Hydrodynamic action in slicing PV polysilicon with a novel fixed and free abrasive combined wire sawing

This paper presents a novel fixed and free abrasive combined wire sawing which uses the diamond wire with surface abrasive-groups interval distribution and combines with free SiC abrasives slurry to obtain sliced surface that can be textured by acid etching. During the sawing process, the ability that the free abrasives lapping the sawn surface has a positive correlation with the elasto-hydrodynamic (EHD) pressure, and the appropriate size of the free abrasives is related to the minimum film thickness of the cutting coolant. In this paper, the EHD action during the FFACWS is analyzed, and the film thickness equation and Reynolds equation of the sawing area are deduced. The influences of feed speed, wire speed, wire tensioning force, cutting coolant viscosity, core wire diameter, and surface structure parameters on EHD pressure and film thickness are analyzed, which provides theoretical reference for selection of the free abrasives diameter and analysis of their lapping effect on the slice surface. The research results show that the EHD pressure changes periodically in the direction of the wire axis in the entire sawing area. The change period is the same as a structural change period of the abrasive area (AA) and the bare wire area (BWA) on the wire surface. In one period, there are two EHD pressure peaks. The size range of free abrasives should be greater than the protruding height of the fixed abrasives on the diamond wire and less than the minimum film thickness in BWA, so that the free abrasives can be constrained in BWA to lap the slice surface.