. Des., 2015, 65, p 34–41CrossRef
16.
A. Fattah-alhosseini and S. Vafaeian, Comparison of Electrochemical Behavior Between Coarse-Grained and Fine-Grained AISI, 430 Ferritic Stainless Steel by Mott–Schottky Analysis and EIS Measurements, J. Alloys Compd., 2015, 639, p 301–307CrossRef
17.
K.D. Ralston and N. Birbilis, Effect of Grain Size on Corrosion: A Review, Corrosion, 2010, 66, p 075005–075005 – 13CrossRef
18.
M. Pérez Sánchez, M. Barrera, S. González, R.M. Souto, R.C. Salvarezza, and A.J. Arvia, Electrochemical Behaviour of Copper in Aqueous Moderate Alkaline Media, Containing Sodium Carbonate and Bicarbonate, and Sodium Perchlorate, Electrochim. Acta, 1990, 35, p 1337–1343CrossRef
19.
R.M. Souto, S. González, R.C. Salvarezza, and A.J. Arvia, Kinetics of Copper Passivation and Pitting Corrosion in Na2SO4 Containing Dilute NaOH Aqueous Solution, Electrochim. Acta, 1994, 39, p 2619–2628CrossRef
20.
M.M. Laz, R.M. Souto, S. González, R.C. Salvarezza, and A.J. Arvia, The Formation of Anodic Layers on Annealed Copper Surfaces in Phosphate-Containing Solutions at Different pH, Electrochim. Acta, 1992, 37, p 655–663CrossRef
21.
Y. Ling, M.L. Taylor, S. Sharifiasl, and D.D. Macdonald, The Semiconducting Properties and Impedance Analysis of Passive Films on Copper in Anoxic Sulfide-Containing Solutions from the Viewpoint of the Point Defect Model, ECS Trans., 2013, 50, p 53–67CrossRef
22.
H.D. Speckmann, S. Haupt, and H.-H. Strehblow, A Quantitative Surface Analytical Study of Electrochemically-Formed Copper Oxides by XPS and x-ray-Induced Auger Spectroscopy, Surf. Interface Anal., 1988, 11, p 148–155CrossRef
23.
W. Kautek, M. Geub, M. Sahre, P. Zhao, and S. Mirwald, Multi-Method Analysis Of The Metal/Electrolyte Interface: Scanning Force Microscopy (SFM), Quartz Microbalance Measurements (QMB), Fourier Transform Infrared Spectroscopy (FTIR) and Grazing Incidence x-ray Diffractometry (GIXD) at a Polycrystalline Copper, Surf. Interface Anal., 1997, 25, p 548–560CrossRef
24.
A. Nikfahm, I. Danaee, A. Ashrafi, and M.R. Toroghinejad, Corrosion Behavior of Ultra Fine Grain Copper Produced by Accumulative Roll Bonding Process, Trans. Indian Inst. Met., 2013, 67, p 115–121CrossRef
25.
A. Nikfahm, I. Danaee, A. Ashrafi, and M.R. Toroghinejad, Effect of Grain Size Changes on Corrosion Behavior of Copper Produced by Accumulative Roll Bonding Process, Mater. Res., 2013, 16, p 1379–1386CrossRef
26.
A. Fattah-alhosseini and O. Imantalab, Effect of Accumulative Roll Bonding Process on the Electrochemical Behavior of Pure Copper, J. Alloys Compd., 2015, 632, p 48–52CrossRef
27.
O. Imantalab and A. Fattah-alhosseini, Electrochemical and Passive Behaviors of Pure Copper Fabricated by Accumulative Roll-Bonding (ARB) Process, J. Mater. Eng. Perform., 2015, 24, p 2579–2585CrossRef
28.
A. Fattah-alhosseini, O. Imantalab, Y. Mazaheri, and M.K. Keshavarz, Microstructural Evolution, Mechanical Properties, and Strain Hardening Behavior of Ultrafine Grained Commercial Pure Copper During the Accumulative Roll Bonding Process, Mater. Sci. Eng. A, 2016, 650, p 8–14CrossRef
29.
M. Shaarbaf and M.R. Toroghinejad, Nano-Grained Copper Strip Produced by Accumulative Roll Bonding Process, Mater. Sci. Eng. A, 2008, 473, p 28–33CrossRef
30.
Z. Wu, J. Chen, N. Piao, C. Sun, W. Hassan, X. Zhang et al., Electrochemical Corrosion Behavior of Bulk Ultra-Fine Grained Fe-Ni-Cr Alloy, Trans. Nonferrous Met. Soc. China, 2014, 24, p 1989–1994CrossRef
31.
H. Maleki-Ghaleh, K. Hajizadeh, A. Hadjizadeh, M.S. Shakeri, S. Ghobadi Alamdari, S. Masoudfar et al., Electrochemical and Cellular Behavior of Ultrafine-Grained Titanium In Vitro, Mater. Sci. Eng. C Mater. Biol. Appl., 2014, 39, p 299–304CrossRef
32.
C. Escrivà-Cerdán, E. Blasco-Tamarit, D.M. García-García, J. García-Antón, and A. Guenbour, Effect of Potential Formation on the Electrochemical Behaviour of a Highly Alloyed Austenitic Stainless Steel in Contaminated Phosphoric Acid at Different Temperatures, Electrochim. Acta, 2012, 80, p 248–256CrossRef
33.
