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2010 | OriginalPaper | Buchkapitel

6. GD-MOSFET Structure

verfasst von : B. Jayant Baliga

Erschienen in: Advanced Power MOSFET Concepts

Verlag: Springer US

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Abstract

In the previous chapter, it was demonstrated that the specific on-resistance for power MOSFET structures can be greatly reduced by utilizing the two-dimensional charge-coupling concept. In these structures, a uniform doping concentration was assumed for the drift region. Although the electric field profile in this case is superior to that observed for a one-dimensional junction, the electric field was found to be non-uniform through the drift region. This non-uniformity of the electric field is relatively small for devices with low (∼30 V) blocking voltage capability. However, when the desired blocking voltage is large (60–200 V), the electric field varies exponentially with distance in the uniformly doped drift region resulting in a low electric field through a large portion of the distance between the drain and source regions.

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Literatur
1.
Zurück zum Zitat B.J. Baliga, “Vertical Field Effect Transistors having improved Breakdown Voltage Capability and Low On-state Resistance”, U.S. Patent # 5,637,898, Issued June 10, 1997. B.J. Baliga, “Vertical Field Effect Transistors having improved Breakdown Voltage Capability and Low On-state Resistance”, U.S. Patent # 5,637,898, Issued June 10, 1997.
2.
Zurück zum Zitat B.J. Baliga, “Power Semiconductor Devices having improved High Frequency Switching and Breakdown Characteristics”, U.S. Patent # 5,998,833, Issued December 7, 1999. B.J. Baliga, “Power Semiconductor Devices having improved High Frequency Switching and Breakdown Characteristics”, U.S. Patent # 5,998,833, Issued December 7, 1999.
3.
Zurück zum Zitat B.J. Baliga, “Trends in Power Discrete Devices”, IEEE International Symposium on Power Semiconductor Devices and ICs, Abstract P-2, pp. 5–10, 1997. B.J. Baliga, “Trends in Power Discrete Devices”, IEEE International Symposium on Power Semiconductor Devices and ICs, Abstract P-2, pp. 5–10, 1997.
4.
Zurück zum Zitat B.J. Baliga, “Epitaxial Silicon Technology”, Academic Press, New York, 1986. B.J. Baliga, “Epitaxial Silicon Technology”, Academic Press, New York, 1986.
5.
Zurück zum Zitat B.J. Baliga, “Fundamentals of Power Semiconductor Devices”, Springer-Science, New York, 2008.CrossRef B.J. Baliga, “Fundamentals of Power Semiconductor Devices”, Springer-Science, New York, 2008.CrossRef
6.
Zurück zum Zitat S. Mahalingam and B.J. Baliga, “The Graded Doped Trench MOS Barrier Schottky Rectifier: a Low Forward Drop High Voltage Rectifier”, Solid State Electronics, Vol. 43, pp. 1–9, 1999.CrossRef S. Mahalingam and B.J. Baliga, “The Graded Doped Trench MOS Barrier Schottky Rectifier: a Low Forward Drop High Voltage Rectifier”, Solid State Electronics, Vol. 43, pp. 1–9, 1999.CrossRef
7.
Zurück zum Zitat B.J. Baliga, “Silicon RF Power MOSFETs”, World Scientific Publishing Company, Singapore, 2005.CrossRef B.J. Baliga, “Silicon RF Power MOSFETs”, World Scientific Publishing Company, Singapore, 2005.CrossRef
Metadaten
Titel
GD-MOSFET Structure
verfasst von
B. Jayant Baliga
Copyright-Jahr
2010
Verlag
Springer US
DOI
https://doi.org/10.1007/978-1-4419-5917-1_6

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