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Erschienen in:
Introduction: Reliability of MEMS Kapitel lesen Erstes Kapitel lesen

2011 | OriginalPaper | Buchkapitel

4. In-Use Failures

verfasst von : Allyson L. Hartzell, Mark G. da Silva, Herbert R. Shea

Erschienen in: MEMS Reliability

Verlag: Springer US

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Abstract

This chapter addresses in-use failures of MEMS, with an emphasis on the physics of failure. Chapter 3 dealt with eliminating failures from a design and manufacturing perspective. In this chapter we focus on how a well-designed, fabricated and packaged device can fail in use. There is a tight link between the design, manufacturing and in-use failures. Understanding the physics of failure (e.g., creep, fatigue) and the properties of materials used and the link to the process flow (e.g., yield strength of poly-silicon following HF release) lead to improved design rules to ensure the device will operate reliably in the expected operating environment. A concurrent design of the package is often required, but is not addressed in this chapter.

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Vorheriges Kapitel Failure Modes and Mechanisms: Failure Modes and Mechanisms in MEMS
Nächstes Kapitel Root Cause and Failure Analysis
Fußnoten
1
This procedure was developed by Subramanian Sundaram at the EPFL.
 
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Metadaten
Titel
In-Use Failures
verfasst von
Allyson L. Hartzell
Mark G. da Silva
Herbert R. Shea
Copyright-Jahr
2011
Verlag
Springer US
Buch
MEMS Reliability

Print ISBN: 978-1-4419-6017-7

Electronic ISBN: 978-1-4419-6018-4

Copyright-Jahr: 2011

DOI
https://doi.org/10.1007/978-1-4419-6018-4_4

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