L. Hamadou, L. Aïnouche, A. Kadri, S.A.A. Yahia, and N. Benbrahim, Electrochemical Impedance Spectroscopy Study of Thermally Grown Oxides Exhibiting Constant Phase Element Behaviour, Electrochim. Acta, 2013, 113, p 99–108CrossRef
34.
C. Escrivà-Cerdán, E. Blasco-Tamarit, D.M. García-García, J. García-Antón, R. Akid, and J. Walton, Effect of Temperature on Passive Film Formation of UNS N08031 Cr-Ni Alloy in Phosphoric Acid Contaminated with Different Aggressive Anions, Electrochim. Acta, 2013, 111, p 552–561CrossRef
35.
J.E. González and J. Mirza-Rosca, Study of the Corrosion Behavior of Titanium And Some of Its Alloys for Biomedical and Dental Implant Applications, J. Electroanal. Chem., 1999, 471, p 109–115CrossRef
36.
Q.J. Wang, M.S. Zheng, and J.W. Zhu, Semi-Conductive Properties of Passive Films Formed on Copper in Chromate Solutions, Thin Solid Films, 2009, 517, p 1995–1999CrossRef
37.
B. Zhang, Y. Li, and F. Wang, Electrochemical Corrosion Behaviour of Microcrystalline Aluminium in Acidic Solutions, Corros. Sci., 2007, 49, p 2071–2082CrossRef
38.
H. Wu, Y. Wang, Q. Zhong, M. Sheng, H. Du, and Z. Li, The semi-Conductor Property and Corrosion Resistance of Passive Film on Electroplated Ni and Cu-Ni Alloys, J. Electroanal. Chem., 2011, 663, p 59–66CrossRef
39.
A. Fattah-alhosseini and O. Imantalab, Passivation Behavior of Ultra-Fine Grained Pure Copper Fabricated by Accumulative Roll Bonding (ARB) Process, Metall. Mater. Trans. A, 2016, 47A, p 572–580CrossRef
40.
O. Imantalab and A. Fattah-alhosseini, Effect of Accumulative Roll Bonding (ARB) Process on the Electrochemical Behavior of Pure Copper in 0.01 M KOH Solution, Anal. Bioanal. Electrochem., 2015, 7(2), p 210–219
41.
O. Imantalab, A. Fattah-alhosseini, Y. Mazaheri, and M.K. Keshavarz, Electrochemical Behavior of Pure Copper in Phosphate Buffer Solutions: A Comparison Between Micro- and Nano-Grained Copper, J. Mater. Eng. Perform., 2016, 25, p 697–703CrossRef
42.
O. Imantalab, A. Fattah-alhosseini, Y. Mazaheri, and M.K. Keshavarz, Strengthening Mechanisms and Electrochemical Behavior of Ultrafine Grained Commercial Pure Copper Fabricated by Accumulative Roll Bonding, Metall. Mater. Trans. A, 2016, 47A, p 3684–3693CrossRef
43.
Q.J. Zhong, YuL Bin, Y. Xiao, Y. Wang, Q.Y. Zhou, and Q.D. Zhong, The Effect of Grain Size and Cl− Concentration on the Passive Behavior of Cu in Borate Buffer Solution, Adv. Mater. Res., 2013, 785–786, p 928–932CrossRef
44.
A.V. Syugaev, E.A. Pechina, N.V. Lyalina, S.F. Lomaeva, M.V. Mar’in, and S.M. Reshetnikov, The Influence of the Ultrafine-Grained Structure on Passivation of Copper, Prot. Met. Phys. Chem. Surfaces, 2014, 50, p 841–845CrossRef
45.
H. Miyamoto, K. Harada, T. Mimaki, A. Vinogradov, and S. Hashimoto, Corrosion of Ultra-Fine Grained Copper Fabricated by Equal-Channel Angular Pressing, Corros. Sci., 2008, 50, p 1215–1220CrossRef
46.
J.K. Yu, E.H. Han, L. Lu, X.J. Wei, and M. Leung, Corrosion Behaviors of Nanocrystalline and Conventional Polycrystalline Copper, J. Mater. Sci., 2005, 40, p 1019–1022CrossRef
47.
R.J. Hellmig, M. Janecek, B. Hadzima, O.V. Gendelman, M. Shapiro, X. Molodova et al., A Portrait of Copper Processed by Equal Channel Angular Pressing, Mater. Trans., 2008, 49, p 31–37CrossRef
48.
X.X. Xu, F.L. Nie, J.X. Zhang, W. Zheng, Y.F. Zheng, C. Hu et al., Corrosion and Ion Release Behavior of Ultra-Fine Grained Bulk Pure Copper Fabricated by ECAP in Hanks Solution as Potential Biomaterial for Contraception, Mater. Lett., 2010, 64, p 524–527CrossRef
49.
A. Fattah-alhosseini and S. Vafaeian, Influence of Grain Refinement on the Electrochemical Behavior of AISI, 430 Ferritic Stainless Steel in an Alkaline Solution, Appl. Surf. Sci., 2016, 360, p 921–928CrossRef
Metadaten
Titel
Facile Electrochemical Method to Improve Surface Features of Pure Copper in Dilute Basic Solutions
verfasst von
Arash Fattah-alhosseini
Omid Imantalab
Farid Reza Attarzadeh
Navid Attarzadeh
Publikationsdatum
13.03.2017
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 4/2017
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-017-2613-y

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