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Journal of Materials Engineering and Performance

Erschienen in:

10.02.2017

Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint

verfasst von: G. F. Ban, F. L. Sun, J. J. Fan, Y. Liu, S. N. Cong

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 3/2017

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Abstract

The influence of Cu nanoparticles addition on microstructure and mechanical properties of Sn0.7Ag0.5Cu-BiNi/Cu solder joint after reflow and isothermal aging has been investigated in this study. Experimental results indicate that the addition of Cu nanoparticles suppresses the growth of intermetallic compound (IMC) layer at the interface after reflow and aging. Moreover, the bulk solder appears with refined microstructure after adding Cu nanoparticles. In addition, solder joints containing Cu nanoparticles display higher microhardness due to the dispersive distribution of Cu nanoparticles as well as the refined IMC particles. The addition of 0.1% Cu nanoparticles can improve the microhardness by 16% compared with the noncomposite. However, the existing porosity in the solder exerts a negative effect on microhardness and shear strength. The mechanism of porosity formation has been discussed in detail. Porosity increases markedly with increasing Cu nanoparticles proportion.

Vorheriger Artikel Microstructure, Martensite Transition and Mechanical Properties Investigations of Polycrystalline Co-Ni-Al Alloys with Er Doping

Nächster Artikel Microhardness and Stress Analysis of Laser-Cladded AISI 420 Martensitic Stainless Steel

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Titel: Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint
verfasst von: G. F. Ban
F. L. Sun
J. J. Fan
Y. Liu
S. N. Cong
Publikationsdatum: 10.02.2017
Verlag: Springer US
Erschienen in: Journal of Materials Engineering and Performance / Ausgabe 3/2017
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-017-2528-7

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